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Datasheet
HUAWEI EM770W HSPA PC EMBEDDED
MODULE
V100R001
Issue
Date
03
2009-08-31
HUAWEI TECHNOLOGIES CO., LTD.


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Huawei Technologies Co., Ltd. provides customers with comprehensive technical support and service.
Please feel free to contact our local office or company headquarters.
Huawei Technologies Co., Ltd.
Address:
Huawei Industrial Base
Bantian, Longgang
Shenzhen 518129
People's Republic of China
Website: http://www.huawei.com
Email: support@huawei.com
Copyright © Huawei Technologies Co., Ltd. 2008. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior
written consent of Huawei Technologies Co., Ltd.
Trademarks and Permissions
and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.
Notice
The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute the warranty of any kind, express or implied.


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HUAWEI EM770W HSPA PC Embedded Module V100R001
Datasheet
About This Document
Summary
This document provides information about the major functions, supported services,
system architecture, and technical references of HUAWEI EM770W HSPA PC
Embedded Module.
The following table lists the contents of this document.
Chapter
Details
1 Overview
Describes the basic functions, key features, and
hardware and software overview of the product.
2 Mechanical
Specifications
Describes the mechanical specifications of the
product.
3 Electrical Specifications Describes the electrical specifications of the product.
4 RF Specifications
Describes the RF specifications of the product.
5 Software and Tools
Describes the software and tools of the product.
6 Test and Certification
Describes the information about test and certification
of the product and notebook.
7 Technical Reference Describes the technical references of the product.
Acronyms and
Abbreviation s
Lists the acronyms and abbreviations mentioned in this
document.
Safety Information
Lists the safety information of using the product.
Reference Schematic
Lists the Reference Schematic of using the product.
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HUAWEI EM770W HSPA PC Embedded Module V100R001
Datasheet
History
Issue Details
01 Creation
02 Modified
03 Modified
Date
2008-09-15
2009-06-20
2009-08-31
Author
Tan Xiao'an
Fred Luo
Fred Luo
Approved By
Xie Conglong
Xie Bingfeng
Xie Bingfeng
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HUAWEI EM770W HSPA PC Embedded Module V100R001
Datasheet
Contents
1 Overview ......................................................................................................................... 8
1.1 Introduction ................................................................................................................................. 8
1.2 Key Features............................................................................................................................... 9
1.3 Hardware Overview................................................................................................................... 10
1.3.1 Hardware Logic Block Diagram ......................................................................................... 10
1.3.2 External Hardware Interfaces .............................................................................................11
1.4 Software Overview .................................................................................................................... 13
2 Mechanical Specifications........................................................................................... 15
2.1 Dimensions and interfaces......................................................................................................... 15
2.1.1 Dimensions and interfaces of the EM770W ....................................................................... 15
2.1.2 Dimensions of the Mini PCI Express Connector................................................................. 16
2.1.3 Dimensions of the Antenna Connector............................................................................... 17
2.2 Reliability................................................................................................................................... 19
2.3 Temperature .............................................................................................................................. 19
3 Electrical Specifications .............................................................................................. 20
3.1 Mini PCI Express Pin Definition ................................................................................................. 20
3.2 Pin Descriptions ........................................................................................................................ 23
3.2.1 Digital Signal DC Characteristics....................................................................................... 23
3.2.2 Power Sources and Grounds ............................................................................................ 24
3.2.3 USB Signals...................................................................................................................... 25
3.2.4 USIM Signals.................................................................................................................... 25
3.2.5 PCM Interface Signals ...................................................................................................... 29
3.2.6 W_DISABLE# Signal......................................................................................................... 33
3.2.7 LED_WWAN# Signal......................................................................................................... 33
3.2.8 PERST# Signal................................................................................................................. 35
3.2.9 NC Pins ............................................................................................................................ 36
3.3 Power Supply and Consumption................................................................................................ 36
3.3.1 Power Supply.................................................................................................................... 36
3.3.2 Power Consumption.......................................................................................................... 36
3.3.3 Module Power Saving Mode Design Guide for Windows XP .............................................. 40
4 RF Specifications ......................................................................................................... 42
4.1 Operating Frequencies .............................................................................................................. 42
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HUAWEI EM770W HSPA PC Embedded Module V100R001
Datasheet
4.2 Conducted RF Measurement..................................................................................................... 42
4.2.1 Test Environment .............................................................................................................. 42
4.2.2 Test Standards .................................................................................................................. 43
4.3 Conducted Rx Sensitivity and Tx Power..................................................................................... 43
4.3.1 Conducted Receive Sensitivity .......................................................................................... 43
4.3.2 Conducted Transmit Power ............................................................................................... 43
4.4 Antenna Design Requirements .................................................................................................. 44
4.4.1 Antenna Design Indicators ................................................................................................ 44
4.4.2 Interference ...................................................................................................................... 48
4.4.3 Radio Test Environment .................................................................................................... 48
4.4.4 Design Recommendations ................................................................................................ 49
