1PS76SB70 (NXP)
General-purpose Schottky diodes

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BAS70 series;
1PS7xSB70 series
General-purpose Schottky diodes
Rev. 09 — 13 January 2010
Product data sheet
1. Product profile
1.1 General description
General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic
packages.
Table 1. Product overview
Type number
Package
NXP
1PS76SB70
SOD323
1PS79SB70
SOD523
BAS70
SOT23
BAS70H
SOD123F
BAS70L
SOD882
BAS70W
SOT323
BAS70-04
SOT23
BAS70-04W
SOT323
BAS70-05
SOT23
BAS70-05W
SOT323
BAS70-06
SOT23
BAS70-06W
SOT323
BAS70-07
SOT143B
BAS70-07S
SOT363
BAS70-07V
SOT666
BAS70VV
SOT666
BAS70XY
SOT363
JEITA
SC-76
SC-79
-
-
-
SC-70
-
SC-70
-
SC-70
-
SC-70
-
SC-88
-
-
SC-88
Configuration
single diode
single diode
single diode
single diode
single diode
single diode
dual series
dual series
dual common cathode
dual common cathode
dual common anode
dual common anode
dual isolated
dual isolated
dual isolated
triple isolated
quadruple; 2 series
1.2 Features
„ High switching speed
„ High breakdown voltage
„ Low leakage current
„ Low capacitance
1.3 Applications
„ Ultra high-speed switching
„ Voltage clamping


1PS76SB70 (NXP)
General-purpose Schottky diodes

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NXP Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
1.4 Quick reference data
Table 2. Quick reference data
Symbol Parameter
Per diode
IF forward current
VF forward voltage
VR reverse voltage
[1] Pulse test: tp 300 μs; δ ≤ 0.02.
2. Pinning information
Table 3. Pinning
Pin Description
BAS70H; 1PS76SB70; 1PS79SB70
1 cathode
2 anode
BAS70L
1
2
cathode
anode
BAS70; BAS70W
1 anode
2 not connected
3 cathode
BAS70-04; BAS70-04W
1 anode (diode 1)
2 cathode (diode 2)
3 cathode (diode 1),
anode (diode 2)
Conditions
Min Typ Max Unit
- - 70 mA
IF = 1 mA [1] - - 410 mV
- - 70 V
Simplified outline Symbol
[1]
12
001aab540
12
sym001
[1]
12
Transparent
top view
12
sym001
3
1
12
006aaa144
3
2
n.c.
006aaa436
3
12
006aaa144
1
3
2
006aaa437
BAS70_1PS7XSB70_SER_9
Product data sheet
Rev. 09 — 13 January 2010
© NXP B.V. 2010. All rights reserved.
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1PS76SB70 (NXP)
General-purpose Schottky diodes

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BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
Table 3. Pinning …continued
Pin Description
BAS70-05; BAS70-05W
1 anode (diode 1)
2 anode (diode 2)
3 cathode (diode 1),
cathode (diode 2)
BAS70-06; BAS70-06W
1 cathode (diode 1)
2 cathode (diode 2)
3 anode (diode 1),
anode (diode 2)
BAS70-07
1
2
3
4
cathode (diode 1)
cathode (diode 2)
anode (diode 2)
anode (diode 1)
BAS70-07S; BAS70-07V
1 anode (diode 1)
2 not connected
3 cathode (diode 2)
4 anode (diode 2)
5 not connected
6 cathode (diode 1)
BAS70VV
1
2
3
4
5
6
anode (diode 1)
anode (diode 2)
anode (diode 3)
cathode (diode 3)
cathode (diode 2)
cathode (diode 1)
Simplified outline Symbol
3
1
12
006aaa144
3
2
006aaa438
3
12
006aaa144
1
3
2
006aaa439
43
43
12
12
006aaa434
654
654
123
001aab555
1 23
006aaa440
654
123
654
123
sym046
BAS70_1PS7XSB70_SER_9
Product data sheet
Rev. 09 — 13 January 2010
© NXP B.V. 2010. All rights reserved.
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1PS76SB70 (NXP)
General-purpose Schottky diodes

