MI0350B2T-1 (MULTI-INNO TECHNOLOGY)
LCD MODULE

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MULTI-INNO TECHNOLOGY CO., LTD.
www.multi-inno.com
LCD MODULE SPECIFICATION
Model : MI0350B2T-1
For Customer's Acceptance:
Customer
Approved
Comment
Revision
Engineering
Date
Our Reference
1.0
2012-01-22


MI0350B2T-1 (MULTI-INNO TECHNOLOGY)
LCD MODULE

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MODULE NO.: MI0350B2T-1
Ver 1.0
REVISION RECORD
REV NO. REV DATE
CONTENTS
1.0 2012-01-22 First release
REMARKS
/
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MODULE NO.: MI0350B2T-1
CONTENTS
GENERAL INFORMATION
EXTERNAL DIMENSIONS 
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
BACKLIGHT CHARACTERISTICS
ELECTRO-OPTICAL CHARACTERISTICS
INTERFACE DESCRIPTION
REFERENCE APPLICATION CIRCUIT
RELIABILITY TEST CONDITIONS
INSPECTION CRITERION
PRECAUTIONS FOR USING LCD MODULES
PACKING SPECIFICATION
PRIOR CONSULT MATTER
Ver 1.0
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LCD MODULE

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MODULE NO.: MI0350B2T-1
GENERAL INFORMATION
Item of general information
Contents
LCD Type
TFT/TRANSMISSIVE
Recommended Viewing Direction Full viewing angle
Module area (W × H×T)
51.06×86.95×2.60
Viewing area (W×H)
Active area (W×H)
47.56×77.80
45.36×75.60
Number of Dots
Pixel pitch (W × H)
Driver IC
480RGB×800
0.0945×0.0945
HX8369-A
Interface Type
Input voltage
Module Power consumption
MPU/MIPI interface
3.3
387
Colors
Backlight Type
Weight
With/Without TSP
16.7M
6 LEDs
TBD
Without TP
Ver 1.0
Unit
/
O’ Clock
mm3
mm2
mm2
/
mm2
/
/
V
mw
/
/
g
/
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LCD MODULE

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MODULE NO.: MI0350B2T-1
EXTERNAL DIMENSIONS
Ver 1.0
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LCD MODULE

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MODULE NO.: MI0350B2T-1
ABSOLUTE MAXIMUM RATINGS
Ver 1.0
Parameter of absolute
maximum ratings
Supply voltage for logic
Symbol
VCC
Operating temperature
Top
Storage temperature
TST
Humidity
RH
Supply voltage for I/O interfa IOVCC
ELECTRICAL CHARACTERISTICS
Min
-0.3
-20
-30
-
-0.3
Max
Unit
5.5 V
70 °C
80 °C
90%(Max60 °C)
3.6
RH
V
DC CHARACTERISTICS
Parameter of DC
characteristics
Supply voltage for logic
Symbol
VCC
I/O power supply
IOVCC
Input Current
Idd
Input voltage 'H' level
VIH
Input voltage 'L' level
VIL
Output voltage 'H' level
VOH
Output voltage 'L' level
VOL
Min Typ Max Unit
2.3
2.8/3.3 4.8
V
1.65 1.8/2.8/3.3 3.3 V
- 25 30 mA
0.7IOVCC -
IOVCC V
0 - 0.3IOVCC V
0.8IOVCC -
IOVCC V
0 - 0.2IOVCC V
BACKLIGHT CHARACTERISTICS
Item of backlight
characteristics
Symbol Min. Typ. Max.
Forward voltage
Vf
3.0 3.2
3.4
Number of LED
-
-6
-
Connection mode
P - Parallel -
Using condition: constant current driving method If=90mA(+/-10%).
