SM802108 Datasheet PDF - MICREL

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SM802108
MICREL

Part Number SM802108
Description ClockWorks 10GbE & GbE (156.25MHz 125MHz) Ultra-Low Jitter - LVPECL Frequency Synthesizer
Page 11 Pages


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SM802108
ClockWorks10GbE & GbE (156.25MHz,
125MHz) Ultra-Low Jitter, LVPECL
Frequency Synthesizer
General Description
The SM802108 is a member of the ClockWorksfamily of
devices from Micrel and provides an extremely low-noise
timing solution for GbE and 10GbE Ethernet clock signals.
It is based upon a unique patented RotaryWave®
architecture that provides very low phase noise.
The device operates from a 3.3V or 2.5V power supply
and synthesizes two LVPECL output clocks at 156.25MHz
and another two at 125MHz. The SM802108 accepts a 25
MHz crystal or LVCMOS reference clock.
Data sheets and support documentation can be found on
Micrel’s web site at: www.micrel.com.
Features
Generates two LVPECL clock outputs at 156.25MHz
and two LVPECL clock outputs at 125MHz
2.5V or 3.3V operating range
Typical phase jitter @ 156.25MHz
(1.875MHz to 20MHz): 110fs (typical) at 3.3V
Industrial temperature range
Green, RoHS, and PFOS compliant
Available in 24-pin 4mm × 4mm QFN package
Applications
10Gigabit Ethernet
Gigabit Ethernet
___________________________________________________________________________________________________________
Block Diagram
www.DataSheet4U.com
ClockWorks is a trademark of Micrel, Inc
RotaryWave is a registered trademark of Multigig, Inc.
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
January 2011
M9999-012111-A
hbwhelp@micrel.com or (408) 955-1690



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Micrel, Inc.
Ordering Information
Part Number
SM802108UMG
SM802108UMGR
Marking
802108
802108
Note:
1. Devices are Green, RoHS, and PFOS compliant.
Shipping
Tube
Tape and Reel
Junction Temperature Range
–40°C to +85°C
–40°C to +85°C
Pin Configuration
SM802108
Package
24-Pin QFN
24-Pin QFN
24-Pin QFN
(Top View)
Pin Description
Pin Number
16, 17
20, 21
23, 24
3, 4
1
2
Pin Name
/Q0, Q0
/Q1, Q1
/Q2, Q2
/Q3, Q3
VDDO2
VSSO2
Pin Type
O, (DIF)
O, (DIF)
PWR
PWR
www.Data5Sheet4U.coPmLL_BYPASS
I, (SE)
6
XTAL_SEL
I, (SE)
Pin Level
LVPECL
LVPECL
LVCMOS
LVCMOS
Pin Function
Differential Clock Outputs from Bank 1
156.25MHz
Differential Clock Outputs from Bank 2
125MHz
Power Supply for Output Bank 2
Power Supply Ground for Output Bank 2
PLL Bypass, Selects Output Source
0 = Normal PLL Operation
1 = Output from Input Reference Clock or Crystal
45Kpull-down
Selects PLL Input Reference Source
0 = REF_IN, 1 = XTAL, 45Kpull-up
January 2011
2 M9999-012111-A
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Micrel, Inc.
Pin Description (Continued)
Pin Number
7, 12, 15, 19
8
9
Pin Name
TEST
VDD
REF_IN
Pin Type
PWR
I, (SE)
10 XIN I, (SE)
11
13, 14
18
22
XOUT
VSS
VDDO1
VSSO1
O, (SE)
PWR
PWR
PWR
SM802108
Pin Level
LVCMOS
12pF crystal
12pF crystal
Pin Function
Factory Test Pins, Do not connect anything to these pins.
Core Power Supply
Reference Clock Input
Crystal Reference Input, no load caps needed.
See Fig. 5.
Crystal Reference Output, no load caps needed.
See Fig. 5.
Core Power Supply Ground
Power Supply for Output Bank 1
Power Supply Ground for Output Bank 1
Application Information
Input Reference
When operating with a crystal input reference, do not
apply a switching signal to REF_IN.
Crystal Layout
Keep the layers under the crystal as open as possible.
Do not place switching signals or noisy supplies under
the crystal.
Truth Table
PLL_BYPASS
0
1
XTAL_SEL
0
1
INPUT
REF_IN
XTAL
OUTPUT
PLL
XTAL/REF_IN
www.DataSheet4U.com
January 2011
3 M9999-012111-A
hbwhelp@micrel.com or (408) 955-1690



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Micrel, Inc.
SM802108
Absolute Maximum Ratings(1)
Supply Voltage (VDD, VDDOx) ........................................+4.6V
Input Voltage (VIN). ............................. –0.50V to VDD + 0.5V
Lead Temperature (soldering, 20sec.)....................... 260°C
Case Temperature ..................................................... 115°C
Storage Temperature (Ts) .........................–65°C to +150°C
Operating Ratings(2)
Supply Voltage (VDD, VDDOx) ................. +2.375V to +3.465V
Ambient
Junction
TTehmerpmearal tRueresi(sTtaAn) .c.e..(.3.)....................
–40°C
to
+85°C
QFN (θJA)
Still-Air ......................................................... 50°C/W
QFN (ψJB)
Junction-to-Board .......................................30°C/W
DC Electrical Characteristics(4)
VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5%
VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5%
TA = 40°C to +85°C.
Symbol
VDD, VDDOx
VDD, VDDOx
IDD
IDD
Parameter
2.5V Operating Voltage
3.3V Operating Voltage
Supply current VDD + VDDO
Supply current VDD + VDDO
Condition
Outputs open; REF_IN source,
XTAL_SEL = 0
Outputs open; CRYSTAL source,
XTAL_SEL = 1
Min.
2.375
3.135
Typ.
2.5
3.3
130
145
Max.
2.625
3.465
165
Units
V
V
mA
185 mA
LVPECL DC Electrical Characteristics(4)
VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5%
VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5%
TA = 40°C to +85°C. RL = 50to VDDO 2V
Symbol
VOH
VOL
VSWING
Parameter
Output High Voltage
Output Low Voltage
Output Voltage Swing
Condition
Min.
VDDO – 1.145
VDDO – 1.945
0.6
Typ.
VDDO – 0.97
VDDO – 1.77
0.8
Max.
VDDO – 0.845
VDDO – 1.645
1.0
Units
V
V
V
Note:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied
at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
4. The circuit is designed to meet the AC and DC specifications shown in the above table(s) after thermal equilibrium has been established.
www.DataSheet4U.com
January 2011
4 M9999-012111-A
hbwhelp@micrel.com or (408) 955-1690



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