TJA1010 (NXP)
Octal Low Side Driver OLSD

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INTEGRATED CIRCUITS
DATA SHEET
TJA1010
Octal Low Side Driver (OLSD)
Preliminary specification
File under Integrated Circuits, IC18
1998 Feb 09


TJA1010 (NXP)
Octal Low Side Driver OLSD

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Philips Semiconductors
Octal Low Side Driver (OLSD)
Preliminary specification
TJA1010
FEATURES
Eight independent low side drivers
Small outline/medium power package for surface
mounting, SO28 (20 + 4 + 4)
Serial input control by writing to internal shift register
Overvoltage clamping for each driver
Each driver protected against short-circuited load
Undervoltage shutdown
All logic pins CMOS microcontroller compatible
Standby mode for minimum current consumption
Two status outputs indicating short-circuited load and
open load respectively at any driver stage
Channel selective diagnostic information available by
reading from internal shift register
Serial output allows cascading of several OLSDs
Outputs can be used in parallel
Two-stage thermal protection
Power-on reset.
GENERAL DESCRIPTION
The TJA1010 is an octal low side driver for relays in
automotive applications.
QUICK REFERENCE DATA
SYMBOL
VDD
PARAMETER
supply voltage
Vo(clamp)
Ro(on)
Io
drain-to-source clamp voltage
on resistance
output current
CONDITIONS
operating
load dump
Io = 20 mA
Io = 0.2 A
continuous at all outputs;
Tamb = 85 °C
MIN.
5.5
50
TYP.
60
MAX. UNIT
25 V
50 V
70 V
3
0.2 A
ORDERING INFORMATION
TYPE
NUMBER
TJA1010T
NAME
SO28
PACKAGE
DESCRIPTION
plastic small outline package; 28 leads; body width 7.5 mm
VERSION
SOT136-1
1998 Feb 09
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Octal Low Side Driver OLSD

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handbook, full pagewidth
STBY
25
serial input
parallel
outputs
8-BIT
SHIFT
REGISTER
parallel
inputs
VDD
24
SUPPLY
AND
0V
REFERENCE
UV
power-on
master
reset
8-BIT
LATCH
data
data
inputs outputs
clock
TEMPERATURE
PROTECTION
TJA1010
CURRENT
LIMITING
1
3
12
14
15
17
26
Vref 28
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
OUT8
latch
DQ
clock
&
serial clock
parallel
load
serial input
&&
DELAY
Tstat
OL
1
&
SC
1
2, 13
16, 27
GND1
to
GND4
&
10 4
SO SCL
6 to 9
5 11 20 to 23
SI SIE GND
Fig.1 Block diagram.
19
STATOL
18
MBH994 STATSC


TJA1010 (NXP)
Octal Low Side Driver OLSD

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Philips Semiconductors
Octal Low Side Driver (OLSD)
Preliminary specification
TJA1010
PINNING
SYMBOL
OUT1
GND1
OUT2
SCL
SI
GND
GND
GND
GND
SO
SIE
OUT3
GND2
OUT4
OUT5
GND3
OUT6
STATSC
STATOL
GND
GND
GND
GND
VDD
STBY
OUT7
GND4
OUT8
PIN DESCRIPTION
1 output 1
2 ground 1
3 output 2
4 serial clock input
5 serial input
6 ground
7 ground
8 ground
9 ground
10 serial output
11 serial input enable
12 output 3
13 ground 2
14 output 4
15 output 5
16 ground 3
17 output 6
18 status output short-circuited load
19 status output open load
20 ground
21 ground
22 ground
23 ground
24 supply voltage
25 standby input
26 output 7
27 ground 4
28 output 8
handbook, halfpage
OUT1 1
28 OUT8
GND1 2
27 GND4
OUT2 3
26 OUT7
SCL 4
25 STBY
SI 5
GND 6
24 VDD
23 GND
GND 7
GND 8
22 GND
TJA1010
21 GND
GND 9
20 GND
SO 10
19 STATOL
SIE 11
18 STATSC
OUT3 12
17 OUT6
GND2 13
16 GND3
OUT4 14
15 OUT5
MBH990
Fig.2 Pin configuration.
1998 Feb 09
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Octal Low Side Driver OLSD