4.5 Offline Mode.............................................................................................................................. 50
5 Software and Tools ...................................................................................................... 51
5.1 Firmware ................................................................................................................................... 51
5.1.1 Version Descriptions ......................................................................................................... 51
5.2 Drivers ...................................................................................................................................... 51
5.2.1 Windows Drivers............................................................................................................... 52
5.2.2 Linux Drivers..................................................................................................................... 53
5.3 Dashboard ................................................................................................................................ 53
5.3.1 Windows Dashboard ......................................................................................................... 53
5.3.2 Linux Dashboard............................................................................................................... 55
5.4 GPS .......................................................................................................................................... 55
5.4.1 Introduction....................................................................................................................... 55
5.4.2 Functionality...................................................................................................................... 55
5.4.3 Performance ..................................................................................................................... 56
5.4.4 GPS Applet ....................................................................................................................... 57
5.5 Tools ......................................................................................................................................... 64
5.5.1 Firmware Update Tool ....................................................................................................... 64
5.5.2 Module Label Print ToolMLT ............................................................................................ 68
5.5.3 Engineering Tools ............................................................................................................. 78
5.5.4 Debugging Board .............................................................................................................. 78
6 Test and Certification................................................................................................... 85
6.1 Reliability Test for Module.......................................................................................................... 85
6.1.1 Environmental Reliability Test............................................................................................ 85
6.1.2 Mechanical Reliability Test ................................................................................................ 87
6.1.3 Temperature-Relevant Tests.............................................................................................. 88
6.2 Temperature Rise Test............................................................................................................... 90
6.2.1 Temperature Rise Test Result............................................................................................ 90
6.3 TRP and TIS.............................................................................................................................. 99
6.3.1 Total Radiated Power ........................................................................................................ 99
6.3.2 Total Isotropic Sensitivity ................................................................................................. 100
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6.3.3 Intermediate Channel Relative Sensitivity........................................................................ 100
6.4 Product Certifications .............................................................................................................. 101
6.5 Environmental Protection Certification and Test ....................................................................... 101
6.5.1 RoHS.............................................................................................................................. 101
6.5.2 WEEE............................................................................................................................. 103
6.5.3 PVC-free......................................................................................................................... 103
6.6 National Compulsory Certification............................................................................................ 103
6.6.1 Product Certification........................................................................................................ 103
6.6.2 Importance of Product Certification.................................................................................. 104
6.6.3 Product Certification Test Items ....................................................................................... 104
6.6.4 Product Certification Classifications................................................................................. 104
6.6.5 Certification Modes ......................................................................................................... 105
6.6.6 Certification Types........................................................................................................... 105
6.6.7 Guide to Product Certification...........................................................................................114
6.6.8 Nameplate .......................................................................................................................115
6.7 GCF and PTCRB......................................................................................................................115
6.7.1 GCF Certification .............................................................................................................116
6.7.2 PTCRB Certification.........................................................................................................117
6.7.3 Overall-System Certification .............................................................................................118
7 Technical Reference................................................................................................... 122
7.1 Layer 1 Specifications (Physical) ............................................................................................. 122
7.2 Layer 2 Specifications (MAC/RLC)........................................................................................... 122
7.3 Layer 3 Specifications (RRC)................................................................................................... 122
7.4 Layer 3 NAS/Core Network (MM/CM) ...................................................................................... 122
7.5 GSM Protocol Specifications.................................................................................................... 123
7.6 GPRS Protocol Specifications.................................................................................................. 123
7.7 General Specifications............................................................................................................. 123
7.8 Performance/Test Specifications .............................................................................................. 124
7.9 SIM Specifications ................................................................................................................... 124
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HUAWEI EM770W HSPA PC Embedded Module V100R001
Datasheet
1 Overview
1.1 Introduction
HUAWEI EM770W HSPA PC Embedded Module (hereinafter referred to as the
EM770W) is a HSPA Wireless Wide Area Network (WWAN) PC module. It is a multi-
mode wireless terminal for business professionals.