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BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
Table 3. Pinning …continued
Pin Description
BAS70XY
1 anode (diode 1)
2 cathode (diode 2)
3 anode (diode 3),
cathode (diode 4)
4 anode (diode 4)
5 cathode (diode 3)
6 cathode (diode 1),
anode (diode 2)
[1] The marking bar indicates the cathode.
3. Ordering information
Simplified outline Symbol
654
654
123
123
006aaa256
Table 4. Ordering information
Type number Package
Name
Description
1PS76SB70
SC-76
plastic surface-mounted package; 2 leads
1PS79SB70
SC-79
plastic surface-mounted package; 2 leads
BAS70 - plastic surface-mounted package; 3 leads
BAS70H
-
plastic surface-mounted package; 2 leads
BAS70L
-
leadless ultra small plastic package; 2 terminals;
body 1.0 × 0.6 × 0.5 mm
BAS70W
SC-70
plastic surface-mounted package; 3 leads
BAS70-04
-
plastic surface-mounted package; 3 leads
BAS70-04W
SC-70
plastic surface-mounted package; 3 leads
BAS70-05
-
plastic surface-mounted package; 3 leads
BAS70-05W
SC-70
plastic surface-mounted package; 3 leads
BAS70-06
-
plastic surface-mounted package; 3 leads
BAS70-06W
SC-70
plastic surface-mounted package; 3 leads
BAS70-07
-
plastic surface-mounted package; 4 leads
BAS70-07S
SC-88
plastic surface-mounted package; 6 leads
BAS70-07V
-
plastic surface-mounted package; 6 leads
BAS70VV
-
plastic surface-mounted package; 6 leads
BAS70XY
SC-88
plastic surface-mounted package; 6 leads
Version
SOD323
SOD523
SOT23
SOD123F
SOD882
SOT323
SOT23
SOT323
SOT23
SOT323
SOT23
SOT323
SOT143B
SOT363
SOT666
SOT666
SOT363
BAS70_1PS7XSB70_SER_9
Product data sheet
Rev. 09 — 13 January 2010
© NXP B.V. 2010. All rights reserved.
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1PS76SB70 (NXP)
General-purpose Schottky diodes

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NXP Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
4. Marking
Table 5. Marking codes
Type number
Marking code[1]
1PS76SB70
S2
1PS79SB70
G
BAS70
73*
BAS70H
AH
BAS70L
S8
BAS70W
73*
BAS70-04
74*
BAS70-04W
74*
BAS70-05
75*
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
Type number
BAS70-05W
BAS70-06
BAS70-06W
BAS70-07
BAS70-07S
BAS70-07V
BAS70VV
BAS70XY
-
Marking code[1]
75*
76*
76*
77*
77*
77
N1
70*
-
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Per diode
VR reverse voltage
-
IF forward current
-
IFRM
repetitive peak forward
tp 1 s; δ ≤ 0.5
current
-
IFSM non-repetitive peak forward tp 10 ms
current
[1] -
Tj
Tamb
Tstg
junction temperature
ambient temperature
storage temperature
-
65
65
[1] Tj = 25 °C prior to surge.
Max Unit
70 V
70 mA
70 mA
100 mA
150
+150
+150
°C
°C
°C
BAS70_1PS7XSB70_SER_9
Product data sheet
Rev. 09 — 13 January 2010
© NXP B.V. 2010. All rights reserved.
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General-purpose Schottky diodes

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BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
6. Thermal characteristics
Table 7. Thermal characteristics
Symbol Parameter
Conditions
Per device
Rth(j-a)
thermal resistance from in free air
junction to ambient
SOT23
SOT143B
SOT363 (BAS70-07S)
SOT666 (BAS70VV)
SOT666 (BAS70-07V)
SOD123F
SOD323
SOD523
SOD882
SOT323
Rth(j-sp)
thermal resistance from
junction to solder point
SOT363 (BAS70XY)
Min Typ Max Unit
[1]
- - 500 K/W
- - 500 K/W
- - 416 K/W
[2] - - 700 K/W
[2] - - 416 K/W
[2] - - 330 K/W
- - 450 K/W
[2] - - 450 K/W
[2] - - 500 K/W
- - 625 K/W
[3] - - 260 K/W
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Soldering point at pins 2, 3, 5 and 6.
7. Characteristics
Table 8. Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Per diode
VF forward voltage
IF = 1 mA
IF = 10 mA
IF = 15 mA
IR
reverse current
VR = 50 V
VR = 70 V
Cd diode capacitance VR = 0 V; f = 1 MHz
[1] Pulse test: tp 300 μs; δ ≤ 0.02.
Min Typ Max Unit
[1]
- - 410 mV
- - 750 mV
- - 1V
- - 100 nA
- - 10 μA
- - 2 pF
BAS70_1PS7XSB70_SER_9
Product data sheet
Rev. 09 — 13 January 2010
© NXP B.V. 2010. All rights reserved.
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1PS76SB70 (NXP)
General-purpose Schottky diodes

