MAX2745 Datasheet PDF - Maxim Integrated Products


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MAX2745
Maxim Integrated Products

Part Number MAX2745
Description Single-Chip Global Positioning System Receiver Front-End
Page 9 Pages

MAX2745 datasheet pdf
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19-3425; Rev 0; 10/04
EVAALVUAAILTAIOBNLEKIT
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Single-Chip Global Positioning System
Receiver Front-End
General Description
The MAX2745 complete single-chip global positioning
system (GPS) RF front-end downconverter utilizes many
innovative and leading-edge RF CMOS design tech-
niques. This high-performance, state-of-the-art device
consumes extremely low power and eliminates the
need for costly SAW and bulky discrete IF filters. The
MAX2745 incorporates a fully integrated low-noise
amplifier (LNA) and mixer, IF section, digital sampler,
and local oscillator synthesizer. The MAX2745 also pro-
vides a voltage supply for an external LNA. In addition,
the MAX2745 features a voltage booster, which can
extend the power-supply voltage to as low as 1.6V.
The MAX2745 supports both 3rd overtone crystal
designs in 32MHz and fundamental frequency crystal
designs in 16MHz, as well as a TCXO implementation.
In addition, the MAX2745 incorporates an on-chip tem-
perature sensor and crystal oscillator with trimmed
capacitors, resulting in a very accurate frequency and
additional system cost savings.
The MAX2745 is available in a space-saving 48-pin
TQFP package and is specified for the extended (-40°C
to +85°C) temperature range. The power consumption
of this device is as low as 41mW at 2.4V.
Applications
In-Vehicle Navigation Systems (IVNSs)
Location-Based Services (PDAs and
Accessories)
Telematics (Vehicle/Asset Tracking and
Inventory Management)
Recreational Handheld/Walkie Talkies
Geographical Information Systems (GISs)
Emergency Roadside Assistance
Emergency Response Systems
Digital Cameras/Camcorders
Consumer Electronics
Features
o Complete Single-Chip GPS Radio for 16.368MHz
and 32.736MHz Floorplans
o Single-Ended or Differential Outputs at 4.092MHz
o Low 3.5dB Typical Noise Figure
o No External IF SAW or Discrete Filters Required
o On-Chip Temperature Sensor
o 2.4V to 3.6V Operational Supply Voltage Range
o Power Consumption as Low as 41mW at 2.4V
o Wide -40°C to +85°C Operational Temperature
Range
Ordering Information
PART
MAX2745ECM
TEMP RANGE
-40°C to +85°C
*EP = Exposed paddle.
PIN-PACKAGE
48 TQFP-EP*
Typical Operating Circuit appears at end of data sheet
Block Diagram/
Pin Configuration
48 47 46 45 44 43 42 41 40 39 38 37
RBIAS 1
36 BPF_CTRL
CBIAS 2
VCXO
MAX2745
TEMPERATURE
SENSOR
35 ODS
VDD 3
VDD 4
GND 5
BIAS
PFD CHG
DIVIDER PUMP
34 CFS
33 COE
32 VDD
GND 6
RFIN 7
LNA/MIXER
VSPORT
31 SCLK
VCO 30 GND
GND 8
29 VOUT+
VDD 9
IEXT_LNA 10
VDD 11
BANDPASS FILTER
AGC
QUANTIZER
FILTER AUTOMATIC TUNING
VOLTAGE
BOOSTER
28 VOUT-
27 VDD
26 GND
AGC_FIL 12
25 VDD
13 14 15 16 17 18 19 20 21 22 23 24
________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.



