MPZ1608S221ATA00 (TDK)
Chip Beads

No Preview Available !

Click to Download PDF File for PC

MPZ1608S221ATA00
Applications
Commercial Grade
Feature
Power Line
Series
MPZ Series / MPZ1608 Type
Status
Production
1 of 2
Creation Date :February 23 2015
Size
Length(L)
Width(W)
Thickness(T)
Recommended Land Pattern (A)
Recommended Land Pattern (B)
Recommended Land Pattern (C)
Electrical Characteristics
Impedance at 100MHz
Rated Current
DC Resistance [Max.]
Other
Operating Temp. Range (Including Self-Temp. Rise)
Soldering Method
AEC Q200
Packing
Package Quantity
Weight
1.60mm +/-0.15mm
0.80mm +/-0.15mm
0.80mm +/-0.15mm
0.60mm Nom.
0.80mm Nom.
0.80mm Nom.
220Ω +/-25%
2.2A
50mΩ
-55 to 125degC
Reflow, Iron Soldering
No
Punched (Paper)Taping [180mm Reel]
4000Pcs Min.
0.004g
•This PDF document was created based on the data listed on the TDK Corporation website.
•All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved


MPZ1608S221ATA00 (TDK)
Chip Beads

No Preview Available !

Click to Download PDF File for PC

MPZ1608S221ATA00
2 of 2
Creation Date :February 23 2015
MPZ1608S221ATA00(|ZM|) PZ1608S221ATA00(R)MPZ1608S221ATA00(X)
MPZ1608S221ATA00
Temperature Rise by DC
no data available
MPZ1608S221ATA00
•This PDF document was created based on the data listed on the TDK Corporation website.
•All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved




MPZ1608S221ATA00.pdf
Click to Download PDF File