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Philips Semiconductors
Octal Low Side Driver (OLSD)
Preliminary specification
TJA1010
FUNCTIONAL DESCRIPTION (see Figs 1, 3 and 4)
This octal low side driver is intended to drive relays in
automotive applications. It is optimized to withstand the
wide temperature and supply voltage range that is typical
for this application area. It consists of 8 protected outputs,
including diagnostic functions, controlled by a serial
interface. These outputs can be used in parallel without the
need for additional components.
Serial control interface
Serial control of the drivers is provided by an 8-bit shift
register with parallel outputs and an 8-bit latch which
controls the DMOS output stages. Using this configuration
the number of pins needed for control of the eight drivers
is reduced to three; Serial Input (SI), Serial CLock (SCL)
and Serial Input Enable (SIE). When pin SIE is LOW, serial
data at pin SI is shifted into the shift register at each
HIGH-to-LOW transition at the SCL pin and serial data is
shifted out at the Serial Output (SO) pin at a LOW-to-HIGH
transition on the SCL pin. The last bit read in before a
LOW-to-HIGH transition at the SIE pin is bit D8. A HIGH
level at the SI pin causes a driver to switch-on. With a
LOW-to-HIGH transition at the SIE pin, parallel output data
in the shift register is written to the 8-bit latch, which
controls the DMOS outputs. When SIE is HIGH, signals at
pins SI, SCL and SO are disabled. For pin SO this results
in a HIGH level because pin SO is an open-collector
output.
Diagnostic interface
The OLSD detects open loads and short-circuited loads at
each driver stage by comparing its output voltages (Vo) to
a reference voltage (Vref). To allow distinction between
short-circuit and open load conditions, a short-circuit is
detected for Vo > Vref in the on-state, while an open load is
detected for Vo < Vref in the off-state of a driver stage.
In both cases the corresponding status pin is set to a LOW
level and the respective bit in the shift register is inverted
on a HIGH-to-LOW transition of SIE.
By writing a following byte into the shift register, its actual
contents (the control byte eventually modified by errors)
can be read out via pin SO. Comparing this byte with the
original control byte previously written, faults can be
localized and identified (e.g. open load at driver stage
number 5).
Protection of DMOS outputs
Each driver contains a DMOS power FET. The drivers are
protected against overvoltage, short-circuit and
overtemperature conditions.
An overvoltage clamp circuit at each driver causes the
respective DMOS power FET to turn partially on, if its
drain-to-source voltage level exceeds the clamp level
[Vo(clamp)]. Consequently each driver can withstand
voltage peaks caused by turning off inductive loads, such
as relays coils without freewheel diodes. It should be noted
that if outputs are used in parallel the amount of inductive
energy which can be handled will not increase but will
remain equal to that of a single output.
Each driver is protected against a short-circuited load by
current limiting. In the event of a short-circuited load at a
driver stage, the current will be limited and the HIGH level
of its drain-to-source voltage will force the comparator
output to go HIGH. This in turn will set the STATSC pin to
a LOW level.
A two-stage temperature protection circuit is included to
protect the device against overheating caused by high
dissipation in the output transistors.
When the temperature exceeds the overtemperature
threshold level, it will switch-off those outputs with a
short-circuit condition for the duration of the
overtemperature condition. The status and diagnostic
function will not be influenced.
If the chip temperature still rises and exceeds the
emergency threshold level, the emergency shutdown will
become active and shut down all of the outputs until the
temperature drops below the overtemperature threshold.
The outputs are fully protected against short-circuit to
battery conditions for the whole supply voltage range.
To protect the outputs against device threatening
dissipation peaks, the overtemperature control is extended
with local power dissipation sensors. If one or more
outputs dissipate too much power all outputs with a
short-circuit condition will be switched off for the duration
of the local overtemperature condition.
To protect the outputs against high dissipation during load
dump, an overvoltage protection is included. This will
switch-off those outputs with a short-circuit condition if the
supply voltage exceeds the overvoltage threshold VDD(0 V)
for the duration of the overvoltage condition.
The diagnostic and status information will not change due
to the interference of the overvoltage and overtemperature
protections.
To avoid a false LOW signal at the SC pin due to switching
transients at the DMOS outputs, the SC pin is disabled for
a sufficient delay time whenever a new input control byte
has been written into the 8-bit latch with a LOW-to-HIGH
transition of SIE.
1998 Feb 09
5


