MSMLG7.5A (Microsemi)
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MSMLG5.0A – MSMLG170CAe3, MSMLJ5.0A – MSMLJ170CAe3 Surface
Mount 3000 Watt Transient Voltage Suppressor
1 Product Overview
The MSMLG5.0A–MSMLG170CA and the MSMLJ5.0A–MSMLJ170CA series of high-reliability transient
voltage suppressors (TVS) protect circuits from voltage spikes containing up to 3000 W (10/1000 μs
model pulse). The SMLG gull-wing design in the DO-215AB package allows for visible solder connections.
The SMLJ J-bend design in the DO-214AB package allows for greater PC board mounting density.
Selections include unidirectional and bidirectional as well as RoHS-compliant versions. These are
available with a variety of upscreening options for enhanced reliability. They protect against the
secondary effects of lightning per IEC61000-4-5 and against voltage pulses from inductive switching
environments and induced by RF radiation. Since their response time is virtually instantaneous, they can
also be used in protection from ESD and EFT per IEC61000-4-2 and IEC61000-4-4.
For the latest information, visit our website www.microsemi.com.
1.1 Features
The following are key features of the MSMLG5.0A through MSMLG170CAe3 and the MSMLJ5.0A
through MSMLJ170CAe3 devices:
High-reliability devices with fabrication and assembly lot traceability for all M prefix devices
All devices are 100% surge tested
3σ lot norm screening performed on standby current (ID) for all M prefix devices
Available in both unidirectional and bidirectional versions
Moisture classification is “Level 1” with no dry pack required per IPC/JEDEC J-STD-020B for all M
prefix devices.
Enhanced reliability screening options with M prefix are available in reference to MIL-PRF-19500.
Refer to High Reliability Up-Screened Plastic Products Portfolio for more details on the screening
options (see Part Nomenclature for all available options).
RoHS compliant versions available
Axial-lead equivalent packages for thru-hole mounting are available as M5KP5.0A to M5KP110CA
with 5000 W rating (contact Microsemi for other surface mount options).
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1.2 Applications and Benefits
The following are benefits of the MSMLG5.0A through MSMLG170CAe3 and the MSMLJ5.0A through
MSMLJ170CAe3 devices.
Suppresses transients up to 3000 W (10/1000 µs test pulse—see Figure 2 (see page 7))
Protection from switching transients and induced RF
Protection from ESD, and EFT per IEC 61000-4-2 and IEC 61000-4-4
Secondary lightning protection per IEC 61000-4-5 with 42 Ω source impedance:
Class 1 and 2: SML 5.0A to SML 170A or CA
Class 3: SML 5.0A to SML 150A or CA
Class 4: SML 5.0A to SML 75A or CA
Secondary lightning protection per IEC 61000-4-5 with 12 Ω source impedance:
Class 1: SML 5.0A to SML 170A or CA
Class 2: SML 5.0A to SML 90A or CA
Class 3: SML 5.0A to SML 48A or CA
Class 4: SML 5.0A to SML 24A or CA
Secondary lightning protection per IEC 61000-4-5 with 2 Ω source impedance:
Class 2: SML 5.0A to SML 43A or CA
Class 3: SML 5.0A to SML 22A or CA
Class 4: SML 5.0A to SML10A or CA
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1.3
1.4
Part Nomenclature
The following table lists the part nomenclature for the MSMLG5.0A through MSMLG170CAe3 and the
MSMLJ5.0 through MSMLJ170CAe3 devices.
Table 1 • MXSMLG5.0CAe3 Part Nomenclature
MX Reliability level*
SM
L
G or J
5.0
C
A
e3
Surface-mount package
3000 W power level
Gull-wing or J-bend lead frame
Reverse standoff voltage
Uni/bidirectional
± 5% Tolerance level
RoHS Compliance
M (controlled product)
MA (aviconics grade) MX (reference JANTX)
MXL (MX life)
Blank = commercial
*(see Hirel Non-Hermetic Product Portfolio)
(see Typical Electrical Performance (see page 5)
table)
C = Bidirectional
Blank = Undirectional
e3 = RoHS compliant
Blank = non-RoHS compliant
Symbols and Definitions
The following table lists the symbols and definitions used for the MSMLG5.0A through MSMLG170CAe3
and the MSMLJ5.0 through MSMLJ170CAe3 devices.
Table 2 • Symbols and Definitions
Symbol
I(BR)
ID
IF
IPP
PPP
V(BR)
VC
Value
Breakdown current
Standby current
Forward current
Peak impulse current
Peak pulse Power
Minimum breakdown voltage
Clamping voltage
VWM Rated working standoff voltage
Definition
The current used for measuring breakdown voltage V(BR).
The current at the rated standoff voltage VWM.
The forward current dc value, no alternating component.
The peak current during the impulse.
The peak power dissipation resulting from peak impulse current IPP.
The minimum voltage the device will exhibit at a specified current.
Clamping voltage at IPP (peak pulse current) at the specified pulse
conditions (typically shown as maximum value).
The maximum peak voltage that can be applied over the operating
temperature range.