Unit
V
Piece
-
Condition
If=90mA
-
-
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MODULE NO.: MI0350B2T-1
ELECTRO-OPTICAL CHARACTERISTICS
Ver 1.0
Item of
electro-optical
characteristics
Symbol
Condition
Min Typ Max Unit Remark Note
Response time Tr+ Tf
- 35 55 ms Fig.1 4
Contrast ratio
Luminance
uniformity
Cr
δ WHITE
θ=0°
=0°
Ta=25
300 850 -
80 -
-
--- FIG 2. 1
% FIG 3. 3
Surface
Luminance
Lv
Viewing angle
range
θ
NTSC ratio ---
CIE (x, y)
chromaticity
Red x
Red y
Green x
Green y
Blue x
Blue y
White x
White y
= 90°
= 270°
= 0°
= 180°
---
θ=0°
=0°
Ta=25_
210 270 -
cd/m2 FIG 3. 2
80 - - deg
80 - - deg
80 - - deg
80 - - deg
- 66 -
%
0.5743
0.3044
0.2804
0.5679
0.0950
0.0223
0.2334
0.2492
0.6243
0.3544
0.3304
0.6179
0.1450
0.0723
0.2934
0.3092
0.6743
0.4044
0.3804
0.6679
0.1950
0.1223
0.3534
0.3692
-
-
-
-
-
-
-
-
FIG 4.
FIG 4
FIG 4
FIG4.
-
FIG 3.
6
-
5
Note1. Contrast Ratio(CR) is defined mathematically by the following formula. For more
information see FIG 2.:
AverageSurface Luminance with all white pixels (P 1, P2, P 3, P4, P5)
ContrastRatio = Average SurfaceLuminance with all black pixels (P1, P2, P 3, P4, P5)
Note2. Surface luminance is the LCD surface from the surface with all pixels displaying white.
For more information see FIG 3.
Lv = Average Surface Luminance with all white pixels (P1, P2, P 3,P4, P5,P6,P7,P8,P9)
Note3. The uniformity in surface luminance δ WHITE is determined by measuring luminance at
each test position 1 through 9, and then dividing the maximum luminance of 9 points luminance by
minimum luminance of 9 points luminance. For more information see FIG 3.
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MODULE NO.: MI0350B2T-1
Ver 1.0
Note4. Response time is the time required for the display to transition from White to black(Rise
Time, Tr) and from black to white(Decay Time, Tf). For additional information see FIG 1..
Note5. CIE (x, y) chromaticity , The x,y value is determined by average of (P1, P2, P 3,P4,
P5,P6,P7, P8,P9) . For more information see FIG 3.
Note6. Viewing angle is the angle at which the contrast ratio is greater than a specific value. For
TFT module, the specific value of conrast ratio is 10; For monochrome and color stn module, the
specific value of conrast ratio is 2. The angles are determined for the horizontal or x axis and the
vertical or y axis with respect to the z axis which is normal to the LCD surface. For more
information see FIG 4.
Note7. For Viewing angle and response time testing, the testing data is base on Autronic-Melchers’s
ConoScope. Series Instruments. For contrast ratio, Surface Luminance, Luminance uniformity and
CIE, the testing data is base on CS-2000 photo detector.
Note8. For TN type TFT transmissive module, Gray scale reverse occurs in the direction of
panel viewing angle
FIG.1. The definition of Response Time
FIG.2. Measuring method for Contrast ratio
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MODULE NO.: MI0350B2T-1
Ver 1.0
FIG.3. Measuring method for surface luminance, Luminance uniformity,CIE (x, y)
chromaticity
FIG.4. The definition of viewing angle
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MODULE NO.: MI0350B2T-1
INTERFACE DESCRIPTION
Ver 1.0
NO. Symbol
I/O or
connect to Description
When not
in use
1 GND Power supply Power ground
-
2 YU(NC)
- No connection
3 XR(NC)
- No connection
4 YD(NC)
- No connection
5 XL(NC)
- No connection
A power supply for the analog /logic
6
VCC
Power supply power.VCC=2.3 to4.8V
TYPE:3.3V
A power supply for the analog /logic
7
VCC
Power supply power.VCC=2.3 to4.8V
TYPE:3.3V
8
IOVCC
Power supply
interface voltage supply. IOVCC=1.65 to 3.3V.