TJA1010 (NXP)
Octal Low Side Driver OLSD

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Philips Semiconductors
Octal Low Side Driver (OLSD)
Preliminary specification
TJA1010
Other features
When using several OLSDs, input control and diagnostics
can be provided, as described above, without spending
further microcontroller pins by cascading, i.e. connecting
the SO pin of one OLSD to the SI pin of the following
OLSD.
A standby input (STBY) pin allows the off state current
consumption in the OLSD to be minimized. Thus the OLSD
can be connected permanently to a battery.
A power-on reset ensures a defined off state for all drivers
when the device is switched on i.e. by switching on the
power supply or by activating the device via the STBY pin.
Thus the STBY input can also be used as a reset pin.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VDD
Vn
VI(STBY)
Vo(STAT)
Vo(SO)
Io
Io(con)
Iclamp(rep)
Eclamp(rep)
Eclamp(nrep)
Tvj
Tstg
Vesd
PARAMETER
CONDITIONS
supply voltage
continuous
transient
input voltage at pins SI, SCL and SIE
input voltage at pin STBY
output voltage at pins STATOL and
STATSC
output voltage at pin SO
output current
continuous output current
repetitive inductive turn-off current per
output
repetitive inductive turn-off energy per
output
non-repetitive inductive turn-off
energy per output
Tj = 135 °C
Tj = 95 °C
Tj = 135 °C; note 1
Tj = 95 °C; notes 1 and 2
Tj = 95 °C; notes 1 and 3
virtual junction temperature
storage temperature
electrostatic handling
human body model
machine model
MIN.
0
0
0
0
0
MAX.
25
50
5.5
7
18
UNIT
V
V
V
V
V
0 18
internally limited
0.2 +0.2
0.3 +0.3
see Fig.5
V
A
A
A
5 mJ
60 mJ
40 +135 °C
55 +150 °C
3 kV
300 V
Notes
1. The amount of Eclamp per output can NOT be added if outputs are used in parallel. Thus, if two or more outputs are
used in parallel it can handle the Eclamp of one output.
2. Defined for tclamp = 1 ms.
3. Defined for tclamp = 5 ms.
1998 Feb 09
6