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NXP Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
102
IF
(mA)
10
mra803
1
101
(1) (2) (3) (4)
102
0
0.2 0.4 0.6 0.8
1
VF (V)
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
(4) Tamb = 40 °C
Fig 1. Forward current as a function of forward
voltage; typical values
103 mra802
rdif
(Ω)
102
10
102
IR
(μA)
10
(1)
mra805
1 (2)
101
102
(3)
103
0
20
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
40
60 80
VR (V)
Fig 2. Reverse current as a function of reverse
voltage; typical values
2
Cd
(pF)
1.5
mra804
1
0.5
1
101
1
10 102
IF (mA)
0
0 20 40 60 80
VR (V)
Fig 3.
f = 10 kHz
Differential forward resistance as a function of
forward current; typical values
Fig 4.
Tamb = 25 °C; f = 1 MHz
Diode capacitance as a function of reverse
voltage; typical values
BAS70_1PS7XSB70_SER_9
Product data sheet
Rev. 09 — 13 January 2010
© NXP B.V. 2010. All rights reserved.
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1PS76SB70 (NXP)
General-purpose Schottky diodes

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NXP Semiconductors
8. Package outline
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
1.35
1.15
1
1.1
0.8
0.45
0.15
2.7 1.8
2.3 1.6
0.85
0.75
1
1.65 1.25
1.55 1.15
0.65
0.58
Dimensions in mm
2
0.40
0.25
0.25
0.10
03-12-17
Dimensions in mm
2
0.34
0.26
0.17
0.11
02-12-13
Fig 5. Package outline SOD323 (SC-76)
Fig 6. Package outline SOD523 (SC-79)
2.5 1.4
2.1 1.2
3.0
2.8
3
1.1
0.9
0.45
0.15
3.6 2.7
3.4 2.5
1.7
1.5
1
1.2
1.0
0.55
0.35
1
Dimensions in mm
1.9
2
0.48
0.38
0.15
0.09
04-11-04
Dimensions in mm
2
0.70
0.55
Fig 7. Package outline SOT23 (TO-236AB)
Fig 8. Package outline SOD123F
0.25
0.10
04-11-29
0.30
0.22
0.62
0.55
2
0.30
0.22 1
0.55
0.47
Dimensions in mm
0.50
0.46
0.65
1.02
0.95
cathode marking on top side
03-04-17
2.2 1.35
2.0 1.15
2.2
1.8
3
1.1
0.8
0.45
0.15
1
Dimensions in mm
1.3
2
0.4
0.3
0.25
0.10
04-11-04
Fig 9. Package outline SOD882
Fig 10. Package outline SOT323 (SC-70)
BAS70_1PS7XSB70_SER_9
Product data sheet
Rev. 09 — 13 January 2010
© NXP B.V. 2010. All rights reserved.
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1PS76SB70 (NXP)
General-purpose Schottky diodes

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BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
3.0
2.8
1.9
43
2.5 1.4
2.1 1.2
0.45
0.15
1
0.88
0.78
Dimensions in mm
1.7
2
0.48
0.38
Fig 11. Package outline SOT143B
2.2 1.1
1.1 1.8 0.8
0.9
6 5 4 0.45
0.15
2.2 1.35
2.0 1.15
pin 1
index
0.15
0.09
04-11-16
12
0.65
1.3
Dimensions in mm
3
0.3
0.2
0.25
0.10
06-03-16
Fig 12. Package outline SOT363 (SC-88)
1.7
1.5
65
1.7 1.3
1.5 1.1
pin 1 index
0.6
0.5
4
0.3
0.1
12
0.5
1
Dimensions in mm
Fig 13. Package outline SOT666
3
0.27
0.17
0.18
0.08
04-11-08
BAS70_1PS7XSB70_SER_9
Product data sheet
Rev. 09 — 13 January 2010
© NXP B.V. 2010. All rights reserved.
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General-purpose Schottky diodes