TYPE:3.3V
Backlight on/fff control pin. If use CABC
9 LCDPWM
O function, the pin can connect to external LED
driver IC. The output voltage range=0 to IOVCC.
10 TE
O Tearing effect output signal.
11 IM0
I
12 IM1
I IM[3:0]: Select the interface mode. See
13 IM2
I NOTE 1.
14 IM3
I
OPEN
OPEN
OPEN
OPEN
-
-
-
OPEN
OPEN
-
-
-
-
15 RESET
I
Reset pin. Setting either pin low initializes the IOVCC/GN
LSI. Must be reset after power is supplied.
D
16 DB23
17 DB22
18 DB21
19 DB20
20 DB19
21 DB18
22 DB17
23 DB16
I/O
DB[23:00]:
24-bit data bus for MCU interface.
I/O
DB[23:00]:
24-bit data bus for MCU interface.
I/O
DB[23:00]:
24-bit data bus for MCU interface.
I/O
DB[23:00]:
24-bit data bus for MCU interface.
I/O
DB[23:00]:
24-bit data bus for MCU interface.
I/O
DB[23:00]:
24-bit data bus for MCU interface.
I/O
DB[23:00]:
24-bit data bus for MCU interface.
I/O
DB[23:00]:
24-bit data bus for MCU interface.
OPEN
OPEN
OPEN
OPEN
OPEN
OPEN
OPEN
OPEN
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LCD MODULE

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MODULE NO.: MI0350B2T-1
Ver 1.0
24 DB15
25 DB14
26 DB13
27 DB12
28 DB11
29 DB10
30 DB09
31 DB08
32 DB07
33 DB06
34 DB05
35 DB04
36 DB03
37 DB02
38 DB01
39 DB00
40 RD
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
41 WR
I
42 RS
I
43 CS
I
44
DSI_LDO_
EN
I
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DB[23:00]:
24-bit data bus for MCU interface.
DB[23:00]:
24-bit data bus for MCU interface.
DB[23:00]:
24-bit data bus for MCU interface.
DB[23:00]:
24-bit data bus for MCU interface.
DB[23:00]:
24-bit data bus for MCU interface.
DB[23:00]:
24-bit data bus for MCU interface.
DB[23:00]:
24-bit data bus for MCU interface.
DB[23:00]:
24-bit data bus for MCU interface.
DB[23:00]:
24-bit data bus for MCU interface.
DB[23:00]:
24-bit data bus for MCU interface.
DB[23:00]:
24-bit data bus for MCU interface.
DB[23:00]:
24-bit data bus for MCU interface.
DB[23:00]:
24-bit data bus for MCU interface.
DB[23:00]:
24-bit data bus for MCU interface.
DB[23:00]:
24-bit data bus for MCU interface.
DB[23:00]:
24-bit data bus for MCU interface.
DBI Type-A: 0: Read/Write disable, 1: Read /
Write enable.
DBI Type-B: Serves as a read signal and read
data at the low level.
DBI Type-B mode: Serves as a write signal and
write data at the low level.DBI Type-A mode: 0:
Read/Write disable, 1: Read / Write enable.
Command/data select signal.
Low: Select command
High: Select data
Chip select signal.
Low: Select (Accessible)
High: Not Select (Inaccessible)
Control signal of DSI_LDO. The default setting
is low.
High: Disable the DSI_LDO.
Low: Enable the DSI_LDO.
OPEN
OPEN
OPEN
OPEN
OPEN
OPEN
OPEN
OPEN
OPEN
OPEN
OPEN
OPEN
OPEN
OPEN
OPEN
OPEN
IOVCC/OP
EN
IOVCC/OP
EN
IOVCC/OP
EN
IOVCC/GN
D
IOVCC/GN
D
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MODULE NO.: MI0350B2T-1
Ver 1.0
45 GND Power supply Power ground
46 DSI_D0N
I
MIPI-DSI Data differential signal input pins.