TJA1010 (NXP)
Octal Low Side Driver OLSD

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Philips Semiconductors
Octal Low Side Driver (OLSD)
Preliminary specification
TJA1010
THERMAL CHARACTERISTICS
SYMBOL
Rth (j-amb)
Rth (j-sp)
PARAMETER
from junction to ambient in free air
from junction to soldering point of ground pins
6 to 9 and 20 to 23
CONDITIONS
note 1
note 2
Notes
1. Printed on an FR-4 board with minimum foot print.
2. Power uniformly divided over all outputs.
VALUE
55
17
UNIT
K/W
K/W
CHARACTERISTICS
Tj = 40 to +135 °C; VDD = 11 to 13.5 V; Vbat(max) = VDD + 1.5 V. All voltages are defined with respect to ground.
Positive currents flow into the IC. All parameters are guaranteed over the temperature range by design, but only 100%
tested at Tamb = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
IDD
VDD(UV)
VDD(0V)
Vo(clamp)
ILO
Io(lim)
Ro
Vref
δIo/δt
VIH
Vi(hys)
VIL
VIL(STBY)
supply current
undervoltage shutdown threshold
overvoltage protection threshold
output clamp voltage
output leakage current
(one output)
output current limit (one output)
output resistance (one output)
open load/short-circuit reference
voltage
maximum rise and fall time of
output current
HIGH-level input voltage at pins
SI, SCL, SIE and STBY
input voltage hysteresis at pins
SI, SCL and SIE
LOW-level input voltage at pins
SI, SCL and SIE
LOW-level input voltage at pin
STBY
Io = 0 mA; VSTBY > 3 V
VSTBY < 1 V; VDD = 13 V;
Tj = 40 to +85 °C
Io = 20 mA
off-state, Vo = 13 V; standby
off-state, Vo = 13 V;
operational
off-state, Vo = 1 V;
operational
on-state
Io = 0.2 A; VDD = 13 V;
Tj = 135 °C
Io = 0.2 A; VDD = 13 V;
Tj = 25°C
Io = 0.1 A; VDD = 5.5 V;
see Fig.6
note 1
VDD = 13 V; RL = 100 ;
note 2
note 2
2
25
50
70
40
0.3
1
3
0.2
60
5 mA
10 µA
4.3 V
33 V
70 V
10 µA
210 µA
180 µA
0.55 A
3
2.5
10
1.9 V
100 mA/µs
V
1.2 V
0.8 V
1V
1998 Feb 09
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Octal Low Side Driver OLSD

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Philips Semiconductors
Octal Low Side Driver (OLSD)
Preliminary specification
TJA1010
SYMBOL
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
Ii
ILI
Ri(STBY)
Ii(STBY)
VSTAT(L)
VSO(L)
ILO(SO)
fclk
tW(SCL)
td(SIE-SCL)
tsu(SIE-SCL)
td(SCL-SO)
tsu(SI-SCL)
th(SCL-SI)
th(SCL-SIE)
tsu(STBY)
th(STBY)
td(STAT)
Tth(otc)
Tth(ets)
input current at pins SCL and SIE Vi = 3 V
input leakage current at pins SI,
SIE and SCl
input resistance at pin STBY
input current at pin STBY
status LOW voltage
off-state; Vi = 3 V;
Tj = 85 °C; VSTBY < 1 V
Vi = 1 V; Tj < 85 °C
Vi = 3 V
ISTAT(L) = 1.6 mA
serial output LOW voltage
output leakage current at pin SO
and status outputs
clock frequency
ISO = 1.6 mA
off-state; Vo = 5 V;
VSTBY < 1 V; Tj < 85 °C
SCL positive pulse width
HIGH-to-LOW transition
delay time from SIE HIGH to SCL
LOW
set-up time from SIE LOW to SCL
HIGH
delay time from SCL HIGH to SO note 3
valid
set-up time from SI to falling edge
of SCL
hold time from falling edge of SCL
to SI
hold time from SCL LOW to SIE
HIGH
STBY set-up time from STBY
HIGH to SIE LOW
STBY hold time from SIE HIGH to
STBY LOW
delay time for status pin enable
threshold overtemperature control
threshold emergency temperature
shutdown
20
−−
60 µA
5 µA
40
20
−−
−−
−−
150 k
60 µA
0.4 V
0.4 V
10 µA
− − 1 MHz
500 − − ns
100 − − ns
250 − − ns
− − 250 ns
150 − − ns
150 − − ns
250 − − ns
100 − − µs
10 − − µs
40 100 250 µs
170 − °C
190 − °C
Notes
1. Open load is indicated for Vo < Vref in the off-state, short-circuited load is indicated for Vo > Vref in the on-state.
2. Guaranteed by design.
3. Delay caused by load excluded.
1998 Feb 09
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Octal Low Side Driver OLSD