The EM770W supports the following standards:
l High Speed Packet Access(HSPA)
l Universal Mobile Telecommunications System (UMTS)
l Enhanced Data Rates for Global Evolution (EDGE)
l General Packet Radio Service (GPRS)
l Global System for Mobile Communications (GSM)
The EM770W provides the following services:
l HSPA/UMTS packet data service
l EDGE/GPRS packet data service
l WCDMA/GSM short message service (SMS)
The EM770W can be connected to a PC via the Mini PCI Express interface. In the
service area of the HSPA, UMTS, EDGE, GPRS or GSM network, you can surf the
Internet, send messages and emails, and receive messages/emails cordlessly. The
EM770W is fast, reliable, and easy to operate. Thus, mobile users can experience
many new features and services with the EM770W. These features and services will
enable a large number of users to use the EM770W and the average revenue per
user (ARPU) of operators will increase substantially.
Figure 1-1 shows the profile of the EM770W.
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HUAWEI EM770W HSPA PC Embedded Module V100R001
Datasheet
Figure 1-1 Profile of the EM770W
1.2 Key Features
Table 1-1 lists the key features of the EM770W.
Table 1-1 Key features of the EM770W
Feature
HSPA/UMTS 2100 MHz
HSPA/UMTS 1900 MHz
HSPA/UMTS 1700 MHz
HSPA/UMTS 900 MHz
HSPA/UMTS 850 MHz
HSPA/UMTS 800 MHz
GSM/GPRS/EDGE 850/900/1800/1900 MHz
UMTS equalizer and receive diversity
HSDPA data service of up to 7.2 Mbit/s
HSUPA data service of up to 5.76 Mbit/s
UMTS PS domain data service of up to 384 kbps
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EM770W
Y
Y
N
Y
Y
N
Y
Y
Y
Y
Y
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HUAWEI EM770W HSPA PC Embedded Module V100R001
Datasheet
Feature
EM770W
EDGE packet data service of up to 236.8 kbps
Y
GPRS packet data service of up to 85.6 kbps
Y
CS domain data service based on UMTS and GSM
Y
SMS based on the CS/PS domain of GSM and WCDMA
Y
Unstructured Supplementary Service Data (USSD)
Y
GPS(GPS Standalone)
Y
AGPS(Assisted GPS)
O
PCM interface
O
Mini PCI Express 1.2 interface
Y
Windows 2000/Windows XP/Windows Vista/Windows 7/Linux 2.6.18 Y
or later versions
Notes:
Y: The feature is supported.
O: The feature is optional.
N: The feature is NOT supported.
1.3 Hardware Overview
The hardware of the EM770W consists of three sections: baseband section, power
management (PM) section, and radio frequency (RF) section. External interfaces
include the antenna interface and the Mini PCI Express interface.
1.3.1 Hardware Logic Block Diagram
The EM770W is completed on a single-board. Figure 1-2 shows the hardware
functional block diagram.
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HUAWEI EM770W HSPA PC Embedded Module V100R001
Datasheet
Figure 1-2 Hardware functional block diagram
The circuitry of the EM770W consists of three sections: baseband section, RF
section, and PM section.
l The baseband section includes the baseband processor and SDRAM/flash MCP.
It implements baseband signals processing, wireless protocols, and
management of various peripheral devices.
l The RF section includes the RF transceiver, PA, antenna switches, duplexer,
and antenna interfaces, and it supports receive diversity.
l The PMU section includes PM IC and DC-DC circuits, providing the power
supply and power management for the whole module.
1.3.2 External Hardware Interfaces
1. Antenna interface
The EM770W has a main antenna connector and an auxiliary antenna connector.
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HUAWEI EM770W HSPA PC Embedded Module V100R001
Datasheet
Auxiliary antenna connector (labeled with A on the PCB)
Main antenna connector (labeled with M on the PCB)
2. Mini PCI Express interface
The interface of the EM770W is a standard Mini PCI Express interface. The EM770W
consists of several major signals, as shown in the following figure.
Figure 1-3 Mini PCI Express identification
USIM interface: The USIM interface provides the interface for a USIM card.
The USIM card can be inserted into the PC.
