PMEG4005CT (NXP)
500 MA Low Vf Dual MEGA Schottky Barrier Rectifier

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PMEG4005CT
500 mA low VF dual MEGA Schottky barrier rectifier
Rev. 01 — 5 June 2009
Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier in
common cathode configuration with an integrated guard ring for stress protection,
encapsulated in a SOT23 (TO-236AB) small Surface-Mounted Device (SMD) plastic
package.
1.2 Features
I Average forward current: IF(AV) 0.5 A
I Reverse voltage: VR 40 V
I Low forward voltage
I AEC-Q101 qualified
I Small SMD plastic package
1.3 Applications
I Low voltage rectification
I High efficiency DC-to-DC conversion
I Switch Mode Power Supply (SMPS)
I Reverse polarity protection
I High-speed switching
I Low power consumption applications
1.4 Quick reference data
Table 1. Quick reference data
Tj = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Min Typ Max
Per diode
IF(AV)
average forward current
square wave;
δ = 0.5;
f = 20 kHz
Tamb 85 °C
[1] -
-
0.5
Tsp 130 °C
- - 0.5
VR reverse voltage
VF forward voltage
IF = 0.5 A
- - 40
- 410 470
IR reverse current
VR = 40 V
- 27 100
[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.
Unit
A
A
V
mV
µA


PMEG4005CT (NXP)
500 MA Low Vf Dual MEGA Schottky Barrier Rectifier

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PMEG4005CT
500 mA low VF dual MEGA Schottky barrier rectifier
2. Pinning information
Table 2.
Pin
1
2
3
Pinning
Description
anode (diode 1)
anode (diode 2)
common cathode
Simplified outline Graphic symbol
33
12
12
006aab034
3. Ordering information
Table 3. Ordering information
Type number
Package
Name
Description
PMEG4005CT
-
plastic surface-mounted package; 3 leads
Version
SOT23
4. Marking
Table 4. Marking codes
Type number
PMEG4005CT
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
Marking code[1]
PA*
PMEG4005CT_1
Product data sheet
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Per diode
VR
IF(AV)
reverse voltage
average forward current
Tj = 25 °C
square wave;
δ = 0.5;
f = 20 kHz
-
IFRM
repetitive peak forward
current
Tamb 85 °C
Tsp 130 °C
tp 1 ms;
δ ≤ 0.25
[1] -
-
-
IFSM
non-repetitive peak
square wave;
[2] -
forward current
tp = 8 ms
Rev. 01 — 5 June 2009
Max Unit
40 V
0.5 A
0.5 A
3.9 A
10 A
© NXP B.V. 2009. All rights reserved.
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500 MA Low Vf Dual MEGA Schottky Barrier Rectifier

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PMEG4005CT
500 mA low VF dual MEGA Schottky barrier rectifier
Table 5. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Per device; one diode loaded
Ptot
total power dissipation Tamb 25 °C
[3] -
[4] -
[1] -
Tj
Tamb
Tstg
junction temperature
ambient temperature
storage temperature
-
55
65
Max Unit
330
400
460
150
+150
+150
mW
mW
mW
°C
°C
°C
[1] Device mounted on a ceramic PCB, Al2O3, standard footprint.
[2] Tj = 25 °C prior to surge.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
6. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter
Per diode; one diode loaded
Rth(j-a)
thermal resistance from
junction to ambient
Conditions
in free air
Rth(j-sp)
thermal resistance from
junction to solder point
Min Typ Max Unit
[1]
[2] - - 375 K/W
[3] - - 310 K/W
[4] - - 270 K/W
[5] - - 60 K/W
[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[4] Device mounted on a ceramic PCB, Al2O3, standard footprint.
[5] Soldering point of cathode tab.
PMEG4005CT_1
Product data sheet
Rev. 01 — 5 June 2009
© NXP B.V. 2009. All rights reserved.
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500 MA Low Vf Dual MEGA Schottky Barrier Rectifier