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2 Electrical Specifications
This section shows the electrical specifications for the MSMLG5.0A–MSMLG170CA and the MSMLJ5.0A–
MSMLJ170CA devices.
2.1 Maximum Ratings
The following table shows you the absolute maximum ratings for the MSMLG5.0A–MSMLG170CA and
the MSMLJ5.0A–MSMLJ170CA devices.
Table 3 • Absolute Maximum Ratings
Parameter/Test Conditions
Junction and storage temperature
Thermal resistance junction-to-lead
Thermal resistance junction-to-ambient1
Peak pulse power dissipation at 25 °C
(10/1000 μs, see Figures 1, 2, and 3).
Impulse repetition rate (duty factor)
tclamping (0 V to V(BR) min)
Rated average power dissipation
Maximum forward surge current2
Solder temperature at 10 s
Unidirectional
Bidirectional
TL = 45 °C
TL = 25 °C
Symbol
TJ and TSTG
RθJL
RθJA
PPP
Value
–65 to 150
17.5
77.5
3000
Unit
°C
°C/W
W
df
tclamping
PM(AV)
IFSM
TSP
0.01 or
less
<100
<5
6
1.611
200
260
%
ps
ns
W
A (pk)
°C
Notes:
1. When mounted on FR4 PC board (1 oz Cu) with recommended mounting pad (see pad layout).
2. Peak impulse of 8.3 ms half-sine wave at 25 °C (unidirectional only).
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2.2
Typical Electrical Performance
The following table shows the Electrical characteristics for the MSMLG5.0A–MSMLG170CA and the
MSMLJ5.05A–MSMLJ170CA devices at 25 °C unless otherwise specified.
For bidirectional device types, indicate a CA suffix after the part number (i.e. MSMLG170CA).
Table 4 • Typical Electrical Performance
Part Number
Gull-wing
SMLG5.0A
SMLG6.0A
SMLG6.5A
SMLG7.0A
SMLG7.5A
SMLG8.0A
SMLG8.5A
SMLG9.0A
SMLG10A
SMLG11A
SMLG12A
SMLG13A
SMLG14A
SMLG15A
SMLG16A
SMLG17A
SMLG18A
SMLG20A
SMLG22A
SMLG24A
SMLG26A
SMLG28A
SMLG30A
SMLG33A
SMLG36A
SMLG40A
SMLG43A
SMLG45A
SMLG48A
SMLG51A
SMLG54A
SMLG58A
SMLG60A
SMLG64A
SMLG70A
SMLG75A
J-bend
SMLJ5.0A
SMLJ6.0A
SMLJ6.5A
SMLJ7.0A
SMLJ7.5A
SMLJ8.0A
SMLJ8.5A
SMLJ9.0A
SMLJ10A
SMLJ11A
SMLJ12A
SMLJ13A
SMLJ14A
SMLJ15A
SMLJ16A
SMLJ17A
SMLJ18A
SMLJ20A
SMLJ22A
SMLJ24A
SMLJ26A
SMLJ28A
SMLJ30A
SMLJ33A
SMLJ36A
SMLJ40A
SMLJ43A
SMLJ45A
SMLJ48A
SMLJ51A
SMLJ54A
SMLJ58A
SMLJ60A
SMLJ64A
SMLJ70A
SMLJ75A
VWM
Reverse
Standoff
Voltage
(V)
5.0
6.0
6.5
7.0
7.5
8.0
8.5
9.0
10
11
12
13
14
15
16
17
18
20
22
24
26
28
30
33
36
40
43
45
48
51
54
58
60
64
70
75
VBR Breakdown
Voltage at I(BR)
(V)
6.40 – 7.00
6.67 – 7.37
7.22 – 7.98
7.78 – 8.60
8.33 – 9.21
8.89 – 9.83
9.44 – 10.4
10.0 – 11.1
11.1 – 12.3
12.2 – 13.5
13.3 – 14.7
14.4 – 15.9
15.6 – 17.2
16.7 – 18.5
17.8 – 19.7
18.9 – 20.9
20.0 – 22.1
22.2 – 24.5
24.4 – 26.9
26.7 – 29.5
28.9 – 31.9
31.1 – 34.4
33.3 – 36.8
36.7 – 40.6
40.0 – 44.2
44.4 – 49.1
47.8 – 52.8
50.0 – 55.3
53.3 – 58.9
56.7 – 62.7
60.0 – 66.3
64.4 – 71.2
66.7 – 73.7
71.1 – 78.6
77.8 – 86.0
83.3 – 92.1
IBR Test
Current
(mA)
10
10
10
10
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
VC Max
Clamping
Voltage
at IPP
(V)
9.2
10.3
11.2
12.0
12.9
13.6
14.4
15.4
17.0
18.2
19.9
21.5
23.2
24.4
26.0
27.6
29.2
32.4
35.5
38.9
42.1
45.4
48.4
53.3
58.1
64.5
69.4
72.7
77.4
82.4
87.1
93.6
96.8
103.0
113
121
IPP Max
Peak
Pulse
Current
(A)
326.0
291.3
267.9
250.0
232.6
220.6
208.4
194.8
176.4
164.8
150.6
139.4
129.4
123.0
115.4
106.6
102.8
92.6
84.4
77.2
71.2
66.0
62.0
56.2
51.6
46.4
43.2
41.2
38.8
36.4
34.4
32.0
31.0
29.2
26.6
24.8
ID Max
Stand-by
Current
at V WM
(µA)
1000
1000
500
200
100
50
25
10
5
5
5
5
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
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2.3
Part Number
SMLG78A
SMLG85A
SMLG90A
SMLG100A
SMLG110A
SMLG120A
SMLG130A
SMLG150A
SMLG160A
SMLG170A
SMLJ78A
SMLJ85A
SMLJ90A
SMLJ100A
SMLJ110A
SMLJ120A
SMLJ130A
SMLJ150A