USB interface: The USB interface supports three modes of USB 2.0 (low
speed, full speed, and high speed). Because there is not a separate USB-
controlled voltage bus, USB functions implemented on EM770W which are
expected to report as self-powered devices.
PCM interface: The PCM interface provides interface for external codecs.
Auxiliary signals: The auxiliary signals provide some other functions.
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Power sources and grounds: The PCI Express Mini Card provides two power
sources, including the one at 3.3 Vaux (3.3Vaux) and the one at 1.5 V(+1.5 V).
The EM770W uses the 3.3 voltage as the power supply.
1.4 Software Overview
Figure 1-4 Software logic block diagram
Firmware
PC Drivers PC
Dashboard
Dashboard
PC Drivers
Mini PCIE interface
Application Service
Subsystem
Firmware Drivers
Platform Service Subsystem
Firmware
Descriptions of the functional modules in the system architecture are as follows.
Firmware Drivers
The firmware drivers include drivers of the RF module, flash, and all the peripherals
such as the SIM card and USB device.
Platform Service Subsystem
The platform service subsystem initializes programs, diagnoses, downloads data,
and serves as a watchdog.
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HUAWEI EM770W HSPA PC Embedded Module V100R001
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Application Service Subsystem
The application service subsystem consists of various application services and a
WCDMA-GSM dual mode protocol stack. Application services handle the commands
and data sent from PC side according to service categories, and deliver them to the
protocol stack. The protocol stack communicates with the network side to process the
commands and data, and returns response from network to application services.
Finally, application services return responses to PC side.
The main application services are as follows:
l Call management service
l SMS service
l CS/PS data service
PC Drivers
The PC drivers are used to implement functions such as the interaction between the
dashboard and the firmware.
Dashboard
The dashboard enables the PC side to display the interfaces of initiating or
answering a call, and sending and receiving messages. It provides the interface for
CS/PS domain network accessing and periodically refreshes the interface of the
current USB modem status. The interface is provided to the end users.
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HUAWEI EM770W HSPA PC Embedded Module V100R001
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2 Mechanical Specifications
2.1 Dimensions and interfaces
2.1.1 Dimensions and interfaces of the EM770W
The dimensions of the EM770W are 51 mm (length) × 30 mm (width) × 5 mm (height),
which comply with the standard dimensions specified in the PCI Express Mini Card
Electromechanical Specification Revision 1.2. Figure 2-1 shows the dimensions of
the EM770W in details.
Figure 2-1 Dimensions of the EM770W
Figure 2-2 shows the appearance of the interfaces on the EM770W.
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Figure 2-2 Appearance of the interfaces on the EM770W
Mini PCI Express connector
It is used to connect the EM770W to the WWAN Mini PCI Express interface of the PC.
Screw holes
They are used to fix the EM770W on the main board of the PC with screws.
Antenna interfaces
They are used to connect to antennas. Auxiliary antenna and main antenna are
combined to support receive diversity. The receive diversity can strengthen the
received RF signal quality and improve RF performance, and whether to open or
close the receive diversity function can be controlled by software.
Notes:
It is strongly recommended adding auxiliary antenna when designing PC with the EM770W.
2.1.2 Dimensions of the Mini PCI Express Connector
The EM770W adopts a standard Mini PCI Express connector that has 52 pins and
complies with the PCI Express Mini Card Electromechanical Specification Revision
1.2.
Figure 2-3 shows a 52-pin Mini PCI Express connector (take the Molex 67910002 as
an example).
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Figure 2-3 Dimensions of the Mini PCI Express connector
2.1.3 Dimensions of the Antenna Connector
The EM770W provides an interface for connecting an external antenna. The external
antenna is connected to the module through the coaxial connector that is the Hirose
U.FL-R-SMT-1(10) (you can get to know Hirose U.FL-R-SMT-1(10) by visiting the
website http://www.hirose-connectors.com/products/U.FL_1.htm).
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Figure 2-4 Dimensions of the antenna connector
Figure 2-5 shows the specifications of the antenna mating connectors (take the ones
with the Hirose part number as U.FL-LP as examples).
Figure 2-5 Specifications of the antenna mating connectors
For more information about Hirose Ltd., SMD connectors, and mating connectors,
visit the website of Hirose http://www.hirose-connectors.com.
