DZ23C47 (Diodes)
300mW DUAL SURFACE MOUNT ZENER DIODE

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Features
Dual Zeners in Common Cathode Configuration
300 mW Power Dissipation
Ideally Suited for Automated Insertion
 VZ For Both Diodes in One Case is 5%
Common Anode Style Available, See AZ Series
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Notes 3 & 4)
Qualified to AEC-Q101 Standards for High Reliability
SOT23
DZ23C2V7 - DZ23C51
300mW DUAL SURFACE MOUNT ZENER DIODE
Mechanical Data
Case: SOT23
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Alloy 42 lead frame
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Polarity: See Diagram
Weight: 0.008 grams (approximate)
Top View
Device Schematic
Ordering Information (Note 5)
Device
(Type Number)-7-F*
(Type Number)Q-7-F*
Qualification
Commercial
Automotive
Packaging
SOT23
SOT23
Shipping
3000/Tape & Reel
3000/Tape & Reel
*Add “-7-F” to the appropriate type number in Electrical Characteristics Table on Page 2. Example: 6.2V Zener = DZ23C6V2-7-F.
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Product manufactured with Date Code OW (week 42, 2009) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code OW are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
5. For Packaging Details, go to our website at http://www.diodes.com/products/packages.html
Marking Information
Kxx
K = SAT (Shanghai Assembly / Test site)
xx = Product Type Marking Code
See Electrical Characteristics Table
YM = Date Code Marking
Y = Year (ex: Z = 2012)
M = Month (ex: 9 = September)
Cxx
C = CAT (Chengdu Assembly / Test site)
xx = Product Type Marking Code
See Electrical Characteristics Table
YM = Date Code Marking
Y = Year (ex: Z = 2012)
M = Month (ex: 9 = September)
Date Code Key
Year
1998
Code
J
Month
Code
Jan
1
2002 2003
…N
P
Feb Mar
23
2004
R
Apr
4
2010 2011 2012 2013
…XY Z A
May Jun
56
Jul Aug
78
2014
B
Sep
9
2015
C
2016
D
2017
E
Oct Nov
ON
2018
F
Dec
D
DZ23C2V7 - DZ23C51
Document number: DS18002 Rev. 20 - 2
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DZ23C47 (Diodes)
300mW DUAL SURFACE MOUNT ZENER DIODE

