XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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XCL210 Series
ETR28009-001a
50mA/200mA Inductor Built-in Step-Down “micro DC/DC” Converters
GreenOperationCompatible
GENERAL DESCRIPTION
The XCL210 series is a synchronous step-down micro DC/DC converter which integrates an inductor and a control IC in one
tiny package (2.0mm×2.5mm, h=1.0mm). An internal coil simplifies the circuit and enables minimization of noise and other
operational trouble due to the circuit wiring. A wide operating voltage range of 2.0V to 6.0V enables support for applications
that require an internally fixed output voltage from 1.0V to 4.0V in increments of 0.05V.
During stand-by, all circuits are shutdown to reduce currentconsumption to as low as 0.1μA or less.
With the built-in UVLO (Under Voltage Lock Out) function, the internal P-channel MOS driver transistor is forced OFF when
input voltage becomes UVLO ditect Voltage or lower.
The XCL210 integrate CL discharge function which enables the electric charge at the output capacitor CL to be discharged via
the internal discharge switch located between the LX and VSS pins. When the devices enter stand-by mode, output voltage
quickly returns to the VSS level as a result of this function.
APPLICATIONS
Wearable Devices
Smart meters
Bluetooth units
Energy Harvest devices
Back up power supply circuits
Portable game consoles
Devices with 1 Lithium cell
FEATURES
Input Voltage
: 2.0V6.0V
Output Voltage
: 1.0V4.0V (±2.0%, 0.05V step increments)
Control Methods
: PFM control
Output Current
: 200mA(XCL210A/XCL210C)
50mA(XCL210B/XCL210D)
Supply Current
: 0.5μA
High Efficiency
Function
: 93% (VIN=3.6V,VOUT=3.0V/100μA)
: UVLO
Short Circuit Protection
Capacitor
CL Discharge
: Low ESR Ceramic Capacitor
Operating Ambient Temperature : -40℃~+85
Packages
: CL-2025-02
Environmentally Friendly
: EU RoHS Compliant, Pb Free
TYPICAL APPLICATION CIRCUIT
TYPICAL PERFORMANCE
CHARACTERISTICS
XCL210B301GR-G(VOUT=3.0V)
50mA
CL
22μF
7
1 Lx
2 GND
VIN 6
NC 5
3 VOUT
8
CE 4
VIN
CIN
10μF
1/24


XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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XCL210 Series
BLOCK DIAGRAM
XCL210 Series, Type A/TypeB
L2
VOUT
CE
VIN
Inductor
Short
Protection
R1
CFB
PFM
Comparator
Current
Sense
R2
Vref
CE Controller Logic
PFM
Controller
VDD
UVLO
VIN Start Up
Controller
VDD
Synch
Buffer
Drive
* XCL210A and B type do not have CL Discharge function.
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
L1
Lx
GND
XCL210 Series, Type C/TypeD
L2
VOUT
CE
VIN
Inductor
R1
CL
Discharge
R2
VDD
CFB
PFM
Comparat
or
Vref
CE Controller Logic
UVLO
VIN Start Up
Controller
Short
Protection
Current
Sense
PFM
Controller
VDD
Synch
Buffer
Drive
L1
Lx
GND
2/24


XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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XCL210
Series
PRODUCT CLASSIFICATION
Ordering information
XCL210①②③④⑤⑥-⑦
DESIGNATOR
ITEM
SYMBOL
A
Product Type
B
C
D
②③
Output Voltage
1040
DESCRIPTION
IOUT=200mA , Without CL Auto Discharge
IOUT=50mA Without CL Auto Discharge
IOUT=200mA , With CL Auto Discharge
IOUT=50mA, With CL Auto Discharge
Output voltage options
e.g.) 1.2V → ② = 1 = 2
1.25V→ ② = 1 = C
0.05V increments :
0.05=A, 0.15=B, 0.25=C, 0.35=D, 0.45=E,
0.55=F, 0.65=H, 0.75=K, 0.85=L, 0.95=M
⑤⑥-⑦(*1)
Fixed number
Package (Order Unit)
1
GR-G
Fixed number
CL-2025-02 (3,000pcs/Reel)
(*1) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
PIN CONFIGURATION
L1
7
VIN 6
1 Lx
NC 5
2 GN D
CE 4
3 VOUT
* The dissipation pad for the CL-2025-02 package should be solder-plated in
recommended mount pattern and metal masking so as to enhance mounting
strength and heat release.
The mount pattern should be connected to GND pin (No.2).
8
L2
(BOTTOM VIEW)
PIN ASSIGNMENT
PIN NUMBER
1
2
3
4
5
6
7
8
PIN NAME
LX
GND
VOUT
CE
NC
VIN
L1
L2
FUNCTIONS
Switching
Ground
Output Voltage
Chip Enable
Ground
Power Input
Inductor Electrodes
Inductor Electrodes
CE PIN FUNCTION
PIN NAME SIGNAL
STATUS
H
CE L
Operation (All Types)
Standby (All Types)
* Please do not leave the CE pin open.
3/24


XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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XCL210 Series
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
RATINGS
VIN Pin Voltage
LX Pin Voltage
VOUT Pin Voltage
CE Pin Voltage
VIN
VLX
VOUT
VCE
-0.3 ~ +7.0
-0.3 ~ VIN+0.3 or +7.0 (*1)
-0.3 ~ VIN+0.3 or +7.0 (*1)
-0.3 ~ +7.0
LX Pin Current
ILX
1000
Power Dissipation
Pd
1000(*2)
Operating Ambient Temperature
Topr
-40 ~ +85
Storage Temperature
Tstg
-55 ~ +125
* All voltages are described based on the GND.
(*1) The maximum value is the lower of either VIN + 0.3 or +7.0.
(*2) The power dissipation figure shown is PCB mounted (40mm×40mm, t=1.6mm, Glass Epoxy FR-4).
Please refer to page 15 for details.
Ta=25˚C
UNITS
V
V
V
V
mA
mW
˚C
˚C
4/24


XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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XCL210
Series
ELECTRICAL CHARACTERISTICS
XCL210Axx1GR-G, without CL discharge function
PARAMETER
SYMBOL
CONDITIONS
MIN.
TYP.
Ta=25˚C
MAX. UNITS CIRCUIT
Input Voltage
VIN -
2.0 - 6.0 V
Output Voltage
VOUT(E) (*2)
Resistor connected with LX pin. Voltage which LX pin
changes “L” to “H” level while VOUT is decreasing.
E1
V
UVLO Release
Voltage
UVLO Hysteresis
Voltage
Supply Current
VUVLO(E)
VHYS(E)
Iq
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
Voltage which LX pin changes “L” to “H” level while
VIN is increasing.
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
VUVLO(E) - Voltage which LX pin changes “H” to “L”
level while VIN is decreasing.
VIN=VCE=VOUT(T)+0.5V (*1), VIN=2.0V, if VOUT(T)1.5V
(*1), VOUT=VOUT(T)+0.5V (*1), LX=Open.
1.65 1.80 1.95
V
0.11 0.15 0.24
V
E2 μA
Standby Current
LX SW “H” Leak
Current
ISTB
ILEAKH
VIN=5.0V, VCE=VOUT=0V, LX=Open.
VIN=5.0V, VCE=VOUT=0V, VLX=0V.
-
0.1 1.0
μA
-
0.1 1.0
μA
LX SW “L” Leak
Current
ILEAKL
VIN=5.0V, VCE=VOUT=0V, VLX=5.0V.
-
0.1 1.0
μA
PFM Switching
Current
IPFM
VIN=VCE=VOUT(T)+2.0V (*1), IOUT=10mA.
260 330 400
mA
Maximum
Duty Ratio (*3)
Efficiency (*4)
Efficiency (*4)
Efficiency (*4)
LX SW “Pch”
ON Resistance (*5)
MAXDTY
EFFI
EFFI
EFFI
RLXP
VIN=VOUT=VOUT()×0.95V(*1), VCE=1.2V
Resistor connected with LX pin.
VIN=VCE=5.0V, VOUT(T)=4.0V (*1), IOUT=30mA.
VIN=VCE=3.6V, VOUT(T)=3.3V (*1), IOUT=30mA.
VIN=VCE=3.6V, VOUT(T)=1.8V (*1), IOUT=30mA.
VIN=VCE=5.0V, VOUT=0V, ILX=100mA.
100 -
-
- 93 -
- 93 -
- 87 -
- 0.4 0.65
%
%
%
%
LX SW “Nch”
ON Resistance
RLXN
VIN=VCE=5.0V.
- 0.4 (*6) -
Output Voltage
Temperature
Characteristics
VOUT/
(VOUTTopr)
-40℃≦Topr85.
- ±100
- ppm/
CE “High” Voltage
CE “Low” Voltage
VOUT=0V. Resistor connected with LX pin.
VCEH Voltage which LX pin changes “L” to “H” level while 1.2 - 6.0 V
VCE=0.21.5V.
VOUT=0V. Resistor connected with LX pin.
VCEL
Voltage which LX pin changes “H” to “L” level while
GND
-
0.3
V
VCE=1.50.2V.
CE “High” Current
ICEH VIN=VCE=5.0V, VOUT=0V, LX=Open.
-0.1 - 0.1 μA
CE “Low” Current
ICEL VIN=5.0V, VCE=VOUT=0V, LX=Open.
-0.1 - 0.1 μA
Short Protection
Threshold Voltage
Inductance Value
VSHORT
L
Resistor connected with LX pin.
Voltage which LX pin changes “H” to “L” level while
VOUT= VOUT(T)+0.1V0V(*1).
Test Frequency=1MHz
0.4 0.5 0.6
- 8.0 -
V
μH
(Coil) Rated Current
IDC_L
T=+40
- 600 -
mA
Unless otherwise stated, VIN=VCE=5.0V
(*1) VOUT(T)=Nominal Output Voltage
(*2) VOUT(E)=Effective Output Voltage
The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC.
Therefore, the DC/DC circuit output voltage, including the peripheral components, is boosted by the ripple voltage average value.
Please refer to the characteristic example.
(*3) Not applicable to the products with VOUT(T) < 2.15V since it is out of operational volatge range.
(*4) EFFI=[{ (Output Voltage)×(Output Current)] / [(Input Voltage)×(Input Current)}]×100
(*5) LX SW “Pch” ON resistance = (VIN – VLX pin measurement voltage) / 100mA
(*6) Designed value
-
5/24


XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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XCL210 Series
ELECTRICAL CHARACTERISTICS (Continued)
XCL210Bxx1GR-G, without CL discharge function
PARAMETER
SYMBOL
CONDITIONS
MIN. TYP. MAX. UNITS
Input Voltage
VIN -
2.0 - 6.0 V
Output Voltage
VOUT(E) (*2)
Resistor connected with LX pin.Voltage which LX pin
changes “L” to “H” level while VOUT is decreasing.
E1
V
UVLO Release
Voltage
UVLO Hysteresis
Voltage
Supply Current
VUVLO(E)
VHYS(E)
Iq
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
Voltage which LX pin changes “L” to “H” level while
VIN is increasing.
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
VUVLO(E) - Voltage which LX pin changes “H” to “L”
level while VIN is decreasing.
VIN=VCE=VOUT(T)+0.5V (*1),VIN=2.0V, if VOUT(T)1.5V
(*1), VOUT=VOUT(T)+0.5V (*1), LX=Open.
1.65 1.80 1.95
V
0.11 0.15 0.24
V
E2 μA
Standby Current
LX SW “H” Leak
Current
ISTB
ILEAKH
VIN=5.0V, VCE=VOUT=0V, LX=Open.
VIN=5.0V, VCE=VOUT=0V, VLX=0V.
-
0.1 1.0
μA
-
0.1 1.0
μA
LX SW “L” Leak
Current
ILEAKL
VIN=5.0V, VCE=VOUT=0V, VLX=5.0V.
-
0.1 1.0
μA
PFM Switching
Current
IPFM
VIN=VCE=VOUT(T)+2.0V (*1), IOUT=10mA.
115 180 250
mA
Maximum
Duty Ratio (*3)
Efficiency (*4)
Efficiency (*4)
Efficiency (*4)
LX SW “Pch”
ON Resistance (*5)
MAXDTY
EFFI
EFFI
EFFI
RLXP
VIN=VOUT=VOUT()×0.95V(*1), VCE=1.2V
Resistor connected with LX pin.
VIN=VCE=5.0V,VOUT(T)=4.0V (*1), IOUT=30mA.
VIN=VCE=3.6V, VOUT(T)=3.3V (*1), IOUT=30mA.
VIN=VCE=3.6V, VOUT(T)=1.8V (*1), IOUT=30mA.
VIN=VCE=5.0V, VOUT=0V, ILX=100mA.
100 -
-
- 95 -
- 95 -
- 89 -
- 0.4 0.65
%
%
%
%
LX SW “Nch”
ON Resistance
RLXN
VIN=VCE=5.0V.
- 0.4 (*6) -
Output Voltage
Temperature
Characteristics
VOUT/
(VOUTTopr)
-40℃≦Topr85.
- ±100 - ppm/
CE “High” Voltage
CE “Low” Voltage
VOUT=0V. Resistor connected with LX pin.
VCEH Voltage which LX pin changes “L” to “H” level while 1.2 - 6.0 V
VCE=0.21.5V.
VOUT=0V. Resistor connected with LX pin.
VCEL
Voltage which LX pin changes “H” to “L” level while
GND
-
0.3
V
VCE=1.50.2V.
CE “High” Current
ICEH VIN=VCE=5.0V, VOUT=0V, LX=Open.
-0.1 - 0.1 μA
CE “Low” Current
ICEL VIN=5.0V, VCE=VOUT=0V, LX=Open.
-0.1 - 0.1 μA
Short Protection
Threshold Voltage
Inductance Value
VSHORT
L
Resistor connected with LX pin.
Voltage which LX pin changes “H” to “L” level while
VOUT=VOUT(T)+0.1V0V(*1).
Test Frequency=1MHz
0.4 0.5 0.6
- 8.0 -
V
μH
(Coil) Rated Current
IDC_L
T=+40
- 600 -
mA
Unless otherwise stated, VIN=VCE=5.0V
(*1) VOUT(T)=Nominal Output Voltage
(*2) VOUT(E)=Effective Output Voltage
The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC.
Therefore, the DC/DC circuit output voltage, including the peripheral components, is boosted by the ripple voltage average value.
Please refer to the characteristic example.
(*3) Not applicable to the products with VOUT(T) < 2.15V since it is out of operational volatge range.
(*4) EFFI=[{ (Output Voltage)×(Output Current)] / [(Input Voltage)×(Input Current)}]×100
(*5) LX SW “Pch” ON resistance = (VIN – VLX pin measurement voltage) / 100mA
(*6) Designed value
TTaa==2255˚C˚C
CIRCUIT
-
6/24


XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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XCL210
Series
ELECTRICAL CHARACTERISTICS (Continued)
XCL210Cxx1GR-G, with CL Discharge Function
PARAMETER
SYMBOL
CONDITIONS
MIN.
TYP.
Ta=25˚C
MAX. UNITS CIRCUIT
Input Voltage
VIN -
2.0 - 6.0 V
Output Voltage
V (*2)
OUT(E)
Resistor connected with LX pin. Voltage which LX pin
changes “L” to “H” level while VOUT is decreasing.
E1
V
UVLO Release
Voltage
UVLO Hysteresis
Voltage
Supply Current
VUVLO(E)
VHYS(E)
Iq
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
Voltage which LX pin changes “L” to “H” level while
VIN is increasing.
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
VUVLO(E) - Voltage which LX pin changes “H” to “L”
level while VIN is decreasing.
VIN=VCE=VOUT(T)+0.5V (*1),VIN=2.0V, if VOUT(T)1.5V
(*1),
1.65 1.80 1.95
V
0.11 0.15 0.24
V
E2 μA
VOUT=VOUT(T)+0.5V (*1), LX=Open.
Standby Current
ISTB VIN=5.0V, VCE=VOUT=0V, LX=Open.
-
0.1 1.0
μA
LX SW “H” Leak
Current
ILEAKH
VIN=5.0V, VCE=VOUT=0V, VLX=0V.
-
0.1 1.0
μA
LX SW “L” Leak
Current
ILEAKL
VIN=5.0V, VCE=VOUT=0V, VLX=5.0V.
-
0.1 1.0
μA
PFM Switching
Current
IPFM
VIN=VCE=VOUT(T)+2.0V (*1), IOUT=10mA.
260 330 400
mA
Maximum
Duty Ratio (*3)
Efficiency (*4)
Efficiency (*4)
Efficiency (*4)
MAXDTY
EFFI
EFFI
EFFI
VIN=VOUT=VOUT()×0.95V(*1), VCE=1.2V
Resistor connected with LX pin.
VIN=VCE=5.0V, VOUT(T)=4.0V (*1), IOUT=30mA.
VIN=VCE=3.6V, VOUT(T)=3.3V (*1), IOUT=30mA.
VIN=VCE=3.6V, VOUT(T)=1.8V (*1), IOUT=30mA.
100 -
- 93
- 93
- 87
-
-
-
-
%
%
%
%
LX SW “Pch”
ON Resistance (*5)
RLXP
VIN=VCE=5.0V, VOUT=0V, ILX=100mA.
-
0.4 0.65
LX SW “Nch”
ON Resistance
RLXN
VIN=VCE=5.0V.
- 0.4 (*6) -
Output Voltage
Temperature
Characteristics
VOUT/
(VOUTTopr)
-40℃≦Topr85.
- ±100 - ppm/
CE “High” Voltage
VOUT=0V. Resistor connected with LX pin.
VCEH Voltage which LX pin changes “L” to “H” level while 1.2 - 6.0 V
VCE=0.21.5V.
CE “Low” Voltage
VOUT=0V. Resistor connected with LX pin.
VCEL
Voltage which LX pin changes “H” to “L” level while
GND
-
0.3
V
VCE=1.50.2V.
CE “High” Current
ICEH VIN=VCE=5.0V, VOUT=0V, LX=Open.
-0.1 - 0.1 μA
CE “Low” Current
ICEL VIN=5.0V, VCE=VOUT=0V, LX=Open.
-0.1 - 0.1 μA
Short Protection
Threshold Voltage
CL Discharge
VSHORT
RDCHG
Resistor connected with LX pin.
Voltage which LX pin changes “H” to “L” level while
VOUT= VOUT(T)+0.1V0V(*1).
VIN=VOUT=5.0V, VCE=0V, LX=Open.
0.4 0.5 0.6
55 80 105
V
Inductance Value
L Test Frequency=1MHz
- 8.0 -
μH
(Coil) Rated Current
IDC_L
T=+40
- 600 -
mA
Unless otherwise stated, VIN=VCE=5.0V
(*1) VOUT(T)=Nominal Output Voltage
(*2) VOUT(E)=Effective Output Voltage
The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC.
Therefore, the DC/DC circuit output voltage, including the peripheral components, is boosted by the ripple voltage average value.
Please refer to the characteristic example.
(*3) Not applicable to the products with VOUT(T) < 2.15V since it is out of operational volatge range.
(*4) EFFI=[{ (Output Voltage)×(Output Current)] / [(Input Voltage)×(Input Current)}]×100
(*5) LX SW “Pch” ON resistance = (VIN – VLX pin measurement voltage) / 100mA
(*6) Designed value
-
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XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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XCL210 Series
ELECTRICAL CHARACTERISTICS (Continued)
XCL210Dxx1GR-G, with CL Discharge Function
PARAMETER
SYMBOL
CONDITIONS
MIN.
TYP.
MAX.
Ta=25˚C
UNITS CIRCUIT
Input Voltage
Output Voltage
VIN
V (*2)
OUT(E)
-
Resistor connected with LX pin. Voltage which LX
pin changes “L” to “H” level while VOUT is
decreasing.
2.0 -
E1
6.0
V
V
UVLO Release
Voltage
UVLO Hysteresis
Voltage
Supply Current
Standby Current
LX SW “H” Leak
Current
VUVLO(E)
VHYS(E)
Iq
ISTB
ILEAKH
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
Voltage which LX pin changes “L” to “H” level
while VIN is increasing.
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
VUVLO(E) - Voltage which LX pin changes “H” to “L”
level while VIN is decreasing.
VIN=VCE=VOUT(T)+0.5V (*1),
VIN=2.0V, if VOUT(T)1.5V (*1),
VOUT=VOUT(T)+0.5V (*1), LX=Open.
VIN=5.0V, VCE=VOUT=0V, LX=Open.
VIN=5.0V, VCE=VOUT=0V, VLX=0V.
1.65
0.11
-
-
1.80
0.15
E2
0.1
0.1
1.95
0.24
1.0
1.0
V
V
μA
μA
μA
LX SW “L” Leak
Current
ILEAKL
VIN=5.0V, VCE=VOUT=0V, VLX=5.0V.
- 0.1 1.0 μA
PFM Switching Current
Maximum
Duty Ratio (*3)
Efficiency (*4)
Efficiency (*4)
Efficiency (*4)
LX SW “Pch”
ON Resistance (*5)
IPFM
MAXDTY
EFFI
EFFI
EFFI
RLXP
VIN=VCE=VOUT(T)+2.0V (*1), IOUT=10mA.
VIN=VOUT=VOUT()×0.95V(*1), VCE=1.2V
Resistor connected with LX pin.
VIN=VCE=5.0V,VOUT(T)=4.0V (*1), IOUT=30mA.
VIN=VCE=3.6V, VOUT(T)=3.3V (*1), IOUT=30mA.
VIN=VCE=3.6V, VOUT(T)=1.8V (*1), IOUT=30mA.
VIN=VCE=5.0V, VOUT=0V, ILX=100mA.
115 180 250 mA
100 -
-%
- 95 - %
- 95 - %
- 89 - %
-
0.4 0.65
LX SW “Nch”
ON Resistance
RLXN
VIN=VCE=5.0V.
- 0.4 (*6) -
Output Voltage
Temperature
Characteristics
VOUT/
-40℃≦Topr85.
(VOUTTopr)
- ±100 - ppm/
CE “High” Voltage
CE “Low” Voltage
CE “High” Current
CE “Low” Current
Short Protection
Threshold Voltage
CL Discharge
Inductance Value
VOUT=0V. Resistor connected with LX pin.
VCEH
Voltage which LX pin changes “L” to “H” level while
1.2
-
6.0
V
VCE=0.21.5V.
VOUT=0V. Resistor connected with LX pin.
VCEL Voltage which LX pin changes “H” to “L” level while GND
-
0.3
V
VCE=1.50.2V.
ICEH VIN=VCE=5.0V, VOUT=0V, LX=Open.
-0.1 - 0.1 μA
ICEL VIN=5.0V, VCE=VOUT=0V, LX=Open.
-0.1 - 0.1 μA
Resistor connected with LX pin.
VSHORT
Voltage which LX pin changes “H” to “L” level while
0.4
0.5
0.6
V
VOUT= VOUT(T)+0.1V0V(*1).
RDCHG
VIN=VOUT=5.0V, VCE=0V, LX=Open.
55 80 105
L Test Frequency=1MHz
- 8.0 - μH
Rated Current
IDC T=+40
- 600 - mA
Unless otherwise stated, VIN=VCE=5.0V
(*1) VOUT(T)=Nominal Output Voltage
(*2) VOUT(E)=Effective Output Voltage
The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC.
Therefore, the DC/DC circuit output voltage, including the peripheral components, is boosted by the ripple voltage average value.
Please refer to the characteristic example.
(*3) Not applicable to the products with VOUT(T) < 2.15V since it is out of operational volatge range.
(*4) EFFI=[{ (Output Voltage)×(Output Current)] / [(Input Voltage)×(Input Current)}]×100
(*5) LX SW “Pch” ON resistance = (VIN – VLX pin measurement voltage) / 100mA
(*6) Designed value
8/24
-


XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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ELECTRICAL CHARACTERISTICS (Continued)
XCL210 Series voltage chart
SYMBOL
E1
E2 SYMBOL
E1
PARAMETER OUTPUT VOLTAGE
SUPPLY CURRENT PARAMETER OUTPUT VOLTAGE
UNITS: V
OUTPUT
VOLTAGE
1.00
1.05
1.10
1.15
1.20
1.25
1.30
1.35
1.40
1.45
1.50
1.55
1.60
1.65
1.70
1.75
1.80
1.85
1.90
1.95
2.00
2.05
2.10
2.15
2.20
2.25
2.30
2.35
2.40
2.45
2.50
2.55
2.60
2.65
2.70
2.75
2.80
2.85
2.90
2.95
UNITS: V
MIN.
MAX.
0.980
1.029
1.078
1.127
1.176
1.225
1.274
1.323
1.372
1.421
1.470
1.519
1.568
1.617
1.666
1.715
1.764
1.813
1.862
1.911
1.960
2.009
2.058
2.107
2.156
2.205
2.254
2.303
2.352
2.401
2.450
2.499
2.548
2.597
2.646
2.695
2.744
2.793
2.842
2.891
1.020
1.071
1.122
1.173
1.224
1.275
1.326
1.377
1.428
1.479
1.530
1.581
1.632
1.683
1.734
1.785
1.836
1.887
1.938
1.989
2.040
2.091
2.142
2.193
2.244
2.295
2.346
2.397
2.448
2.499
2.550
2.601
2.652
2.703
2.754
2.805
2.856
2.907
2.958
3.009
UNITS: μA
TYP.
MAX.
0.500
0.800
0.500
0.900
0.600
1.100
0.700
1.500
UNITS: V
OUTPUT
VOLTAGE
3.00
3.05
3.10
3.15
3.20
3.25
3.30
3.35
3.40
3.45
3.50
3.55
3.60
3.65
3.70
3.75
3.80
3.85
3.90
3.95
4.00
UNITS: V
MIN.
MAX.
2.940
2.989
3.038
3.087
3.136
3.185
3.234
3.283
3.332
3.381
3.430
3.479
3.528
3.577
3.626
3.675
3.724
3.773
3.822
3.871
3.920
3.060
3.111
3.162
3.213
3.264
3.315
3.366
3.417
3.468
3.519
3.570
3.621
3.672
3.723
3.774
3.825
3.876
3.927
3.978
4.029
4.080
XCL210
Series
E2
SUPPLY CURRENT
UNITS: μA
TYP.
MAX.
0.800
2.100
1.500
3.000
9/24


XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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XCL210 Series
TEST CIRCUITS
< Circuit No.>
Wave Form Measure Point
L
CL
RL V
L2
VOUT
CE
L1
Lx
VIN
GND
A
CIN
< Circuit No.>
L2
VOUT
CE
Wave Form Measure Point
L1
Lx
VIN
GND
V
CIN
RPu lld own
External Components
 L10μH(Selected goods)
 CIN10μF(Ceramic)
  CL:22μF(Ceramic)
< Circuit No.>
L2 L1
VOUT
Lx
A
CE
VIN
GND
A
CIN
A
External Components
 CIN10μF(Ceramic)
  RPULLDOWN:100Ω
< Circuit No.>
L2
VOUT
CE
L1
Lx
VIN
GND
V
CIN
ILX
External Components
 CIN10μF(Ceramic)
< Circuit No.>
L2
VOUT
ICEH
A
ICEL
CE
External Components
 CIN10μF(Ceramic)
  RPULLDOWN:100Ω
Wave Form Measure Point
L1
Lx
VIN
GND
CIN
RPulldown
External Components
 CIN10μF(Ceramic)
< Circuit No.>
RL V CL
A
L2
VOUT
CE
External Components
 CIN10μF(Ceramic)
  CL22μF(Ceramic)
L1
Lx
VIN
GND
A
CIN
10/24


XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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TYPICAL APPLICATION CIRCUIT
XCL210
Series
VOUT CL
7
1 Lx
2 GND
VIN 6
NC 5
3 VOUT
8
CE 4
VIN
CIN
NOTE:
The integrated Inductor can be used only for this
DC/DC converter. Please do not use this inductor
for other reasons.
Manufacturer
Part Number
VALUE
LMK107BBJ106MALT
Taiyo Yuden
LMK212ABJ106MG
CIN C1608X5R1A106M
TDK
C2012X5R1A106M
10μF/10V
10μF/10V
10μF/10V
10μF/10V
LMK107BBJ226MA
Taiyo Yuden
LMK212BBJ226MG
CL
C1608X5R1A226M
TDK C2012X5R1A226M
22μF/10V
22μF/10V
22μF/10V
22μF/10V
* Take capacitance loss, withstand voltage, and other conditions into consideration when selecting components.
11/24


XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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XCL210 Series
OPERATIONAL EXPLANATION
The XCL210 series consists of a reference voltage supply, PFM comparator, Pch driver Tr, Nch synchronous rectification switch Tr, current sensing
circuit, PFM control circuit, CE control circuit, and others. (Refer to the block diagram below.)
L2
VOUT
CE
VIN
Inductor
Short
Protection
R1
CFB
PFM
Comparator
Current
Sense
R2
Vref
CE Controller Logic
PFM
Controller
VDD
UVLO
VIN Start Up
Controller
VDD
Synch
Buffer
Drive
L1 L2
VOUT
Lx
CE
GND
VIN
Inductor
R1
CL
Discharge
R2
VDD
CFB
PFM
Comparator
Vref
CE Controller Logic
UVLO
VIN Start Up
Controller
Short
Protection
Current
Sense
PFM
Controller
VDD
Synch
Buffer
Drive
L1
Lx
GND
<BLOCK DIAGRAM TYPE A/B>
<BLOCK DIAGRAM TYPE C/D >
An ultra-low quiescent current circuit and synchronous rectification enable a significant reduction of dissipation in the IC, and the IC operates with
high efficiency at both light loads and heavy loads. Current limit PFM is used for the control method, and even when switching current superposition
occurs, increases of output voltage ripple are suppressed, allowing use over a wide voltage and current range. The IC is compatible with low-
capacitance ceramic capacitors, and a small, high-performance step-down DC-DC converter can be created.
The actual output voltage VOUT(E) in the electrical characteristics is the threshold voltage of the PFM comparator in the block diagram. Therefore
the average output voltage of the step-down circuit, including peripheral components, depends on the ripple voltage. Before use, test fully using
the actual device.
VIN=VCE=3.6VVOUT=1.8VIOUT=5mAL=8.0μHCL=22uFTa=25VIN=VCE=3.6VVOUT=1.8VIOUT=30mAL=8.0μHCL=22uFTa=25
VLX
VOUT
VOUT(E)
Voltage
ILX
IPFM
VLX
VOUT
ILX
VLX : 2[V/div]
VOUT : 50[mV/div]
ILX : 100[mA/div]
10[μs/div]
10[μs/div]
<Reference voltage supply (VREF)>
Reference voltage for stabilization of the output voltage of the IC.
<PFM control>
(1) The feedback voltage (FB voltage) is the voltage that results from dividing the output voltage with the IC internal dividing resistors RFB1 and
RFB2. The PFM comparator compares this FB voltage to VREF. When the FB voltage is lower than VREF, the PFM comparator sends a signal to the
buffer driver through the PFM control circuit to turn on the Pch driver Tr. When the FB voltage is higher than VREF, the PFM comparator sends a
signal to prevent the Pch driver Tr from turning on.
(2) When the Pch driver Tr is on, the current sense circuit monitors the current that flows through the Pch driver Tr connected to the Lx pin. When the
current reaches the set PFM switching current (IPFM), the current sense circuit sends a signal to the buffer driver through the PFM control circuit. This
signal turns off the Pch driver Tr and turns on the Nch synchronous rectification switch Tr.
(3) The on time (off time) of the Nch synchronous rectification switch Tr is dynamically optimized inside the IC. After the off time elapses and the
PFM comparator detects that the VOUT voltage is higher than the set voltage, the PFM comparator sends a signal to the PFM control circuit that
prevents the Pch driver Tr from turning on. However, if the VOUT voltage is lower than the set voltage, the PFM comparator starts Pch driver Tr on.
12/24


XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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XCL210
Series
OPERATIONAL EXPLANATION (Continued)
By continuously adjusting the interval of the linked operation of (1), (2) and (3) above in response to the load current, the output voltage is stabilized
with high efficiency from light loads to heavy loads.
<PFM Switching Current >
The PFM switching current monitors the current that flows through the Pch driver Tr, and is a value that limits the Pch driver Tr current.
The Pch driver Tr remains on until the coil current reaches the PFM switching current (IPFM). An approximate value for this on-time tON can be
calculated using the following equation:
tON = L × IPFM / (VIN – VOUT)
<Maximum on-time function>
To avoid excessive ripple voltage in the event that the coil current does not reach the PFM switching current within a certain interval even though
the Pch driver Tr has turned on and the FB voltage is above VREF, the Pch driver Tr can be turned off at any timing using the maximum on-time
function of the PFM control circuit. If the Pch driver Tr turns off by the maximum on-time function instead of the current sense circuit, the Nch
synchronous rectification switch Tr will not turn on and the coil current will flow to the VOUT pin by means of the parasite diode of the Nch
synchronous rectification switch Tr.
<Through mode>
When the VIN voltage is lower than the output voltage, through mode automatically activates and the Pch driver Tr stays on continuously.
(1) In through mode, when the load current is increased and the current that flows through the Pch driver Tr reaches a load current that is several tens
of mA lower than the set PFM switching current (IPFM), the current sense circuit sends a signal through the PFM control circuit to the buffer driver. This
signal turns off the Pch driver Tr and turns on the Nch synchronous rectification switch Tr.
(2) After the on-time (off-time) of the Nch synchronous rectification switch Tr, the Pch driver Tr turns on until the current reaches the set PFM
switching current (IPFM) again.
If the load current is large as described above, operations (1) and (2) above are repeated. If the load current is several tens of mA lower than the
PFM switching current (IPFM), the Pch driver Tr stays on continuously.
<VIN start mode>
When the VIN voltage rises, VIN start mode stops the short-circuit protection function during the interval until the FB voltage approaches VREF. After
the VIN voltage rises and the FB voltage approaches VREF by step-down operation, VIN start mode is released. In order to prevent an excessive
rush current while VIN start mode is activated, the coil current flows to the VOUT pin by means of the parasitic diode of the Nch synchronous
rectification Tr. In VIN start mode as well, the coil current is limited by the PFM switching current.
<Short-circuit protection function>
The short-circuit protection function monitors the VOUT voltage. In the event that the VOUT pin is accidentally shorted to GND or an excessive load
current causes the VOUT voltage to drop below the set short-circuit protection voltage, the short-circuit protection function activates, and turns off
and latches the Pch driver Tr at any selected timing. Once in the latched state, the IC is turned off and then restarted from the CE pin, or operation
is started by re-applying the VIN voltage.
<UVLO function>
When the VIN pin voltage drops below the UVLO detection voltage, the IC stops switching operation at any selected timing, turns off the Pch driver
Tr and Nch synchronous rectification switch Tr (UVLO mode). When the VIN pin voltage recovers and rises above the UVLO release voltage, the
IC restarts operation.
<CL discharge function>
On the XCL210 series, a CL discharge function is available as an option (XCL210C/XCL210D types). This function enables quick discharging of
the CL load capacitance when Lvoltage is input into the CE pin by the Nch Tr connected between the VOUT-GND pins, or in UVLO mode. This
prevents malfunctioning of the application in the event that a charge remains on CL when the IC is stopped. The discharge time is determined by
CL and the CL discharge resistance RDCHG, including the Nch Tr (refer to the diagram below). Using this time constant τ= CL×RDCHG, the discharge
time of the output voltage is calculated by means of the equation below.
V = VOUT × e - t /τ, or in terms of t, t = τIn(VOUT / V)
V: Output voltage after discharge
VOUT : Set output voltage
: Discharge time
CL: Value of load capacitance (CL)
RDCHG : Value of CL discharge resistance Varies by power supply voltage.
τ: CL × RDCHG
The CL discharge function is not available on the XCL210A/XCL210B types.
13/24


XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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XCL210 Series
NOTE ON USE
1. Be careful not to exceed the absolute maximum ratings for externally connected components and this IC.
2. The DC/DC converter characteristics greatly depend not only on the characteristics of this IC but also on those of externally connected
components, so refer to the specifications of each component and be careful when selecting the components. Be especially careful of the
characteristics of the capacitor used for the load capacity CL and use a capacitor with B characteristics (JIS Standard) or an X7R/X5R (EIA
Standard) ceramic capacitor.
3. Use a ground wire of sufficient strength. Ground potential fluctuation caused by the ground current during switching could cause the IC operation
to become unstable, so reinforce the area around the GND pin of the IC in particular.
4. Mount the externally connected components in the vicinity of the IC. Also use short, thick wires to reduce the wire impedance.
5. When the voltage difference between VIN and VOUT is small, switching energy increases and there is a possibility that the ripple voltage will be
too large. Before use, test fully using the actual device.
6. The CE pin does not have an internal pull-up or pull-down, etc. Apply the prescribed voltage to the CE pin.
7. If other than the recommended inductance and capacitance values are used, excessive ripple voltage or a drop in efficiency may result.
8. If other than the recommended inductance and capacitance values are used, a drop in output voltage when the load is excessive may cause
the short-circuit protection function to activate. Before use, test fully using the actual device.
9. At high temperature, excessive ripple voltage may occur and cause a drop in output voltage and efficiency. Before using at high temperature,
test fully using the actual device
10. At light loads or when IC operation is stopped, leakage current from the Pch driver Tr may cause the output voltage to rise.
11. The average output voltage may vary due to the effects of output voltage ripple caused by the load current. Before use, test fully using the
actual device.
12. If the CL capacitance or load current is large, the output voltage rise time will lengthen when the IC is started, and coil current overlay may
occur during the interval until the output voltage reaches the set voltage (refer to the diagram below).
XCL210A SeriesVIN=VCE=06.0VVOUT=1.0VIOUT=200ACL=22uFTa=25
13. When the IC is started, the short-circuit protection function does not operate during the interval until the VOUT voltage reaches a value near the
set voltage.
14. If the IC is started at a VIN voltage that activates through mode, it is possible that the short-circuit protection function will not operate. Before
use, test fully using the actual device.
15. If the load current is excessively large when the IC is started, it is possible that the VOUT voltage will not rise to the set voltage. Before use, test
fully using the actual device.
14/24


XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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XCL210
Series
NOTE ON USE (Continued)
16. In actual operation, the maximum on-time depends on the peripheral components, input voltage, and load current. Before use, test fully using
the actual device.
17. When the VIN voltage is turned on and off continuously, excessive rush current may occur while the voltage is on. Before use, test fully using
the actual device.
18. When the VIN voltage is high, the Pch driver may change from on to off before the coil current reaches the PFM switching current (IPFM), or
before the maximum on-time elapses. Before use, test fully using the actual device.
19. When the IC change to the Through Mode at light load, the supply current of this IC can increase in some cases.
20. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded.
21. Torex places an importance on improving our products and their reliability.
We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems.
22. The UVLO function can be activated when the UVLO hysteresis width gets to about 0mV and after several tens ms elapses at light loads.
Before use, test fully using the actual device.
23. Please use within the power dissipation range below. Please also note that the power dissipation may changed by test conditions, the
power dissipation figure shown is PCB mounted.
Pd vs Operating Temperature
Pakage Body Temperature vs Operating Temperature
the power loss of micro DC/DC according to the following formula:
power loss = VOUT×IOUT×((100/EFFI) – 1) (W)
VOUT : Output Voltage (V)
IOUT : Output Current (A)
EFFI : Conversion Efficiency (%)
Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (unit: mm)
15/24


XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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XCL210 Series
NOTE ON USE (Continued)
Instructions of pattern layouts
1. To suppress fluctuations in the VIN potential, connect a bypass capacitor (CIN) in the shortest path between the VIN pin and ground pin.
2. Please mount each external component as close to the IC as possible.
3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance.
4. Make sure that the ground traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of
switching may result in instability of the IC.
5. Internal driver transistors bring on heat because of the transistor current and ON resistance of the driver transistors.
Recommended Pattern Layout
Top view
Back side top view
16/24


XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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XCL210
Series
TYPICAL PERFORMANCE CHARACTERISTICS
1) Output Voltage vs. Output Current
XCL210A121GR-G/XCL210C121GR-G
1.5
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF×2
1.4 Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
1.3
XCL210B121GR-G/XCL210D121GR-G
1.5
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF×2
1.4 Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
1.3
1.2 1.2
1.1 1.1
1.0 1.0
0.9
0.01
0.1 1 10
Output Current: IOUT [mA]
100
0.9
0.01
0.1 1 10
Output Current: IOUT [mA]
100
XCL210A181GR-G/XCL210C181GR-G
2.1
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF×2
2.0 Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
1.9
1.8
1.7
1.6
1.5
0.01
0.1 1 10
Output Current: IOUT [mA]
100
XCL210B181GR-G/XCL210D181GR-G
2.1
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF×2
2.0 Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
1.9
1.8
1.7
1.6
1.5
0.01
0.1 1 10
Output Current: IOUT [mA]
100
XCL210A331GR-G/XCL210C331GR-G
3.6
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
3.5 Vin=5.0V,CL=22uF
Vin=5.0V,CL=22uF×2
3.4
3.3
3.2
3.1
3.0
0.01
0.1 1 10
Output Current: IOUT [mA]
100
XCL210B331GR-G/XCL210D331GR-G
3.6
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
3.5 Vin=5.0V,CL=22uF
Vin=5.0V,CL=22uF×2
3.4
3.3
3.2
3.1
3.0
0.01
0.1 1
10
Output Current: IOUT [mA]
100
17/24


XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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XCL210 Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
2) Efficiency vs. Output Current
XCL210A121GR-G/XCL210C121GR-G
100
XCL210B121GR-G/XCL210D121GR-G
100
80 80
60 60
40 40
20
0
0.01
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF×2
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
0.1 1 10
Output Current: IOUT [mA]
100
20
0
0.01
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF×2
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
0.1 1 10
Output Current: IOUT [mA]
100
XCL210A181GR-G/XCL210C181GR-G
100
XCL210B181GR-G/XCL210D181GR-G
100
80 80
60 60
40 40
20
0
0.01
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF×2
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
0.1 1 10
Output Current: IOUT [mA]
100
20
0
0.01
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF×2
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
0.1 1 10
Output Current: IOUT [mA]
100
XCL210A331GR-G/XCL210C331GR-G
100
XCL210B331GR-G/XCL210D331GR-G
100
80 80
60 60
40 40
20
0
0.01
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
Vin=5.0V,CL=22uF
Vin=5.0V,CL=22uF×2
0.1 1 10
Output Current: IOUT [mA]
100
20
0
0.01
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
Vin=5.0V,CL=22uF
Vin=5.0V,CL=22uF×2
0.1 1 10
Output Current: IOUT [mA]
100
18/24


XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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XCL210
Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
3) Ripple Voltage vs. Output Current
XCL210A121GR-G/XCL210C121GR-G
200
150
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF×2
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
XCL210B121GR-G/XCL210D121GR-G
200
150
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF×2
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
100 100
50 50
0
0.01
0.1 1 10
Output Current: IOUT [mA]
100
XCL210A181GR-G/XCL210C181GR-G
200
150
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF×2
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
0
0.01
0.1 1 10
Output Current: IOUT [mA]
100
XCL210B181GR-G/XCL210D181GR-G
200
150
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF×2
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
100 100
50 50
0
0.01
0.1 1 10
Output Current: IOUT [mA]
100
XCL210A331GR-G/XCL210C331GR-G
200
150
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
Vin=5.0V,CL=22uF
Vin=5.0V,CL=22uF×2
0
0.01
0.1 1 10
Output Current: IOUT [mA]
100
XCL210B331GR-G/XCL210D331GR-G
200
150
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
Vin=5.0V,CL=22uF
Vin=5.0V,CL=22uF×2
100 100
50 50
0
0.01
0.1 1 10
Output Current: IOUT [mA]
100
0
0.01
0.1 1 10
Output Current: IOUT [mA]
100
19/24


XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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XCL210 Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
4) Ambient Temperature vs. Output Voltage
XCL210A121GR-G/XCL210C121GR-G
1.4
VIN=3.6V
XCL210B121GR-G/XCL210D121GR-G
1.4
VIN=3.6V
1.3 1.3
1.2 1.2
1.1
1.0
-40 -20
IOUT=0.1mA
IOUT=1mA
IOUT=10mA
IOUT=100mA
0 20 40 60 80
Ambient Temperature : Ta []
100
XCL210A181GR-G/XCL210C181GR-G
2.0
VIN=3.6V
1.9
1.1
1.0
-40 -20
IOUT=0.1mA
IOUT=1mA
IOUT=10mA
0 20 40 60 80
Ambient Temperature : Ta []
100
XCL210B181GR-G/XCL210D181GR-G
2.0
VIN=3.6
1.9
1.8 1.8
1.7
1.6
-40 -20
IOUT=0.1mA
IOUT=1mA
IOUT=10mA
IOUT=100mA
0 20 40 60 80
Ambient Temperature : Ta []
100
XCL210A331GR-G/XCL210C331GR-G
3.5
VIN=5.0V
3.4
1.7
1.6
-40 -20
IOUT=0.1mA
IOUT=1mA
IOUT=10mA
0 20 40 60 80
Ambient Temperature : Ta []
100
XCL210B331GR-G/XCL210D331GR-G
3.5
VIN=5.0V
3.4
3.3 3.3
3.2
3.1
-40 -20
IOUT=0.1mA
IOUT=1mA
IOUT=10mA
IOUT=100mA
0 20 40 60 80
Ambient Temperature : Ta []
100
3.2
3.1
-40 -20
IOUT=0.1mA
IOUT=1mA
IOUT=10mA
0 20 40 60 80
Ambient Temperature : Ta []
100
20/24


XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
5) Load Transient Response
(1)XCL210B181GR-G, VIN=3.6V, VOUT=1.8V / IOUT=0.1mA 30mA
XCL210
Series
VOUT = 1.8V
IOUT = 0.1mA 30mA
(2)XCL210B181GR-G, VIN=3.6V, VOUT=1.8V / IOUT=10mA 30mA
VOUT = 1.8V
IOUT = 10mA 30mA
21/24


XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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XCL210 Series
PACKAGING INFORMATION
CL-2025-02 (unit: mm)
External Lead
Reference Pattern Layout (unit: mm)
Reference Metal Mask Design (unit: mm)
* Implementation of CL-2025-02 is recommended within accuracy 0.05mm.
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XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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MARKING RULE
CL-2025-02
16
25
34
XCL210
Series
represents products series
MARK
PRODUCT SERIES
0 XCL210******-G
represents integer of the output voltage
MARK
TYPE OUTPUT VOLTAGE(V)
8 1.x
9A
E
2.x
3.x
F 4.x
H 1.x
K
B
L
2.x
3.x
M 4.x
N 1.x
P
RC
2.x
3.x
S 4.x
T 1.x
U
D
V
2.x
3.x
X 4.x
PRODUCT SERIES
XCL210A1****-G
XCL210A2****-G
XCL210A3****-G
XCL210A4****-G
XCL210B1****-G
XCL210B2****-G
XCL210B3****-G
XCL210B4****-G
XCL210C1****-G
XCL210C2****-G
XCL210C3****-G
XCL210C4****-G
XCL210D1****-G
XCL210D2****-G
XCL210D3****-G
XCL210D4****-G
represents the decimal part of output voltage
MARK
OUTPUT VOLTAGE(V)
X.0 0
X.05
A
X.1 1
X.15
B
X.2 2
X.25
C
X.3 3
X.35
D
X.4 4
X.45
E
X.5 5
X.55
F
X.6 6
X.65
H
X.7 7
X.75
K
X.8 8
X.85
L
X.9 9
X.95
M
PRODUCT SERIES
XCL210**0***-G
XCL210**A***-G
XCL210**1***-G
XCL210**B***-G
XCL210**2***-G
XCL210**C***-G
XCL210**3***-G
XCL210**D***-G
XCL210**4***-G
XCL210**E***-G
XCL210**5***-G
XCL210**F***-G
XCL210**6***-G
XCL210**H***-G
XCL210**7***-G
XCL210**K***-G
XCL210**8***-G
XCL210**L***-G
XCL210**9***-G
XCL210**M***-G
④,⑤ represents production lot number
01090A0Z119ZA1A9AAAZB1ZZ in order.
(G, I, J, O, Q, W excluded)
Note: No character inversion used.
23/24


XCL210 (Torex Semiconductor)
50mA/200mA Inductor Built-in Step-Down Converters

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XCL210 Series
1. The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2. The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or completeness
of the information contained in this datasheet nor grant any license to any intellectual property rights
of ours or any third party concerning with the information in this datasheet.
3. Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4. The product is neither intended nor warranted for use in equipment of systems which require extremely
high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human
life, bodily injury, serious property damage including but not limited to devices or equipment used in 1)
nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other
transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless
Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or
property damage resulting from such failure, customers are required to incorporate adequate safety
measures in their designs, such as system fail safes, redundancy and fire prevention features.
6. Our products are not designed to be Radiation-resistant.
7. Please use the product listed in this datasheet within the specified ranges.
8. We assume no responsibility for damage or loss due to abnormal use.
9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
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