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HUAWEI EM770W HSPA PC Embedded Module V100R001
Datasheet
2.2 Reliability
Table 2-1 Requirements on the environment reliability
Test Case
Standard
High temperature
IEC60068-2-2
High temperature
IEC60068-2-1
Operational Random vibration
MIL-STD-810F-
METHOD 514.5
Shock vibration
ANSI/TIA-603-C-2004 -3.3.5
Environment
reliability
Sine sweep vibration
High temperature
Low temperature
ANSI/TIA-603-C-2004 -3.3.4
IEC60068-2-2
IEC60068-2-1
Non-
operational
Damp heat, cyclic
Thermal shock
Salt-fog
IEC60068-2-30
IEC60068-2-14
IEC60068-2-11
Drop
IEC 60068-2-32
Durability
EIA-364-9
2.3 Temperature
Table 2-2 Operating and storage temperature
Description
Minimum
Operating temperature
10
Operating temperature
(reduced RF performance)
Storage temperature
20
40
Maximum
+55
+65
+85
Unit
°C
°C
°C
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HUAWEI EM770W HSPA PC Embedded Module V100R001
Datasheet
3 Electrical Specifications
3.1 Mini PCI Express Pin Definition
The physical connections and signal levels of the EM770W comply with PCI Express
Mini CEM specifications. Device operations comply with USB 2.0 specifications.
Table 3-1 lists the Mini PCI Express connector pins out of the EM770W.
Table 3-1 Definition of mini PCI Express pins
Definition of the EM770W Mini PCI Express pins
Pin Mini PCI
No. Express
Standard
Description
HUAWEI Pin
Description
Additional
Description
Direction to
Module
1 WAKE#
NC
Not connected.
-
2 3.3Vaux
VCC_3V3
3.3 V DC supply
rails from the PC
side.
Input
3 COEX1
NC
Not connected.
-
4 GND
GND
Mini Card ground. -
5 COEX2
NC
Not connected.
-
6 1.5 V
NC
Not connected.
-
7 CLKREQ#
NC
Not connected.
-
8 UIM_PWR
UIM_PWR
Power source for
the external
UIM/SIM card.
Output
9 GND
GND
Mini Card ground. -
10 UIM_DATA
UIM_DATA
External UIM/SIM Input/Output
data signal.
11 REFCLK-
NC
Not connected.
-
12 UIM_CLK
UIM_CLK
External UIM/SIM Output
clock signal.
13 REFCLK+
NC
Not connected.
-
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HUAWEI EM770W HSPA PC Embedded Module V100R001
Datasheet
Definition of the EM770W Mini PCI Express pins
Pin Mini PCI
No. Express
Standard
Description
HUAWEI Pin
Description
Additional
Description
Direction to
Module
14 UIM_RESET UIM_RESET
External UIM/SIM Output
reset signal.
15 GND
GND
Mini Card ground. -
16 UIM_Vpp
NC
Not connected.
-
17 Reserved
NC
Not connected.
-
18 GND
GND
Mini Card ground. -
19 Reserved
NC
Not connected.
-
20 W_DISABLE# W_DISABLE_N
For ending the
wireless
communications
Input
21 GND
GND
Mini Card ground. -
22 PERST#
PERST#
For forcing a
Input
hardware reset on
the card.
23 PERn0
NC
Not connected.
-
24 3.3Vaux
NC
Not connected.
-
25 PERp0
NC
Not connected.
-
26 GND
GND
Mini Card ground. -
27 GND
GND
Mini Card ground. -
28 1.5 V
NC
Not connected.
-
29 GND
GND
Mini Card ground. -
30 SMB_CLK
NC
Not connected.
-
31 PETn0
NC
Not connected.
-
32 SMB_DATA NC
Not connected.
-
33 PETp0
NC
Not connected.
-
34 GND
GND
Mini Card ground. -
35 GND
GND
Mini Card ground. -
36 USB_D-
USB_D-
USB signal D-.
Input/Output
37 GND
GND
Mini Card ground. -
38 USB_D+
USB_D+
USB signal D+.
Input/Output
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HUAWEI EM770W HSPA PC Embedded Module V100R001
Datasheet
Definition of the EM770W Mini PCI Express pins
Pin Mini PCI
No. Express
Standard
Description
HUAWEI Pin
Description
Additional
Description
Direction to
Module
39 3.3Vaux
VCC_3V3
3.3V DC supply
rail from the PC
side.
Input
40 GND
GND
Mini Card ground. -
41 3.3Vaux
VCC_3V3
3.3V DC supply
rail from the PC
side.
