TMP95C061BFG Datasheet PDF - Toshiba


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TMP95C061BFG
Toshiba

Part Number TMP95C061BFG
Description CMOS 16-Bit Microcontroller
Page 30 Pages

TMP95C061BFG datasheet pdf
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TOSHIBA Original CMOS 16-Bit Microcontroller
TLCS-900/H Series
TMP95C061BFG
TMP95C061BDFG
Semiconductor Company



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TMP95C061B
Document Change Notification
The purpose of this notification is to inform customers about the launch of the Pb-free version of the
device. The introduction of a Pb-free replacement affects the datasheet. Please understand that this
notification is intended as a substitute for a revision of the datasheet.
Changes to the datasheet may include the following, though not all of them may apply to this
particular device.
1. Part number
Example: TMPxxxxxxF TMPxxxxxxFG
All references to the previous part number were left unchanged in body text. The new
part number is indicated on the prelims pages (cover page and this notification).
2. Package code and package dimensions
Example: LQFP100-P-1414-0.50C LQFP100-P-1414-0.50F
All references to the previous package code and package dimensions were left unchanged
in body text. The new ones are indicated on the prelims pages.
3. Addition of notes on lead solderability
Now that the device is Pb-free, notes on lead solderability have been added.
4. RESTRICTIONS ON PRODUCT USE
The previous (obsolete) provision might be left unchanged on page 1 of body text. A new
replacement is included on the next page.
5. Publication date of the datasheet
The publication date at the lower right corner of the prelims pages applies to the new
device.
I 2011-01-26



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TMP95C061B
1. Part number
2. Package code and dimensions
Previous Part Number Previous Package Code
(in Body Text)
(in Body Text)
New Part Number
New Package Code
TMP95C061BF
(Note)
P-QFP100-1414-0.50
(Note)
TMP95C061BFG
TMP95C061BDFG
QFP100-P-1414-0.50
LQFP100-P-1414-0.50F
Note: Pb-containing variant not available.
*: For the dimensions of the new package, see the attached Package Dimensions diagram.
3. Addition of notes on lead solderability
The following solderability test is conducted on the new device.
Solderability
Test Parameter
Solderability
Test Condition
Use of Sn-37Pb solder Bath
Solder bath temperature = 230°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Use of Sn-3.0Ag-0.5Cu solder bath
Solder bath temperature = 245°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Note
Pass:
Solderability rate until forming
95%
4. RESTRICTIONS ON PRODUCT USE
It replaces the “RESTRICTIONS ON PRODUCT USE” on page 1 of body text. For details, see
the attached RESTRICTIONS ON PRODUCT USE.
5. Publication date of the datasheet
The publication date of this datasheet is printed at the lower right corner of this notification.
II 2011-01-26




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