(Data lane 0)
47 DSI_D0P
I
MIPI-DSI Data differential signal input pins.
(Data lane 0)
48 GND Power supply Power ground
49 DSI_CLKN I MIPI-DSI CLOCK differential signal input pins.
50 DSI_CLKP
I MIPI-DSI CLOCK differential signal input pins.
51 GND Power supply Power ground
52 DSI_D1N
I/O
MIPI-DSI Data differential signal input pins.
(Data lane 1)
53 DSI_D1P
I/O
MIPI-DSI Data differential signal input pins.
(Data lane 1)
54 GND Power supply Power ground
55 LEDA
LED
DRIVER
LED ANODE
56 LEDK1
LED
DRIVER
LED CATHODE
57 LEDK2
LED
DRIVER
LED CATHODE
58 LEDK3
LED
DRIVER
LED CATHODE
59 LEDK4
60 LEDK5
61 LEDK6
LED
DRIVER
LED
DRIVER
LED
DRIVER
LED CATHODE
LED CATHODE
LED CATHODE
OPEN
GND
GND
-
GND
GND
-
GND
GND
-
OPEN
OPEN
OPEN
OPEN
OPEN
OPEN
OPEN
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Note1:
MODULE NO.: MI0350B2T-1
Ver 1.0
REFERENCE APPLICATION CIRCUIT
Please consult our technical department for detail information.
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MODULE NO.: MI0350B2T-1
RELIABILITY TEST CONDITIONS
Ver 1.0
No. Test Item
Test Condition
Inspection after test
1 High Temperature Storage 8082_/200 hours
2 Low Temperature Storage -3082_/200 hours
3 High Temperature Operating 7082_/120 hours
Inspection after 2~4hours
storage at room temperature,
the sample shall be free from
defects:
4 Low Temperature Operating -2082_/120 hours
5 Temperature Cycle storage -2082_~25~7082_<10cycles
(30min.) (5min.) (30min.)
6 Damp proof Test operating 50_85_<90%RH/120 hours
1.Air bubble in the LCD;
2.Sealleak;
3.Non-display;
4.missing segments;
5.Glass crack;
6.Current Idd is twice
higher than initial value.
Frequency%10Hz~55Hz~10Hz
7 Vibration Test
8 Dropping test
Amplitude%1.5mm,
X,Y,Z direction for total 3hours
(Packing condition)
Drop to the ground from 1m height,
one time,every side of carton.
(Packing condition)
9 ESD test
Voltage:±8KV R: 330Ω C: 150pF
Air discharge, 10time
Remark:
1.The test samples should be applied to only one test item.
2.Sample size for each test item is 5~10pcs.
3.For Damp Proof Test, Pure water(Resistance10MΩ) should be used.
4.In case of malfunction defect caused by ESD damage, if it would be recovered to normal state after resetting, it would be judged as a good
part.
5.EL evaluation should be excepted from reliability test with humidity and temperature: Some defects such as black spot/blemish can happen
by natural chemical reaction with humidity and Fluorescence EL has.
6.Failure Judgment Criterion: Basic Specification, Electrical Characteristic, Mechanical Characteristic, Optical Characteristic.
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MODULE NO.: MI0350B2T-1
INSPECTION CRITERION
Ver 1.0
OUTGOING QUALITY STANDARD
TITLE:FUNCTIONAL TEST & INSPECTION CRITERIA
PAGE 1 OF 4
MDS Product
This specification is made to be used as the standard acceptance/rejection criteria for Color mobile
phone LCM.
1 Sample plan
Sampling plan according to GB/T2828.1-2003/ISO 2859-1%1999 and ANSI/ASQC Z1.4-1993,
normal level 2 and based on:
Major defect: AQL 0.65
Minor defect: AQL 1.5
2. Inspection condition
Viewing distance for cosmetic inspection is about 30cm with bare eyes, and under an
environment of 20~40W light intensity, all directions for inspecting the sample should be within
45°against perpendicular line.