SMLJ160A
SMLJ170A
VWM
Reverse
Standoff
Voltage
78
85
90
100
110
120
130
150
160
170
VBR Breakdown
Voltage at I(BR)
86.7 – 95.8
94.4 – 104.0
100 – 111
111 – 123
122 – 135
133 – 147
144 – 159
167 – 185
178 – 197
189 – 209
IBR Test
Current
1
1
1
1
1
1
1
1
1
1
VC Max
Clamping
Voltage
at IPP
126
137
146
162
177
193
209
243
259
275
IPP Max
Peak
Pulse
Current
22.8
20.8
20.6
18.6
16.8
15.6
14.4
12.4
11.6
11.0
ID Max
Stand-by
Current
at V WM
2
2
2
2
2
2
2
2
2
2
Bidirectional capacitance is half that shown in Figure 4 (see page 8) at 0 V.
Typical Performance Curves
This section shows the typical performance curves of the MSMLG5.0A–MSMLG170CA and the
MSMLJ5.0A–MSMLJ170CA devices.
The following graph shows peak-pulse power versus pulse time (up to 50% of exponentially decaying
pulse).
Figure 1 • Peak Pulse Power vs. Pulse Time (to 50% of exponentially decaying pulse)
The following graph shows the pulse waveform with these parameters: tr = 10 µs and tp = 1000 µs.
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The following graph shows the pulse waveform with these parameters: tr = 10 µs and tp = 1000 µs.
Figure 2 • Pulse Waveform
The following graph shows the derating curve.
Figure 3 • Derating Curve
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The following graph shows the typical capacitance versus the breakdown voltage. Note that the
bidirectional capacitance is half that shown at 0 V.
Figure 4 • Typical Capacitance vs. Breakdown Voltage (Unidirectional Configuration)
Note:
Bidirectional capacitance is half that shown in Figure 4 at 0 V.
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3 Package Specification
The following sections shows the package specifications for the SMLG (DO-215AB) and SMLG (DO-
214AB) packages.
3.1 Package Information
The following illustration shows the SMLJ DO-214AB package dimensions. The typical standoff height is
0.004 in—0.008 in (0.1—0.2 mm).
Figure 5 • SMLG (DO-215AB) Package Dimensions
The following table shows the SMLG DO-215AB mechanical and packaging information.
Table 5 • SMLG (DO-215AB) Mechanical and Package Information
Letter
A
B
C
E
F1
K
Dimensions (in.)
0.115—0.121
0.260—0.280
0.220—0.245
0.077—0.110
0.380—0.400
0.025—0.040
Dimensions (mm)
2.92—3.07
6.60—7.11
5.59—6.22
1.95—2.80
9.65—10.16
0.635—1.016
Note:
1. Dimesion "E" exceeds the JEDEC outline as shown.
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The following illustration shows the mechanical and packaging information for the SMLG (DO-214AB)
package.
Figure 6 • SMLJ_(DO-214AB)_Package_Dimensions
The following table shows the SMLJ DO-214AB mechanical and packaging information.
Table 6 • SMLJ (DO-214AB) Mechanical and Package Information
Letter
A
B
C
D
E
L
Dimensions (in.)
0.115—0.121
0.260—0.280
0.220—0.245
0.305—0.320
0.077—0.110
0.030—0.060
Dimensions (mm)
2.92—3.07
6.60—7.11
5.59—6.22
7.75—8.13
1.95—2.80
0.760—1.52
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3.2 Pad Layout
The following illustration shows the pad layout for the SMLG (DO-215AB) and SMLJ (DO-214AB)
packages.
Figure 7 • Pad Layout
The following table shows the SMLG DO-215AB pad layout dimensions.
Table 7 • SMLG (DO-215AB) Pad Layout Dimensions
Letter
A
B
C
Dimensions (in.)
0.510
0.110
0.150
Dimensions (mm)
12.95
2.79
3.81
The following table shows the SMLJ DO-214AB pad layout dimensions.
Table 8 • SMLJ (DO-214AB) Pad Layout Dimensions
Letter
A
B
C
Dimensions (in.)
0.390
0.110
0.150
Dimensions (mm)
9.90
2.79
3.81
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products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with
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