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103
Zth(j-a)
(K/W)
102
10
duty cycle =
1
0.5
0.25
0.1
0.02
0.75
0.33
0.2
0.05
0.01
0
PMEG4005CT
500 mA low VF dual MEGA Schottky barrier rectifier
006aab533
1
103
102
101
1
10 102 103
tp (s)
FR4 PCB, standard footprint
Fig 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
103
Zth(j-a)
(K/W)
102
10
duty cycle =
1
0.5
0.25
0.1
0.02
0
0.75
0.33
0.2
0.05
0.01
006aab534
1
103
102
101
1
10 102 103
tp (s)
FR4 PCB, mounting pad for cathode 1 cm2
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMEG4005CT_1
Product data sheet
Rev. 01 — 5 June 2009
© NXP B.V. 2009. All rights reserved.
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500 MA Low Vf Dual MEGA Schottky Barrier Rectifier

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103
Zth(j-a)
(K/W)
102
10
duty cycle =
1
0.5
0.25
0.1
0.02
0
0.75
0.33
0.2
0.05
0.01
PMEG4005CT
500 mA low VF dual MEGA Schottky barrier rectifier
006aab535
1
103
102
101
1
10 102 103
tp (s)
Ceramic PCB, Al2O3, standard footprint
Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
7. Characteristics
Table 7. Characteristics
Tj = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Per diode
VF
forward voltage
IF = 0.1 mA
IF = 1 mA
IF = 10 mA
IF = 100 mA
IF = 500 mA
IR
reverse current
VR = 10 V
VR = 40 V
Cd
diode capacitance
VR = 1 V; f = 1 MHz
trr reverse recovery time
Min
-
-
-
-
-
-
-
-
[1] -
Typ
95
155
220
295
410
7
27
43
13
[1] When switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA.
Max
130
210
270
350
470
20
100
50
-
Unit
mV
mV
mV
mV
mV
µA
µA
pF
ns
PMEG4005CT_1
Product data sheet
Rev. 01 — 5 June 2009
© NXP B.V. 2009. All rights reserved.
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500 MA Low Vf Dual MEGA Schottky Barrier Rectifier

