PDTA114T Datasheet PDF - NXP Semiconductors


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PDTA114T
NXP Semiconductors

Part Number PDTA114T
Description PNP resistor-equipped transistors
Page 11 Pages

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PDTA114T series
PNP resistor-equipped transistors; R1 = 10 k, R2 = open
Rev. 07 — 20 April 2007
Product data sheet
1. Product profile
1.1 General description
PNP Resistor-Equipped Transistors (RET) family in small plastic packages.
Table 1. Product overview
Type number
Package
NXP
PDTA114TE
SOT416
PDTA114TK
SOT346
PDTA114TM
SOT883
PDTA114TS[1]
SOT54
PDTA114TT
SOT23
PDTA114TU
SOT323
JEITA
SC-75
SC-59A
SC-101
SC-43A
-
SC-70
JEDEC
-
TO-236
-
TO-92
TO-236AB
-
[1] Also available in SOT54A and SOT54 variant packages (see Section 2).
NPN complement
PDTC114TE
PDTC114TK
PDTC114TM
PDTC114TS
PDTC114TT
PDTC114TU
1.2 Features
I 100 mA output current capability
I Built-in bias resistors
I Simplifies circuit design
I Reduces component count
I Reduces pick and place costs
1.3 Applications
I Digital applications
I Control of IC inputs
I Cost-saving alternative to BC857 series
in digital applications
I Low current peripheral driver
1.4 Quick reference data
Table 2.
Symbol
VCEO
IO
R1
Quick reference data
Parameter
collector-emitter voltage
output current
bias resistor 1 (input)
Conditions
open base
Min Typ Max Unit
- - 50 V
- - 100 mA
7 10 13 k



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PDTA114T series
PNP resistor-equipped transistors; R1 = 10 k, R2 = open
2. Pinning information
Table 3.
Pin
SOT54
1
2
3
Pinning
Description
input (base)
output (collector)
GND (emitter)
SOT54A
1
2
3
input (base)
output (collector)
GND (emitter)
SOT54 variant
1 input (base)
2 output (collector)
3 GND (emitter)
SOT23; SOT323; SOT346; SOT416
1 input (base)
2 GND (emitter)
3 output (collector)
SOT883
1
2
3
input (base)
GND (emitter)
output (collector)
Simplified outline Symbol
1
2
3
001aab347
R1
1
2
3
006aaa217
1
2
3
001aab348
R1
1
2
3
006aaa217
1
2
3
001aab447
R1
1
2
3
006aaa217
3
12
006aaa144
R1
1
3
2
sym009
1
3
2
Transparent
top view
R1
1
3
2
sym009
PDTA114T_SER_7
Product data sheet
Rev. 07 — 20 April 2007
© NXP B.V. 2007. All rights reserved.
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PDTA114T series
PNP resistor-equipped transistors; R1 = 10 k, R2 = open
3. Ordering information
4. Marking
Table 4. Ordering information
Type number
Package
Name Description
Version
PDTA114TE
SC-75 plastic surface-mounted package; 3 leads
SOT416
PDTA114TK
SC-59A plastic surface-mounted package; 3 leads
SOT346
PDTA114TM
SC-101 leadless ultra small plastic package; 3 solder lands; SOT883
body 1.0 × 0.6 × 0.5 mm
PDTA114TS[1]
SC-43A plastic single-ended leaded (through hole) package; SOT54
3 leads
PDTA114TT
-
plastic surface-mounted package; 3 leads
SOT23
PDTA114TU
SC-70 plastic surface-mounted package; 3 leads
SOT323
[1] Also available in SOT54A and SOT54 variant packages (see Section 2 and Section 9).
Table 5. Marking codes
Type number
PDTA114TE
PDTA114TK
PDTA114TM
PDTA114TS
PDTA114TT
PDTA114TU
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
Marking code[1]
11
23
DE
TA114T
*11
*23
PDTA114T_SER_7
Product data sheet
Rev. 07 — 20 April 2007
© NXP B.V. 2007. All rights reserved.
3 of 11



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PDTA114T series
PNP resistor-equipped transistors; R1 = 10 k, R2 = open
5. Limiting values
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
VCBO
VCEO
VEBO
IO
ICM
Ptot
collector-base voltage
collector-emitter voltage
emitter-base voltage
output current
peak collector current
total power dissipation
PDTA114TE
open emitter
open base
open collector
single pulse;
tp 1 ms
Tamb 25 °C
-
-
-
-
-
[1] -
PDTA114TK
[1] -
PDTA114TM
[2][3] -
PDTA114TS
[1] -
PDTA114TT
[1] -
PDTA114TU
[1] -
Tj
Tamb
Tstg
junction temperature
ambient temperature
storage temperature
-
65
65
Max
50
50
5
100
100
150
250
250
500
250
200
150
+150
+150
Unit
V
V
V
mA
mA
mW
mW
mW
mW
mW
mW
°C
°C
°C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB with 60 µm copper strip line, standard footprint.
6. Thermal characteristics
Table 7.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
PDTA114TE
PDTA114TK
PDTA114TM
PDTA114TS
PDTA114TT
PDTA114TU
Conditions
in free air
Min Typ Max
[1] - - 833
[1] - - 500
[2][3] - - 500
[1] - - 250
[1] - - 500
[1] - - 625
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB with 60 µm copper strip line, standard footprint.
Unit
K/W
K/W
K/W
K/W
K/W
K/W
PDTA114T_SER_7
Product data sheet
Rev. 07 — 20 April 2007
© NXP B.V. 2007. All rights reserved.
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