Input
42 LED_WWAN# LED_WWAN
Active-low LED
signal for
indicating the state
of the card.
Output
43 GND
GND
Mini Card ground. -
44 LED_WLAN# NC
Not connected.
-
45 Reserved
PCM_CLK
PCM clock
Output
46 LED_WPAN# NC
Not connected.
-
47 Reserved
PCM_DOUT
PCM data output Output
48 1.5 V
NC
Not connected
-
49 Reserved
PCM_DIN
PCM_data input Input
50 GND
GND
Mini Card Ground -
51 Reserved
PCM_SYNC
PCM frame
synchronization
Output
52 3.3Vaux
VCC_3V3
3.3V DC supply
rail from the PC
side.
Input
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EM770W (HUAWEI)
HSPA PC EMBEDDED MODULE

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HUAWEI EM770W HSPA PC Embedded Module V100R001
Datasheet
3.2 Pin Descriptions
3.2.1 Digital Signal DC Characteristics
Table 3-2 Digital signal DC characteristics
Symbol Description
Minimum Maximum Unit
VIH
High-level input voltage, 0.7VDD_X VDD_X +
V
CMOS/Schmitt
0.3
VIL Low-level input voltage, 0.3
CMOS/Schmitt
0.3VDD_X V
VOH High-level output voltage, VDD_X- 0.5 VDD_X V
CMOS
VOL Low-level output voltage, 0
CMOS
0.4 V
IIH Input high leakage current -
1 µA
IIL Input low leakage current 1
-
µA
IIHPD Input high leakage current 10 60 µA
with pull-down
IILPU Input low leakage current 60 10 µA
with pull-up
IOZH High-level, three-state -
leakage current
1 µA
IOZL Low-level, three-state 1
leakage current
-
µA
IOZHPD High-level, three-state
10
60
µA
leakage current with pull-
down
IOZLPU
Low-level, three-state
60
10
µA
leakage current with pull-
up
CIN Input capacitance
-
7 pF
Notes
1
1
1
1
1
1
1
1
1
1
1
1
1, 2
Notes:
1. Table 3-2 lists the universal specifications of the signals. Any difference from the universal
specifications is listed in the relevant chapter or section.
2. The input capacitance value is guaranteed by design and not completely tested.
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3.2.2 Power Sources and Grounds
The PCI Express Mini Card provides two power sources: one is 3.3Vaux (3.3 Vaux)
and the other is 1.5V (+ 1.5 V). For the EM770W, +3.3Vaux is the only supply voltage
available. The input voltage is 3.3 V ± 9%, as specified by PCI Express Mini CEM
Specifications 1.2.
Table 3-3 Power and ground specifications
Name Pins
Minimum Type
Maximum
VCC 2, 39, 41, and 52
3.0 V
3.3 V
3.6 V
GND
4, 9, 15, 18, 21, 26, 27, 29, 34,
35, 37, 40, 43, and 50
0V
Notes:
To minimize the RF radiation through the power lines, it is suggested to add ceramic
capacitors of 10pF,and 100nF to the ground beside the Mini PCI Express connector on the
host side.
The PCI Express Mini CEM specification states that PERST# is deasserted minimum
1 ms after 3.3Vaux has been applied and is stable. The module will generate an on
board power on reset signal and will remain in reset condition until PERST# is de-
asserted.
After de-assertion of PERST#, the module will boot up. USB D+ becomes high when
booting is completed, simultaneously the module starts to communicate with PC via
USB. Figure 3-1 shows power up timing.
During PC suspend state, its better to keep VCC available to avoid startup delays
occurred when power down the module.
Figure 3-1 Power up timing
Table 3-4 Power up timing
Parameter Comments
Time(Nominal values) Units
TPP Power Valid to PERST# de- 1
assert
TPD+ Power Valid to USB D+ high 3.45
ms
sec.
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If PC need to detect the PID/VID of module during the BIOS phase, the detect time
should exceed the TPD+ time.
3.2.3 USB Signals
The EM770W is compliant with USB 2.0 specification. It supports full-speed(12Mbit/s)
and high-speed(480Mbit/s) when acting as a peripheral and supports low-speed, full-
speed, and high-speed when acting as a host. The USB 2.0 specifications allow
peripherals to support any one or more of these speeds. To ensure best performance,
the PC USB host controller should support high-speed mode also when using
EM770W USB high-speed mode.