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PMEG4005CT
500 mA low VF dual MEGA Schottky barrier rectifier
10
IF
(A)
1
101
(1)
(2)
102
(3) (4) (5)
006aab554
103
104
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
VF (V)
(1) Tj = 150 °C
(2) Tj = 125 °C
(3) Tj = 85 °C
(4) Tj = 25 °C
(5) Tj = 40 °C
Fig 4. Forward current as a function of forward
voltage; typical values
100
Cd
(pF)
80
102
IR
(A)
103
104
105
106
107
108
109
0
(1)
(2)
(3)
(4)
10 20
(1) Tj = 125 °C
(2) Tj = 85 °C
(3) Tj = 25 °C
(4) Tj = 40 °C
006aab555
30 40
VR (V)
Fig 5. Reverse current as a function of reverse
voltage; typical values
006aab556
60
40
20
0
0 10 20 30 40
VR (V)
f = 1 MHz; Tamb = 25 °C
Fig 6. Diode capacitance as a function of reverse voltage; typical values
PMEG4005CT_1
Product data sheet
Rev. 01 — 5 June 2009
© NXP B.V. 2009. All rights reserved.
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PMEG4005CT
500 mA low VF dual MEGA Schottky barrier rectifier
0.4
PF(AV)
(W)
0.3
0.2
0.1
(2)
(1)
006aab557
(4)
(3)
0.25
PR(AV)
(W)
0.20
0.15
0.10
0.05
006aab558
(1)
(2)
(3)
(4)
0.0
0.0
0.25
0.50
0.75
IF(AV) (A)
Tj = 150 °C
(1) δ = 0.1
(2) δ = 0.2
(3) δ = 0.5
(4) δ = 1
Fig 7.
Average forward power dissipation as a
function of average forward current; typical
values
0.75
IF(AV)
(A)
0.50
(1)
(2)
006aab559
0.0
0
5 10 15 20 25
VR (V)
Tj = 125 °C
(1) δ = 1
(2) δ = 0.9
(3) δ = 0.8
(4) δ = 0.5
Fig 8. Average reverse power dissipation as a
function of reverse voltage; typical values
0.75
IF(AV)
(A)
0.50
(1)
(2)
006aab560
(3)
0.25 (4)
(3)
0.25 (4)
0.0
0
25 50 75 100 125 150 175
Tamb (°C)
FR4 PCB, standard footprint
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig 9. Average forward current as a function of
ambient temperature; typical values
0.0
0
25 50 75 100 125 150 175
Tamb (°C)
FR4 PCB, mounting pad for cathode 1 cm2
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig 10. Average forward current as a function of
ambient temperature; typical values
PMEG4005CT_1
Product data sheet
Rev. 01 — 5 June 2009
© NXP B.V. 2009. All rights reserved.
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0.75
IF(AV)
(A)
0.50
(1)
(2)
(3)
0.25 (4)
006aab561
PMEG4005CT
500 mA low VF dual MEGA Schottky barrier rectifier
0.75
IF(AV)
(A)
0.50
(1)
(2)
(3)
0.25 (4)
006aab562
0.0
0
25 50 75 100 125 150 175
Tamb (°C)
Ceramic PCB, Al2O3, standard footprint
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig 11. Average forward current as a function of
ambient temperature; typical values
8. Test information
0.0
0
25 50 75 100 125 150 175
Tsp (°C)
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig 12. Average forward current as a function of
solder point temperature; typical values
RS = 50
V = VR + IF × RS
D.U.T.
IF
SAMPLING
OSCILLOSCOPE
Ri = 50
mga881
VR
tr
10 %
tp
90 %
input signal
t
+ IF
trr
t
(1)
output signal
(1) IR = 1 mA
Input signal: reverse pulse rise time tr = 0.6 ns; reverse voltage pulse duration tp = 100 ns; duty cycle δ = 0.05
Oscilloscope: rise time tr = 0.35 ns
Fig 13. Reverse recovery time test circuit and waveforms
PMEG4005CT_1
Product data sheet
Rev. 01 — 5 June 2009
© NXP B.V. 2009. All rights reserved.
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PMEG4005CT
500 mA low VF dual MEGA Schottky barrier rectifier
P
t2
duty cycle δ =
t1
t2
t1
Fig 14. Duty cycle definition
t
006aaa812
The current ratings for the typical waveforms as shown in Figure 9, 10, 11 and 12 are
calculated according to the equations: IF(AV ) = I M × δ with IM defined as peak current,
I RMS = IF(AV ) at DC, and I RMS = I M × δ with IRMS defined as RMS current.
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
2.5 1.4
2.1 1.2
3.0
2.8
3
1.1
0.9
0.45
0.15
1
Dimensions in mm
1.9
Fig 15. Package outline SOT23 (TO-236AB)
2
0.48
0.38
0.15
0.09
04-11-04
10. Packing information
PMEG4005CT_1
Product data sheet
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description
PMEG4005CT SOT23 4 mm pitch, 8 mm tape and reel
Packing quantity
3 000
10 000
-215
-235
[1] For further information and the availability of packing methods, see Section 14.
Rev. 01 — 5 June 2009
© NXP B.V. 2009. All rights reserved.
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11. Soldering
PMEG4005CT
500 mA low VF dual MEGA Schottky barrier rectifier
3.3
2.9
1.9
3 1.7
2
0.7 0.6
(3×) (3×)
0.5
(3×)
0.6
(3×)
1
Fig 16. Reflow soldering footprint SOT23 (TO-236AB)
2.2
1.2
(2×)
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sot023_fr
1.4
(2×)
4.6 2.6
1.4
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport direction during soldering
2.8
4.5 sot023_fw
Fig 17. Wave soldering footprint SOT23 (TO-236AB)
PMEG4005CT_1
Product data sheet
Rev. 01 — 5 June 2009
© NXP B.V. 2009. All rights reserved.
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500 mA low VF dual MEGA Schottky barrier rectifier
12. Revision history
Table 9. Revision history
Document ID
Release date
PMEG4005CT_1
20090605
Data sheet status
Product data sheet
Change notice
-
Supersedes
-
PMEG4005CT_1
Product data sheet
Rev. 01 — 5 June 2009
© NXP B.V. 2009. All rights reserved.
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500 mA low VF dual MEGA Schottky barrier rectifier
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet Development
Preliminary [short] data sheet Qualification
Product [short] data sheet
Production
Definition
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PMEG4005CT_1
Product data sheet
Rev. 01 — 5 June 2009
© NXP B.V. 2009. All rights reserved.
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500 mA low VF dual MEGA Schottky barrier rectifier
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 9
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
10 Packing information. . . . . . . . . . . . . . . . . . . . . . 9
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
13.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
14 Contact information. . . . . . . . . . . . . . . . . . . . . 12
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 5 June 2009
Document identifier: PMEG4005CT_1




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