3. Definition of inspection zone in LCD.
A BC
Zone A: character/Digit area
Zone B: viewing area except Zone A (ZoneA+ZoneB=minimum Viewing area)
Zone C: Outside viewing area (invisible area after assembly in customer’s product)
Fig.1 Inspection zones in an LCD.
Note: As a general rule, visual defects in Zone C are permissible, when it is no trouble for
quality and assembly of customer’s product.
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MODULE NO.: MI0350B2T-1
Ver 1.0
OUTGOING QUALITY STANDARD
TITLE:FUNCTIONAL TEST & INSPECTION CRITERIA
PAGE 2 OF 4
MDS Product
4. Inspection standards
4.1 Major Defect
Item
No
4.1.1
Items to be
inspected
All
functional
defects
Inspection Standard
1) No display
2) Display abnormally
3) Missing vertical,horizontal segment
4) Short circuit
5) Back-light no lighting, flickering and abnormal lighting.
4.1.2 Missing Missing component
Classification
of defects
Major
4.1.3
Outline
Overall outline dimension beyond the drawing is not allowed.
dimension
4.2 Cosmetic Defect
Item Items to be
No inspected
Inspection Standard
Clear
Spots
For dark/white spot, sizeΦis defined
as Φ= (x + y)
2
y
x
Black and
white Spot
defect
Pinhole,
Foreign
Particle,
Dirt under
polarizer
1/
Zone
Size(mm)
Φ≤0.10
0.100Φ≤0.15
0.150Φ≤0.20
Acceptable Qty
AB C
Ignore
2
Ignore
1
4.2.1
Φ0.20
0
Dim Spots 2.
Classification of
defects
Minor
Circle
shaped and
dim edged
defects
2. Zone
Size(mm)
Φ≤0.2
0.200Φ≤0.40
0.400Φ≤0.60
0.600Φ≤0.80
0.800Φ
Acceptable Qty
AB
C
Ignore
3
Ignore
2
1
0
Minor
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MODULE NO.: MI0350B2T-1
Ver 1.0
OUTGOING QUALITY STANDARD
TITLE: FUNCTIONAL TEST & INSPECTION CRITERIA
4.2. Cosmetic Defect
Item Items to be
No inspected
Inspection Standard
PAGE 3 OF 4
MDS Product
Classification
of defects
Line defect
Black line,
White line,
4.2.2
Foreign
material
under
polarizer,
Size(mm)
L(Length)
W(Width)
Acceptable Qty
Zone
ABC
Ignore
L≤3.0
L≤2.0
W≤0.02
0.020W≤0.03
0.030W≤0.05
0.050W
Ignore
2
1 Ignore
Define as spot
defect
Minor
If the Polarizer scratch can be seen after mobile phone
cover assembling or in the operating condition, judge by
the line defect of 4.2.2.
If the Polarizer scratch can be seen only in non-operating
condition or some special angle, judge by the following.
4.2.3
Polarizer
scratch
Size(mm)
Acceptable Qty
L(Length)
W(Width)
Zone
AB
C
Ignore
W≤0.03
Ignore
5.00L≤10.0
L≤5.0
0.030W≤0.05
0.050W≤0.08
2
1
Ignore
0.080W
0
Air bubbles between glass & polarizer
4.2.4
Polarize
Air bubble
2. Zone
Size(mm)
Φ≤0.2
0.200Φ≤0.30
0.300Φ≤0.50
0.500Φ
Acceptable Qty
AB
C
Ignore
2
Ignore
1
0
Minor
Minor
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MODULE NO.: MI0350B2T-1
Ver 1.0
OUTGOING QUALITY STANDARD
TITLE:FUNCTIONAL TEST & INSPECTION CRITERIA
4.3. Cosmetic Defect
Item Items to be
No inspected
Inspection Standard
(i) Chips on corner
PAGE 4 OF 4
MDS Product
Classification of
defects
4.3.5
Glass
defect
XYZ
≤2.0 ≤S Disregard
Notes: S=contact pad length
Chips on the corner of terminal shall not be allowed to extend
into the ITO pad or expose perimeter seal.
