PUMD2 Datasheet PDF - NXP Semiconductors


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PUMD2
NXP Semiconductors

Part Number PUMD2
Description NPN/PNP resistor-equipped transistors
Page 16 Pages

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PEMD2; PIMD2; PUMD2
NPN/PNP resistor-equipped transistors;
R1 = 22 k, R2 = 22 k
Rev. 07 — 24 September 2008
Product data sheet
1. Product profile
1.1 General description
NPN/PNP Resistor-Equipped Transistors (RET).
Table 1. Product overview
Type number Package
NXP
PEMD2
SOT666
PIMD2
SOT457
PUMD2
SOT363
JEITA
-
SC-74
SC-88
PNP/PNP
complement
PEMB1
-
PUMB1
NPN/NPN
complement
PEMH1
-
PUMH1
1.2 Features
I Built-in bias resistors
I Simplifies circuit design
I Reduces component count
I Reduces pick and place costs
1.3 Applications
I Low current peripheral driver
I Control of IC inputs
I Replaces general-purpose transistors in digital applications
1.4 Quick reference data
Table 2.
Symbol
VCEO
IO
R1
R2/R1
Quick reference data
Parameter
collector-emitter voltage
output current
bias resistor 1 (input)
bias resistor ratio
Conditions
open base
Min Typ
--
--
15.4 22
0.8 1
Max Unit
50 V
100 mA
28.6 k
1.2



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PEMD2; PIMD2; PUMD2
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = 22 k
2. Pinning information
Table 3. Pinning
Pin Description
PEMD2; PUMD2
1 GND (emitter) TR1
2 input (base) TR1
3 output (collector) TR2
4 GND (emitter) TR2
5 input (base) TR2
6 output (collector) TR1
Simplified outline Graphic symbol
654
65
4
123
001aab555
R1
TR1
R2
R2
TR2
R1
PIMD2
1
2
3
4
5
6
GND (emitter) TR2
input (base) TR2
output (collector) TR1
GND (emitter) TR1
input (base) TR1
output (collector) TR2
1 23
006aaa143
654
123
654
R1 R2
TR1
TR2
R2 R1
123
006aab235
3. Ordering information
Table 4. Ordering information
Type number Package
Name
Description
PEMD2
-
plastic surface-mounted package; 6 leads
PIMD2
SC-74
plastic surface-mounted package (TSOP6); 6 leads
PUMD2
SC-88
plastic surface-mounted package; 6 leads
Version
SOT666
SOT457
SOT363
PEMD2_PIMD2_PUMD2_7
Product data sheet
Rev. 07 — 24 September 2008
© NXP B.V. 2008. All rights reserved.
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PEMD2; PIMD2; PUMD2
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = 22 k
4. Marking
Table 5. Marking codes
Type number
PEMD2
PIMD2
PUMD2
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
Marking code[1]
D4
M5
D*2
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Per transistor; for the PNP transistor with negative polarity
VCBO
VCEO
VEBO
VI
collector-base voltage
collector-emitter voltage
emitter-base voltage
input voltage TR1
positive
open emitter
open base
open collector
-
-
-
-
negative
-
input voltage TR2
positive
-
negative
-
IO output current
ICM
peak collector current
single pulse;
tp 1 ms
Ptot total power dissipation Tamb 25 °C
PEMD2 (SOT666)
-
-
[1]
[2] -
PIMD2 (SOT457)
-
PUMD2 (SOT363)
-
Tj
Tamb
Tstg
junction temperature
ambient temperature
storage temperature
-
65
65
Max Unit
50 V
50 V
10 V
+40 V
10 V
+10 V
40 V
100 mA
100 mA
200
300
200
150
+150
+150
mW
mW
mW
°C
°C
°C
PEMD2_PIMD2_PUMD2_7
Product data sheet
Rev. 07 — 24 September 2008
© NXP B.V. 2008. All rights reserved.
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PEMD2; PIMD2; PUMD2
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = 22 k
Table 6. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Per device
Ptot total power dissipation Tamb 25 °C
PEMD2 (SOT666)
[1]
[2] -
PIMD2 (SOT457)
-
PUMD2 (SOT363)
-
Max Unit
300 mW
600 mW
300 mW
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
6. Thermal characteristics
Table 7. Thermal characteristics
Symbol Parameter
Per transistor
Rth(j-a)
thermal resistance from
junction to ambient
PEMD2 (SOT666)
PIMD2 (SOT457)
PUMD2 (SOT363)
Per device
Rth(j-a)
thermal resistance from
junction to ambient
PEMD2 (SOT666)
PIMD2 (SOT457)
PUMD2 (SOT363)
Conditions
in free air
in free air
Min Typ Max
[1]
[2] - - 625
- - 417
- - 625
[1]
[2] - - 416
- - 208
- - 416
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
Unit
K/W
K/W
K/W
K/W
K/W
K/W
PEMD2_PIMD2_PUMD2_7
Product data sheet
Rev. 07 — 24 September 2008
© NXP B.V. 2008. All rights reserved.
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