Table 3-5 USB pins
Name
Pin
USB D- 36
USB D+ 38
Description
USB data signal D-
USB data signal D+
Direction to Module
Input/Output
Input/Output
Notes:
To minimize the RF radiation through the PCI-E interface, you can add a 33 pF ceramic
capacitor to ground on every pin of the PCI-E on the host side except USB D+/D-.
The USB interface is powered directly from the 3.3 V supply. The USB input/output
lines are compatible with the USB 2.0 3.3 V signal specifications.
Table 3-6 USB signal DC characteristics
VOHmin VOLmax
VIHmin
2.8V
0.3V
2V
VILmax
0.8V
The high-speed signal characteristics according to the Eye Pattern Templates of the
USB 2.0 signal specification.
3.2.4 USIM Signals
The USIM is a smart card for UMTS/GSM cellular applications. The USIM provides
the required subscription information to allow the mobile equipment to attach to a
GSM or UMTS network. The USIM also provides the subscriber's verification
procedures as well as authentication methods for network authentication during the
attach procedures.
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Table 3-7 USIM pins
Pin Name
Description
8 UIM_PWR Power source for the external
UIM/SIM.
10 UIM_DATA External UIM/SIM data signal.
12 UIM_CLK
External UIM/SIM clock signal.
14 UIM_RESET External UIM/SIM reset signal.
Direction to
Module
Output
Input/Output
Output
Output
16 UIM_Vpp
Programming power connection used Not connected
to program EEPROM of first
generation ICCs, but not used now.
Notes:
It is recommended that the SIM card is inserted only after the power of the module is
disconnected, otherwise the SIM card can be destroyed.
USIM interface schematic reference
There is no SIM card interface circuit in the EM770W module, and users need to add
the USIM interface circuit. Figure 3-2 shows the definition of interface signals and the
typical USIM interface schematic.
Figure 3-2 USIM interface schematic on PC
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Design guide
The USIM signals are connected to the Mini PCI Express card connector (the card
edge connector) and pass through an EMI filtering and ESD protection circuit on the
module board before entering the EM770W processor. There is also an EMI filtering
and ESD protection circuit between SIM card interface and Mini PCI interface on the
users board.
1. Power supply
The SIM interface is powered by an internal LDO regulator of EM770W. The default
value of this regulator is 2.85 V. The power of the regulator is programmable in the
range of 1.5 V to 3.05 V and is expected to be set to 3.0 V or 1.8 V.
2. Modem signals
After a power-on or reset, the USIM signals are activated to detect if a SIM card is
present and to initialize it if it exists. Once a card has been detected and initialized,
the interface is always on. However, the clock signal is only activated when data is
actually being transferred. The USIM signals from the module are connected to the
level translators and then to the Mini Card host connector.
l UIM_DETECT pin is optional, according to whether need this function.
l UIM_DATA neednt add pull-up resistance, it has been pulled up to UIM_PWR by
a 15 kΩ resistor on the module, as the standard ISO/IEC 7816-3 recommends.
l UIM_PWR need add additional decoupling capacitors (range 1uF-
10μF,typevalue 4.7uF ),also 10pF capacitor are placed on the signals UIM_RST,
UIM_CLK and UIM_DATA each.
These levels exceed those required in ISO/IEC 7816-3.
3. SIM signals
The following data is taken from ETSI standard Specification of the 3 Volt Subscriber
Identity Module - Mobile Equipment (SIM-ME) interface (GSM 11.12 version 4.3.1).
Table 3-8 SIM RST requirements
RST
Minimum
VIL 0
VIH 0.7Vcc
Maximum
0.2Vcc
Vcc
Table 3-9 SIM CLK requirements
CLK
Minimum
VIL 0
VIH 0.7Vcc
Maximum
0.2Vcc
Vcc
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Table 3-10 SIM IO requirements
IO Minimum
Maximum
VIL 0
0.4
VIH
0.7Vcc
Vcc
VOL 0.3 0.2 Vcc
VOH
0.7 Vcc
Vcc+0.3
Notes:
The VOLmax of 0.45 V for the outputs is specified at an output current of 3 mA whereas the
VILmax of 0.4 V for the SIM IO input is specified at an input current of 1 mA. With the smaller
current drive, the output voltage would be driven lower than the stated maximum value.
4. ESD protection
Since the SIM is a CMOS device, ESD protection devices should be placed near to
the SIM connector to provide protection before connecting to the module. In addition,
all the SIM interface signals should be bypassed with a 10 pF capacitor.