(ii)Usual surface cracks
Minor
Minor
XY
≤3.0 <Inner border line of the seal
(iii) Crack
Cracks tend to break are not allowed.
Z
Disregard
Major
4.3.6
4.3.7
Parts
alignment
SMT
1) Not allow IC and FPC/heat-seal lead width is more than 50%
beyond lead pattern.
2) Not allow chip or solder component is off center more than
50% of the pad outline.
According to the <Acceptability of electronic assemblies>
IPC-A-610C class 2 standard. Component missing or function
defect are Major defect, the others are Minor defect.
Minor
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MODULE NO.: MI0350B2T-1
PRECAUTIONS FOR USING LCD MODULES
Ver 1.0
1 Handing Precautions
1.1 The display panel is made of glass and polarizer. As glass is fragile. It tends to become or
chipped during handling especially on the edges. Please avoid dropping or jarring. Do not
subject it to a mechanical shock by dropping it or impact.
1.2 If the display panel is damaged and the liquid crystal substance leaks out, be sure not to get any
in your mouth. If the substance contacts your skin or clothes, wash it off using soap and water.
1.3 Do not apply excessive force to the display surface or the adjoining areas since this may cause
the color tone to vary. Do not touch the display with bare hands. This will stain the display area
and degraded insulation between terminals (some cosmetics are determined to the polarizer).
1.4 The polarizer covering the display surface of the LCD module is soft and easily scratched.
Handle this polarizer carefully. Do not touch, push or rub the exposed polarizers with anything
harder than an HB pencil lead (glass, tweezers, etc.). Do not put or attach anything on the
display area to avoid leaving marks on it. Condensation on the surface and contact with
terminals due to cold will damage, stain or dirty the polarizer. After products are tested at low
temperature they must be warmed up in a container before coming in to contact with room
temperature air.
1.5 If the display surface becomes contaminated, breathe on the surface and gently wipe it with a
soft dry cloth. If it is heavily contaminated, moisten cloth with one of the following solvents
- Isopropyl alcohol
- Ethyl alcohol
Do not scrub hard to avoid damaging the display surface.
1.6 Solvents other than those above-mentioned may damage the polarizer. Especially, do not use
the following.
- Water
- Ketone
- Aromatic solvents
Wipe off saliva or water drops immediately, contact with water over a long period of time
may cause deformation or color fading. Avoid contact with oil and fats.
1.7 Exercise care to minimize corrosion of the electrode. Corrosion of the electrodes is accelerated
by water droplets, moisture condensation or a current flow in a high-humidity environment.
1.8 Install the LCD Module by using the mounting holes. When mounting the LCD module make
sure it is free of twisting, warping and distortion. In particular, do not forcibly pull or bend the
I/O cable or the backlight cable.
1.9 Do not attempt to disassemble or process the LCD module.
1.10 NC terminal should be open. Do not connect anything.
1.11 If the logic circuit power is off, do not apply the input signals.
1.12 Electro-Static Discharge Control,Since this module uses a CMOS LSI, the same careful
attention should be paid to electrostatic discharge as for an ordinary CMOS IC. To prevent
destruction of the elements by static electricity, be careful to maintain an optimum work
environment.
- Before removing LCM from its packing case or incorporating it into a set, be sure
the module and your body have the same electric potential. Be sure to ground the body when
handling the LCD modules
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MODULE NO.: MI0350B2T-1
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- Tools required for assembling, such as soldering irons, must be properly grounded.
Make certain the AC power source for the soldering iron does not leak. When using an
electric screwdriver to attach LCM, the screwdriver should be of ground potentiality to
minimize as much as possible any transmission of electromagnetic waves produced sparks
coming from the commutator of the motor.
- To reduce the amount of static electricity generated, do not conduct assembling
and other work under dry conditions. To reduce the generation of static electricity be careful
that the air in the work is not too dry. A relative humidity of 50%-60% is recommended. As
far as possible make the electric potential of your work clothes and that of the work bench
the ground potential.
