MF1PLUSX0Y1 Datasheet PDF - NXP Semiconductors

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MF1PLUSX0Y1
NXP Semiconductors

Part Number MF1PLUSX0Y1
Description Mainstream contactless smart card IC
Page 20 Pages


MF1PLUSX0Y1 datasheet pdf
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MF1PLUSx0y1
Mainstream contactless smart card IC for fast and easy
solution development
Rev. 3.2 — 21 February 2011
163532
Product short data sheet
PUBLIC
1. General description
Migrate classic contactless smart card systems to the next security level! MIFARE Plus
brings benchmark security to mainstream contactless smart card applications. It is the
only mainstream IC compatible with MIFARE Classic 1K (MF1ICS50) and MIFARE
Classic 4K (MF1ICS70) which offers an upgrade path for existing infrastructure and
services.
After the security upgrade, MIFARE Plus uses AES-128 (Advanced Encryption Standard)
for authentication, data integrity and encryption. MIFARE Plus is based on open global
standards for both air interface and cryptographic methods at the highest security level.
MIFARE Plus is available in two versions: MIFARE Plus X and MIFARE Plus S.
The MIFARE Plus X (MF1PLUSx0y1, described in this data sheet) offers more
flexibility to optimize the command flow for speed and confidentiality. It offers a rich
feature set including proximity checks against relay attacks.
The MIFARE Plus S (MF1SPLUSx0y1)is the standard version for straight forward
migration of MIFARE Classic systems. It is configured to offer high data integrity.
2. Features and benefits
„ 2 kB or 4 kB EEPROM
„ Simple fixed memory structure compatible with MIFARE Classic 1K and
MIFARE Classic 4K
„ Memory structure identical to MIFARE Classic 4K (sectors, blocks)
„ Access conditions freely configurable
„ Supports ISO/IEC 14443-31 UIDs (4-byte UID, 4 Byte NUID, 7-byte UID),
optional support of random IDs
„ Multi-sector authentication, Multi-block read and write
„ AES-128 used for authenticity, confidentiality and integrity
„ Anti-tearing mechanism for writing AES keys
„ Keys can be stored as MIFARE CRYPTO1 keys (2 × 48-bit per sector) and as AES
keys (2 × 128-bit per sector)
„ Full support of virtual card concept
„ Proximity check
„ Communication speed up to 848 kbit/s
www.DataSheet4U.com
1. ISO/IEC 14443-x used in this data sheet refers to ISO/IEC 14443 Type A.



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MF1PLUSx0y1
Mainstream contactless smart card IC
„ Number of single write operations: 200000 cycles (typical)
„ Common Criteria Certification: EAL4+
3. Applications
„ Public transportation
„ Access management such as employee, school or campus cards
„ Electronic toll collection
„ Closed loop micro payment
„ Car parking
„ Internet cafés
„ Loyalty programs
4. Quick reference data
Table 1. Quick reference data
Symbol Parameter
Conditions
Ci input capacitance Tamb = 22 °C; fi = 13.56
MHz; 2.8 V RMS
fi input frequency
EEPROM characteristics
tret retention time
Nendu(W) write endurance
Tamb = 22 °C
Tamb = 22 °C; excluding
anti-tearing for AES keys or
sector trailers in security
level 3
Min
[1] 15.0
Typ
17.0
Max
19.04
- 13.56 -
10 -
-
100000 200000 -
Unit
pF
MHz
year
cycle
[1] Measured with LCR meter.
www.DataSheet4U.com
MF1PLUSX0Y1_SDS
Product short data sheet
PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.2 — 21 February 2011
163532
© NXP B.V. 2011. All rights reserved.
2 of 20



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5. Ordering information
Table 2. Ordering information
Type number
Package
Commercial
name
MF1PLUS8001DUD/03 FFC
Name
-
MF1PLUS8011DUD/03 FFC
-
MF1PLUS8031DUD/03 FFC
-
MF1PLUS8001DA4/03 MOA4
MF1PLUS8011DA4/03 MOA4
MF1PLUS8031DA4/03 MOA4
MF1PLUS6001DUD/03 FFC
PLLMC
PLLMC
PLLMC
-
MF1PLUS6011DUD/03 FFC
-
MF1PLUS6031DUD/03 FFC
-
MF1PLUS6001DA4/03 MOA4
MF1PLUS6011DA4/03 MOA4
MF1PLUS6031DA4/03 MOA4
MF1PLUS8001DUD/13 FFC
www.DataSheet4U.com
PLLMC
PLLMC
PLLMC
-
MF1PLUSx0y1
Mainstream contactless smart card IC
Description
Version
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see Ref. 3,
4 kB EEPROM, 7-byte UID, L1 card
-
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see Ref. 3,
4 kB EEPROM, 4-byte UID, L1 card
-
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see Ref. 3,
4 kB EEPROM, 4-byte NUID, L1 card
-
plastic leadless module carrier package; 35 mm SOT500-2
wide tape, 4 kB EEPROM, 7-byte UID, L1 card
plastic leadless module carrier package; 35 mm SOT500-2
wide tape, 4 kB EEPROM, 4-byte UID, L1 card
plastic leadless module carrier package; 35 mm SOT500-2
wide tape, 4 kB EEPROM, 4-byte NUID, L1 card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see Ref. 3,
2 kB EEPROM, 7-byte UID, L1 card
-
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see Ref. 3,
2 kB EEPROM, 4-byte UID, L1 card
-
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see Ref. 3,
2 kB EEPROM, 4-byte NUID, L1 card
-
plastic leadless module carrier package; 35 mm SOT500-2
wide tape, 2 kB EEPROM, 7-byte UID, L1 card
plastic leadless module carrier package; 35 mm SOT500-2
wide tape, 2 kB EEPROM, 4-byte UID, L1 card
plastic leadless module carrier package; 35 mm SOT500-2
wide tape, 2 kB EEPROM, 4-byte NUID, L1 card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see Ref. 3,
4 kB EEPROM, 7-byte UID, no security level 1 or
2, L3 card
-
MF1PLUSX0Y1_SDS
Product short data sheet
PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.2 — 21 February 2011
163532
© NXP B.V. 2011. All rights reserved.
3 of 20



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Table 2. Ordering information …continued
Type number
Package
Commercial
name
Name
MF1PLUS8001DA4/13 MOA4
PLLMC
MF1PLUS6001DUD/13 FFC
-
MF1PLUS6001DA4/13 MOA4
6. Block diagram
PLLMC
MF1PLUSx0y1
Mainstream contactless smart card IC
Description
Version
plastic leadless module carrier package; 35 mm SOT500-2
wide tape, 4 kB EEPROM, 7-byte UID, no
security level 1 or 2, L3 card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see Ref. 3,
2 kB EEPROM, 7-byte UID, no security level 1 or
2, L3 card
-
plastic leadless module carrier package; 35 mm SOT500-2
wide tape, 2 kB EEPROM, 7-byte UID, no
security level 1or 2, L3 card
RF
INTERFACE
SECURITY
SENSORS
POWER ON
RESET
VOLTAGE
REGULATOR
CLOCK
INPUT FILTER
RESET
GENERATOR
UART
ISO/IEC
14443A
Fig 1. Block diagram
AES CRYPTO
CO-PROCESSOR
TRUE RANDOM
NUMBER
GENERATOR
CRYPTO1
CPU/LOGIC UNIT
CRC
ROM
RAM
EEPROM
001aah389
www.DataSheet4U.com
MF1PLUSX0Y1_SDS
Product short data sheet
PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.2 — 21 February 2011
163532
© NXP B.V. 2011. All rights reserved.
4 of 20



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