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NXP Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
9. Packing information
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description
Packing quantity
3000 4000 8000 10000
1PS76SB70 SOD323 4 mm pitch, 8 mm tape and reel
-115 - - -135
1PS79SB70 SOD523 2 mm pitch, 8 mm tape and reel
- - -315 -
4 mm pitch, 8 mm tape and reel
-115 - - -135
BAS70
SOT23 4 mm pitch, 8 mm tape and reel
-215 - - -235
BAS70H
SOD123F 4 mm pitch, 8 mm tape and reel
-115 - - -135
BAS70L
SOD882 2 mm pitch, 8 mm tape and reel
- - - -315
BAS70W
SOT323 4 mm pitch, 8 mm tape and reel
-115 - - -135
BAS70-04 SOT23 4 mm pitch, 8 mm tape and reel
-215 - - -235
BAS70-04W SOT323 4 mm pitch, 8 mm tape and reel
-115 - - -135
BAS70-05 SOT23 4 mm pitch, 8 mm tape and reel
-215 - - -235
BAS70-05W SOT323 4 mm pitch, 8 mm tape and reel
-115 - - -135
BAS70-06 SOT23 4 mm pitch, 8 mm tape and reel
-215 - - -235
BAS70-06W SOT323 4 mm pitch, 8 mm tape and reel
-115 - - -135
BAS70-07 SOT143B 4 mm pitch, 8 mm tape and reel
-215 - - -235
BAS70-07S SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135
4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165
BAS70-07V SOT666 2 mm pitch, 8 mm tape and reel
- - -315 -
4 mm pitch, 8 mm tape and reel
- -115 - -
BAS70VV
SOT666 2 mm pitch, 8 mm tape and reel
- - -315 -
4 mm pitch, 8 mm tape and reel
- -115 - -
BAS70XY
SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 -
-
-135
4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165
[1] For further information and the availability of packing methods, see Section 13.
[2] T1: normal taping
[3] T2: reverse taping
BAS70_1PS7XSB70_SER_9
Product data sheet
Rev. 09 — 13 January 2010
© NXP B.V. 2010. All rights reserved.
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General-purpose Schottky diodes

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10. Soldering
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
1.65 0.95
3.05
2.80
2.10
1.60
0.50 0.60
0.50
(2×)
msa433
Dimensions in mm
Fig 14. Reflow soldering footprint SOD323 (SC-76)
5.00
4.40
1.40
2.75 1.20
solder lands
solder resist
occupied area
solder paste
solder lands
solder resist
occupied area
msa415
preferred transport direction during soldering
Dimensions in mm
Fig 15. Wave soldering footprint SOD323 (SC-76)
2.15
solder lands
solder paste
solder resist
occupied area
1.20
0.30
0.40
1.80
1.90
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 16. Reflow soldering footprint SOD523 (SC-79)
0.50 0.60
mgs343
BAS70_1PS7XSB70_SER_9
Product data sheet
Rev. 09 — 13 January 2010
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General-purpose Schottky diodes

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BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
2.90
2.50
0.85 2
1
3.00 1.30
0.85 3
2.70
0.60
(3x)
1.00
3.30
0.50 (3x)
0.60 (3x)
MSA439
Dimensions in mm
Fig 17. Reflow soldering footprint SOT23 (TO-236AB)
3.40
1.20 (2x)
4.60 4.00 1.20
21
3
solder lands
solder resist
occupied area
solder paste
solder lands
solder resist
occupied area
preferred transport direction during soldering
2.80
4.50
MSA427
Dimensions in mm
Fig 18. Wave soldering footprint SOT23 (TO-236AB)
BAS70_1PS7XSB70_SER_9
Product data sheet
Rev. 09 — 13 January 2010
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General-purpose Schottky diodes

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BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
4.4
4
2.9
1.6
2.1 1.6
1.1 1.2
1.1
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 19. Reflow soldering footprint SOD123F
solder lands
solder resist
solder paste
occupied area
R = 0.05 (8×)
1.30
0.30
R = 0.05 (8×)
0.90
0.60 0.70 0.80
(2×) (2×) (2×)
solder lands
solder paste
solder resist
occupied area
0.30
(2×)
0.40
(2×)
0.50
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 20. Reflow soldering footprint SOD882
mbl872
BAS70_1PS7XSB70_SER_9
Product data sheet
Rev. 09 — 13 January 2010
© NXP B.V. 2010. All rights reserved.
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General-purpose Schottky diodes

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NXP Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
2.65
0.75 1.325
1.30
2.35
0.85
0.60
(3×)
2
3
1
0.50
(3×) 1.90
0.55
(3×)
2.40
msa429
Dimensions in mm
Fig 21. Reflow soldering footprint SOT323 (SC-70)
solder lands
solder paste
solder resist
occupied area
Dimensions in mm
4.60
4.00
1.15
2
3.65 2.10
3
1
2.70
0.90
(2×)
preferred transport direction during soldering
solder lands
solder resist
occupied area
Dimensions in mm
msa419
Dimensions in mm
Fig 22. Wave soldering footprint SOT323 (SC-70)
BAS70_1PS7XSB70_SER_9
Product data sheet
Rev. 09 — 13 January 2010
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General-purpose Schottky diodes