- The LCD module is coated with a film to protect the display surface. Exercise care
when peeling off this protective film since static electricity may be generated.
1.13 Since LCM has been assembled and adjusted with a high degree of precision, avoid applying
excessive shocks to the module or making any alterations or modifications to it.
- Do not alter, modify or change the shape of the tab on the metal frame.
- Do not make extra holes on the printed circuit board, modify its shape or change the
positions of components to be attached.
- Do not damage or modify the pattern writing on the printed circuit board.
- Absolutely do not modify the zebra rubber strip (conductive rubber) or heat seal
connector.
- Except for soldering the interface, do not make any alterations or modifications with a
soldering iron.
- Do not drop, bend or twist the LCM.
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MODULE NO.: MI0350B2T-1
2 Handling precaution for LCM
2.1 LCM is easy to be damaged. Please note below and be careful for handling.
2.2 Correct handling:
Ver 1.0
As above picture please handle with anti-static gloves around LCM edges.
2.3 Incorrect handling:
Please don’t touch IC directly.
Please don’t stack LCM.
Please don’t hold the surface of panel.
Please don’t stretch interface of output, such
as FPC cable.
Please don’t hold the surface of IC.
MULTI-INNO TECHNOLOGY CO.,LTD.
Please don’t operate with sharp stick such as
pens.
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MODULE NO.: MI0350B2T-1
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3 Storage Precautions
3.1 When storing the LCD modules, the following precaution are necessary.
3.1.1 Store them in a sealed polyethylene bag. If properly sealed, there is no need for the
desiccant.
3.1.2 Store them in a dark place. Do not expose to sunlight or fluorescent light, keep the
temperature between 0°C and 35°C, and keep the relative humidity between 40%RH and
60%RH.
3.1.3 The polarizer surface should not come in contact with any other objects (We advise you to
store them in the anti-static electricity container in which they were shipped).
3.2 Others
3.2.1 Liquid crystals solidify under low temperature (below the storage temperature range)
leading to defective orientation or the generation of air bubbles (black or white). Air
bubbles may also be generated if the module is subject to a low temperature.
3.2.2 If the LCD modules have been operating for a long time showing the same display
patterns, the display patterns may remain on the screen as ghost images and a slight
contrast irregularity may also appear. A normal operating status can be regained by
suspending use for some time. It should be noted that this phenomenon does not adversely
affect performance reliability.
3.2.3 To minimize the performance degradation of the LCD modules resulting from destruction
caused by static electricity etc., exercise care to avoid holding the following sections when
handling the modules.
3.2.3.1 - Exposed area of the printed circuit board.
3.2.3.2 -Terminal electrode sections.
4 USING LCD MODULES
4.1 Installing LCD Modules
The hole in the printed circuit board is used to fix LCM as shown in the picture below.
Attend to the following items when installing the LCM.
4.1.1 Cover the surface with a transparent protective plate to protect the polarizer and LC cell.
4.1.2 When assembling the LCM into other equipment, the spacer to the bit between the LCM
and the fitting plate should have enough height to avoid causing stress to the module
surface, refer to the individual specifications for measurements. The measurement
tolerance should be ±0.1mm.
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MODULE NO.: MI0350B2T-1
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4.2 Precaution for assemble the module with BTB connector:
Please note the position of the male and female connector position, don’t assemble or
assemble like the method which the following picture shows
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MODULE NO.: MI0350B2T-1
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4.3 Precaution for soldering the LCM
Manual soldering
No RoHS 290°C ~350°C.
Product Time : 3-5S.
RoHS
Product
340°C ~370°C.
Time : 3-5S.
Machine drag soldering
330°C ~350°C.
Speed : 4-8 mm/s.
350°C ~370°C.
Time : 4-8 mm/s.
Machine press soldering
300°C ~330°C.
Time : 3-6S.
Press: 0.8~1.2Mpa
330°C ~360°C.
Time : 3-6S.