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DZ23C2V7 - DZ23C51
Thermal Characteristics
Characteristic
Power Dissipation
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
(Note 6)
(Note 6)
Symbol
PD
RθJA
TJ, TSTG
Value
300
417
–65 to +150
Notes: 6. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com.
Unit
mW
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Type
Number
DZ23C2V7
DZ23C3V0
DZ23C3V3
DZ23C3V6
DZ23C3V9
DZ23C4V3
DZ23C4V7
DZ23C5V1
DZ23C5V6
DZ23C6V2
DZ23C6V8
DZ23C7V5
DZ23C8V2
DZ23C9V1
DZ23C10
DZ23C11
DZ23C12
DZ23C13
DZ23C15
DZ23C16
DZ23C18
DZ23C20
DZ23C22
DZ23C24
DZ23C27
DZ23C30
DZ23C33
DZ23C36
DZ23C39
DZ23C43
DZ23C47
DZ23C51
Marking
Code
V1
V2
V3
V4
V5
V6
V7
V8
V9
VA
VB
VC
VD
VE
VF
VG
VH
VI
VJ
VK
VL
VM
VN
VO
VP
VQ
VR
VS
VT
VU
VV
VW
Zener
Voltage Range
(Note 7)
@ IZT = 5.0mA
VZ (V)
2.5-2.9
2.8-3.2
3.1-3.5
3.4-3.8
3.7-4.1
4.0-4.6
4.4-5.0
4.8-5.4
5.2-6.0
5.8-6.6
6.4-7.2
7.0-7.9
7.7-8.7
8.5-9.6
9.4-10.6
10.4-11.6
11.4-12.7
12.4-14.1
13.8-15.6
15.3-17.1
16.8-19.1
18.8-21.2
20.8-23.3
22.8-25.6
25.1-28.9
28-32
31-35
34-38
37-41
40-46
44-50
48-54
Maximum
Zener Impedance
f = 1kHz
ZZT @ IZT = 5.0mA ZZK @ IZK = 1.0mA
ΩΩ
83 500
95 500
95 500
95 500
95 500
95 500
78 500
60 480
40 400
10 200
8.0 150
7.0 50
7.0 50
10 50
15 70
20 70
20 90
25 110
30 110
40 170
50 170
50 220
55 220
80 220
80 250
80 250
80 250
90 250
90 300
100 700
100 750
100 750
Notes: 7. Short duration pulse test used to minimize self-heating effect.
Typical
Temperature
Coefficient
TC (%/°C)
-0.065
-0.060
-0.055
-0.055
-0.050
-0.035
-0.015
+0.005
+0.020
+0.030
+0.045
+0.050
+0.055
+0.065
+0.065
+0.070
+0.075
+0.080
+0.080
+0.090
+0.090
+0.090
+0.090
+0.090
+0.090
+0.090
+0.090
+0.090
+0.110
+0.110
+0.110
+0.110
Min.
Reverse
Voltage (Note 7)
@ IR = 0.1µA
VR (V)
0.8
1.0
2.0
3.0
5.0
6.0
7.0
7.5
8.5
9.0
10.0
11.0
12.0
14.0
15.0
17.0
18.0
20.0
22.5
25.0
27.0
29.0
32.0
35.0
38.0
DZ23C2V7 - DZ23C51
Document number: DS18002 Rev. 20 - 2
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DZ23C47 (Diodes)
300mW DUAL SURFACE MOUNT ZENER DIODE

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500
400
300
200
Note 6
100
0
0 40 80 120 160
TA, AMBIEMT TEMPERATURE (°C)
Fig. 1 Power Derating Curve
30 Tj = 25°C C10
C12
200
20 C15
10
Test Current IZ
5mA
C18
C22
C27
C33 C36
0
0 10 20 30 40
VZ, ZENER VOLTAGE (V)
Fig. 3 Typical Zener Breakdown Characteristics
1,000
DZ23C2V7 - DZ23C51
50
40
30
20
10
0
0 1 2 3 4 5 6 7 8 9 10
VZ, ZENER VOLTAGE (V)
Fig. 2 Typical Zener Breakdown Characteristics
10
8
6
4
2
0
0 10 20 30 40 50 60 70 80 90 100
VZ, ZENER VOLTAGE (V)
Fig. 4 Typical Zener Breakdown Characteristics
100
10
1 10 100
VZ, NOMINAL ZENER VOLTAGE (V)
Fig. 5 Typical Total Capacitance vs. Nominal Zener Voltage
DZ23C2V7 - DZ23C51
Document number: DS18002 Rev. 20 - 2
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DZ23C47 (Diodes)
300mW DUAL SURFACE MOUNT ZENER DIODE

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DZ23C2V7 - DZ23C51
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
A
BC
K
JF
H
D
G
K1
L
M
SOT23
Dim Min Max Typ
A 0.37 0.51 0.40
B 1.20 1.40 1.30
C 2.30 2.50 2.40
D 0.89 1.03 0.915
F 0.45 0.60 0.535
G 1.78 2.05 1.83
H 2.80 3.00 2.90
J 0.013 0.10 0.05
K 0.903 1.10 1.00
K1
0.400
L 0.45 0.61 0.55
M 0.085 0.18 0.11
 0° 8°
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
Y
Z
C
XE
Dimensions
Z
X
Y
C
E
Value (in mm)
2.9
0.8
0.9
2.0
1.35
DZ23C2V7 - DZ23C51
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DZ23C47 (Diodes)
300mW DUAL SURFACE MOUNT ZENER DIODE

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DZ23C2V7 - DZ23C51
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
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