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NXP Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
0.60
(4x)
2.70
3.25
0.60 (3x)
0.50 (3x)
43
1.30 3.00
12
solder lands
solder resist
occupied area
solder paste
0.90
1.00
2.50
Dimensions in mm
Fig 23. Reflow soldering footprint SOT143B
4.45
1.20 (3×)
msa441
43
1.15 4.00 4.60
12
1.00
3.40
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport direction during soldering
msa422
Dimensions in mm
Fig 24. Wave soldering footprint SOT143B
BAS70_1PS7XSB70_SER_9
Product data sheet
Rev. 09 — 13 January 2010
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General-purpose Schottky diodes

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NXP Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
2.65
0.60
(2×)
2.35
solder paste
solder lands
solder resist
occupied area
0.50
(4×)
0.50
(4×)
1.20
2.40
Dimensions in mm
Fig 25. Reflow soldering footprint SOT363 (SC-88)
0.40
(2×)
0.90
2.10
MSA432
1.5
4.5 0.3 2.5
1.5
1.3 1.3
2.45
5.3
Fig 26. Wave soldering footprint SOT363 (SC-88)
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport
direction during soldering
sot363_fw
BAS70_1PS7XSB70_SER_9
Product data sheet
Rev. 09 — 13 January 2010
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General-purpose Schottky diodes

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NXP Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
0.538
2 1.7 1.075
0.55
(2×)
2.75
2.45
2.1
1.6
0.45
(4×)
0.5
(4×)
1.7
0.4
(6×) 0.25 0.3
(2×) (2×)
solder lands
placement area
solder paste
0.6
(2×)
0.65
(2×)
0.325 0.375
(4×) (4×)
occupied area
Dimensions in mm
sot666_fr
Reflow soldering is the only recommended soldering method.
Fig 27. Reflow soldering footprint SOT666
BAS70_1PS7XSB70_SER_9
Product data sheet
Rev. 09 — 13 January 2010
© NXP B.V. 2010. All rights reserved.
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General-purpose Schottky diodes

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General-purpose Schottky diodes
11. Revision history
Table 10. Revision history
Document ID
Release date Data sheet status Change notice Supersedes
BAS70_1PS7XSB70_SER_9
Modifications:
20100113
Product data sheet -
BAS70_1PS7XSB70_SER_8
This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
BAS70_1PS7XSB70_SER_8 20060504
Product data sheet -
BAS70_1PS7XSB70_SER_7
BAS70_1PS7XSB70_SER_7 20050718
Product data sheet -
1PS76SB70_2
1PS79SB70_1 BAS70H_1
BAS70L_1 BAS70-07V_1
BAS70VV_1 BAS70W_3
BAS70-07S_4
BAS70_SERIES_6
1PS76SB70_2
20040126
Product specification -
1PS76SB70_1
1PS79SB70_1
19980716
Product specification -
-
BAS70H_1
20050425
Product data sheet -
-
BAS70L_1
20030520
Product specification -
-
BAS70-07V_1
20020117
Product specification -
-
BAS70VV_1
20040910
Product data sheet -
-
BAS70W_3
19990326
Product specification -
BAS70W_2
BAS70-07S_4
20030411
Product specification -
BAS70_07S_3
BAS70_SERIES_6
20011011
Product specification -
BAS70_5
BAS70_1PS7XSB70_SER_9
Product data sheet
Rev. 09 — 13 January 2010
© NXP B.V. 2010. All rights reserved.
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General-purpose Schottky diodes

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BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
12. Legal information
12.1 Data sheet status
Document status[1][2]
Objective [short] data sheet
Preliminary [short] data sheet
Product [short] data sheet
Product status[3]
Development
Qualification
Production
Definition
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BAS70_1PS7XSB70_SER_9
Product data sheet
Rev. 09 — 13 January 2010
© NXP B.V. 2010. All rights reserved.
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BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
14. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 4
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 6
7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
9 Packing information . . . . . . . . . . . . . . . . . . . . 10
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18
12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19
12.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
12.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
13 Contact information. . . . . . . . . . . . . . . . . . . . . 19
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 13 January 2010
Document identifier: BAS70_1PS7XSB70_SER_9




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