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Philips Semiconductors
Octal Low Side Driver (OLSD)
Preliminary specification
TJA1010
handbook, full pagewidth
SIE
SCL
shift
register
bit n
SI
SO
(1)
B
n+1
D1 D2 D3 D4 D5 D6 D7 D8
new new new new new new new new
previous D1 D2 D3 D4 D5 D6 D7 D8
D8 old old old old old old old old
OUT1
corresponding to D1 old
OUT2
corresponding to D8 old
(1) Inverting only when error (open load/short-circuit).
Fig.3 Serial interface timing.
corresponding to D1 new
corresponding to D8 new
MBH992
1998 Feb 09
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Octal Low Side Driver OLSD

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Philips Semiconductors
Octal Low Side Driver (OLSD)
Preliminary specification
TJA1010
andbook, full pagewidth
STBY
SIE
SCL
SI
SO
tsu(STBY)
th(STBY)
td(SIE-SCL)
tw(SCL)
td(SCL-SIE)
tsu(SI-SCL)
th(SCL-SI)
don't care
td(SCL-SO)
previous
valid
valid
Fig.4 Input and output waveform timing.
70%
16%
70%
16%
5V
0V
5V
0V
5V
0V
70%
16%
5V
0V
70%
16%
5V
0V
MBH993
0.16
haIncdlabomopk, full pagewidth
(A)
0.14
MGL379
0.12
0.10
0.08
0.06
0.04
0.02
0
0 100 200 300 400 500 600
t (µs)
The curve is based on behaviour of relays; Siemens A4001-X40.
Fig.5 Maximum current during inductive turn-off (Tamb = 85 °C).
1998 Feb 09
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Octal Low Side Driver OLSD

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Philips Semiconductors
Octal Low Side Driver (OLSD)
Preliminary specification
TJA1010
12
handbook, full pagewidth
Ron
()
10
8
6
4
2
0
56
7 8 9 10 11 12 13
Fig.6 Maximum on-resistance as a function of supply voltage.
MGL380
14 15
VDD (V)
handbook, full pagewidth
+5 V
REGULATOR
MICROCONTROLLER
STBY
SIE
SCL
SI
+5 V
R1 R2 R3
SO
STATSC
OL
D1
100 nF 100 µF
C2 C1
VDD
TJA1010
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
OUT8
load
load
load
load
load
load
load
load
GND
MBH991
Vbat
1998 Feb 09
Fig.7 Application example.
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Octal Low Side Driver OLSD

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Philips Semiconductors
Octal Low Side Driver (OLSD)
PACKAGE OUTLINE
SO28: plastic small outline package; 28 leads; body width 7.5 mm
Preliminary specification
TJA1010
SOT136-1
y
Z
28
D
c
15
EA
X
HE v M A
pin 1 index
1
e
A2
A1
14
wM
bp
Q
(A3)
A
Lp
L
detail X
θ
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT max. A1 A2 A3 bp
c
D (1) E (1)
e
HE
L
Lp
Q
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
18.1
17.7
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
inches
0.10
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.71
0.69
0.30
0.29
0.050
0.419
0.394
0.055
0.043
0.016
0.043
0.039
v
0.25
0.01
w y Z (1)
0.25 0.1
0.9
0.4
0.01
0.004
0.035
0.016
θ
8o
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT136-1
IEC
075E06
REFERENCES
JEDEC
EIAJ
MS-013AE
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
1998 Feb 09
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Octal Low Side Driver OLSD

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Philips Semiconductors
Octal Low Side Driver (OLSD)
Preliminary specification
TJA1010
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
1998 Feb 09
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Octal Low Side Driver OLSD

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Philips Semiconductors
Octal Low Side Driver (OLSD)
Preliminary specification
TJA1010
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 Feb 09
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Octal Low Side Driver OLSD

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Philips Semiconductors
Octal Low Side Driver (OLSD)
NOTES
Preliminary specification
TJA1010
1998 Feb 09
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Octal Low Side Driver OLSD

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Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,
Fax. +43 160 101 1210
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220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 0044
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1998
SCA57
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
615102/00/01/pp16
Date of release: 1998 Feb 09
Document order number: 9397 750 01763




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