The used ESD device (PESD3V3L5UY, NXP) in reference schematic is a low
capacitance 5-fold ESD protection diode arrays in SOT363 package.
5. Clock frequency
The SIM must support clock frequencies between 1 MHz and 4 MHz. (The Mini Card
can be programmed to generate a clock of 1.625 MHz, 2.6 MHz, or 3.25 MHz).
6. Routing recommendations
The SIM interface signals consist of four signals that are UIM_PWR, UIM_RST,
UIM_CLK, and UIM_DATA ( UIM_Vpp isnt connected also not used in many
applications). Due to the relatively low clock frequencies involved, the concern is not
the degradation of the SIM signals themselves. The main concern is routing of the
SIM interface signals through areas considered to be of high risk for RF noise
coupling (crosstalk and RF contamination) which can desensitize the radio circuitry.
The general guidelines that should be followed are listed as follows:
l It is recommended that these signals should be routed over a contiguous ground
plane.
l SIM interface signals should not be routed near high transient signals (power
supply chokes and DC/DC switching FETs).
l Avoid routing of these signals near output connectors.
l Keep SIM interface signals isolated from other signals. 2x width spacing (1.5x
min) between SIM interface signals and all other signal routing is recommended.
Certification test
Using test equipment simulates a (U)SIM card to test U(SIM) protocol in GCF or
PTCRB test, Some strange issues may be encountered during SIM/USIM test,
please contact with Huawei for more details.
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3.2.5 PCM Interface Signals
The PCM interface can be used in two modes:
l Primary PCM that runs at 2.048MHz(short frame sync)
l Auxiliary PCM that runs at 128KHz(long frame sync)
They both support linear, µ-law and A-law codecs match the sync timing and run in
master mode. The default mode of EM770W is primary PCM with linear codec.
Both the PCM interface modes, primary and auxiliary, use the same pins. The PCM
pin assignment is shown in Table 3-11.
Table 3-11 PCM Pins
Pin Name
Primary PCM
functionality
Auxiliary
PCM
functionality
Description
45 PCM_C PRIM_PCM_CL AUX_PCM_C PCM clock
LK K
LK
47 PCM_D PRIM_PCM_DO AUX_PCM_D PCM data
OUT
UT
OUT
output
49 PCM_DI PRIM_PCM_DI AUX_PCM_DI PCM data input
NN
N
51 PCM_S PRIM_PCM_SY AUX_PCM_S PCM frame
YNC
NC
YNC
synchronization
Direction
to
Module
Output
Output
Input
Output
Primary PCM interface (2.048MHz)
The PCM codec port operates with a 2.048MHz clock and the PCM_SYNC runs at
8KHz with a 50% duty cycle.
Figure 3-3 PRIM_PCM_SYNC timing
Figure 3-4 PRIM_PCM_DIN codec to module timing
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Figure 3-5 PRIM_PCM_DOUT module to codec timing
Table 3-12 Primary PCM timing parameters
Parameter
t(sync)
t(synca)
t(syncd)
t(clk)
t(clkh)
t(clkl)
Description
PRIM_PCM_SYNC cycle
time(PCM_SYNC_DIR=1)
PRIM_PCM_SYNC cycle
time(PCM_SYNC_DIR=0)
PRIM_PCM_SYNC asserted
time(PCM_SYNC_DIR=1)
PRIM_PCM_SYNC asserted
time(PCM_SYNC_DIR=0)
PRIM_PCM_SYNC
de-
asserted
time(PCM_SYNC_DIR=1)
PRIM_PCM_SYNC
de-
asserted
time(PCM_SYNC_DIR=0)
PRIM_PCM_CLK
cycle
time(PCM_CLK_DIR=1)
PRIM_PCM_CLK
cycle
time(PCM_CLK_DIR=0)
PRIM_PCM_CLK
high
time(PCM_CLK_DIR=1)
PRIM_PCM_CLK
high
time(PCM_CLK_DIR=0)
PRIM_PCM_CLK
low
time(PCM_CLK_DIR=1)
Min
-
-
-
-
-
-
-
-
-
-
-
Typical
125
125
488
-
124.5
-
488
-
244
-
244
Max
-
-
-
-
-
-
-
-
-
-
-
Unit Note
µs
µs
ns 2
ns
µs 3
µs
ns 4
ns
ns 1,5
ns
ns 1,5
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