Press: 0.8~1.2Mpa
4.3.1 If soldering flux is used, be sure to remove any remaining flux after finishing to soldering
operation (This does not apply in the case of a non-halogen type of flux). It is
recommended that you protect the LCD surface with a cover during soldering to prevent
any damage due to flux spatters.
4.3.2 When soldering the electroluminescent panel and PC board, the panel and board should not
be detached more than three times. This maximum number is determined by the
temperature and time conditions mentioned above, though there may be some variance
depending on the temperature of the soldering iron.
4.3.3 When remove the electroluminescent panel from the PC board, be sure the solder has
completely melted, the soldered pad on the PC board could be damaged.
4.4 Precautions for Operation
4.4.1 Viewing angle varies with the change of liquid crystal driving voltage (VLCD). Adjust
VLCD to show the best contrast.
4.4.2 It is an indispensable condition to drive LCD's within the specified voltage limit since the
higher voltage then the limit cause the shorter LCD life. An electrochemical reaction due
to direct current causes LCD's undesirable deterioration, so that the use of direct current
drive should be avoided.
4.4.3 Response time will be extremely delayed at lower temperature than the operating
temperature range and on the other hand at higher temperature LCD's show dark color in
them. However those phenomena do not mean malfunction or out of order with LCD's,
which will come back in the specified operating temperature.
4.4.4 If the display area is pushed hard during operation, the display will become abnormal.
However, it will return to normal if it is turned off and then back on.
4.4.5 A slight dew depositing on terminals is a cause for electro-chemical reaction resulting in
terminal open circuit. Usage under the maximum operating temperature, 50%RH or less is
required.
4.4.6 Input logic voltage before apply analog high voltage such as LCD driving voltage when
power on. Remove analog high voltage before logic voltage when power off the module.
Input each signal after the positive/negative voltage becomes stable.
4.4.7 Please keep the temperature within the specified range for use and storage. Polarization
degradation, bubble generation or polarizer peel-off may occur with high temperature and
high humidity.
4.5 Safety
4.5.1 It is recommended to crush damaged or unnecessary LCDs into pieces and wash them off
with solvents such as acetone and ethanol, which should later be burned.
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MODULE NO.: MI0350B2T-1
Ver 1.0
4.5.2 If any liquid leaks out of a damaged glass cell and comes in contact with the hands, wash
off thoroughly with soap and water.
4.6 Limited Warranty
Unless agreed between Multi-Inno and the customer, Multi-Inno will replace or repair any
of its LCD modules which are found to be functionally defective when inspected in accordance
with Multi-Inno LCD acceptance standards (copies available upon request) for a period of one
year from date of production. Cosmetic/visual defects must be returned to Multi-Innowithin 90
days of shipment. Confirmation of such date shall be based on data code on product. The
warranty liability of Multi-Inno limited to repair and/or replace on the terms set forth above.
Multi-Inno will not be responsible for any subsequent or consequential events.
4.7 Return LCM under warranty
4.7.1 No warranty can be granted if the precautions stated above have been disregarded. The
typical examples of violations are :
4.7.1.1 - Broken LCD glass.
4.7.1.2 - PCB eyelet is damaged or modified.
4.7.1.3 -PCB conductors damaged.
4.7.1.4 - Circuit modified in any way, including addition of components.
4.7.1.5 - PCB tampered with by grinding, engraving or painting varnish.
4.7.1.6 - Soldering to or modifying the bezel in any manner.
4.7.2 Module repairs will be invoiced to the customer upon mutual agreement. Modules must be
returned with sufficient description of the failures or defects. Any connectors or cable
installed by the customer must be removed completely without damaging the PCB eyelet,
conductors and terminals.
PACKING SPECIFICATION
Please consult our technical department for detail information.
PRIOR CONSULT MATTER
1 For Multi-Inno standard products, we keep the right to change material, process ... for improving
the product property without prior notice to our customer.
2 For OEM products, if any changes are needed which may affect the product property, we will
consult with our customer in advance.
3 If you have special requirement about reliability condition, please let us know before you start the
test on our samples.
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