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Single-Chip Global Positioning System
Receiver Front-End
ABSOLUTE MAXIMUM RATINGS
VDD to GND ...........................................................-0.3V to +3.7V
Other Pins to GND......................................-0.3V to (VDD + 0.3V)
RF LNA Input Power .......................................................+10dBm
Continuous Power Dissipation (TA = +70°C)
48-Pin TQFP-EP (derate 12.5mW/°C above +70°C) ............1W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Soldering Temperature (10s) ...........................................+300°C
CAUTION! ESD SENSITIVE DEVICE
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(MAX2745 EV kit, VDD = +2.4V to +3.6V, SHDN = GND, TA = -40°C to +85°C. Typical values are at VDD = +3.0V and TA = +25°C,
unless otherwise noted.)
PARAMETER
CONDITIONS
MIN TYP MAX UNITS
Supply Voltage
2.4 3.6 V
Supply Current
VDD = +3.0V, TA = +25°C (Note 1)
Shutdown mode
20.5 27
11
mA
µA
Optional External LNA Supply
Current
VDD = +3.0V
10 mA
Logic-Input High Voltage
2.0 V
Logic-Input Low Voltage
0.5 V
Logic-Input Bias Current
-10 +10 µA
AC ELECTRICAL CHARACTERISTICS
(MAX2745 EV kit, VDD = +2.4V to +3.6V, SHDN = GND, TA = -40°C to +85°C. Typical values are at VDD = +3.0V and TA = +25°C,
unless otherwise noted.)
PARAMETER
GENERAL PERFORMANCE
Maximum Conversion Gain
Input Frequency
Noise Figure
Return Loss (S11)
LNA/Mixer Input IP3
Output IF Frequency
OUTPUT STAGE
Output Rise/Fall Time
Output-Voltage-Level Low
Output-Voltage-Level High
CONDITIONS
MIN TYP MAX UNITS
(Notes 2, 3)
Measured at quantizer output
f1 = 5.09MHz and f2 = 7.09MHz above carrier frequency
105
1575.42
3.5
-14
-25
4.092
120
dB
MHz
dB
dB
dBm
MHz
Differential (VOUT+, VOUT-), CL < 20pF
Single ended (DOUT), CL<20pF
Differential
Single ended
Differential
Single ended
16
6
VDD - 0.9
0
VDD
ns
V
V
2 _______________________________________________________________________________________



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Single-Chip Global Positioning System
Receiver Front-End
AC ELECTRICAL CHARACTERISTICS (continued)
(MAX2745 EV kit, VDD = +2.4V to +3.6V, SHDN = GND, TA = -40°C to +85°C. Typical values are at VDD = +3.0V and TA = +25°C,
unless otherwise noted.)
PARAMETER
SYNTHESIZER
Crystal Input Frequency
Charge-Pump Current
Phase Noise
Maximum PLL Spur
VCO Tuning Frequency Range
VCO Tuning Gain
IF STAGE
IF Stage Gain
Dynamic Range IF Stage Gain
Bandpass Filter 1dB Corner
Frequency
Bandpass Filter 3dB Bandwidth
Bandpass Filter 60dB High-Side
Rejection
Bandpass Filter 60dB Low-Side
Rejection
Image Rejection
In-Band Ripple
AGC Loop Lock Time
CONDITIONS
Fundamental frequency crystal
3rd overtone crystal
fOFFSET = 10kHz offset,
BWLOOP = 70kHz
fOFFSET = 1MHz offset,
BWLOOP = 70kHz
BWLOOP = 70kHz
(Notes 2, 3)
(Notes 2, 3)
VGA set at maximum gain
Low-frequency corner
High-frequency corner
MIN TYP MAX UNITS
16.368
32.736
0.4
MHz
mA
-81
-104
dBc/Hz
-39
150 210
150 210
dBc
270 MHz
310 MHz/V
80 dB
56 dB
3.1 MHz
5.1
2.0 MHz
6.6 MHz
1.6 MHz
17 dB
1 dB
1 ms
Note 1: At TA = +25°C, min/max limits are guaranteed by production test.
Note 2: At TA = -40°C, min/max limits are guaranteed by design and characterization.
Note 3: At TA = +25°C and +85°C, min/max limits are guaranteed by production test.
Typical Operating Characteristics
(MAX2745 EV kit, VDD = +3.0V, SHDN = GND, fRF = 1575.42MHz, and TA = +25°C, unless otherwise noted.)
SUPPLY CURRENT vs. TEMPERATURE
30
26
22 VCC = 3V VCC = 2.7V
18
VCC = 2.4V
14
10
-40 -20 0 20 40 60 80
TEMPERATURE (°C)
LNA/MIXER GAIN vs. TEMPERATURE
40
35
30 VCC = 3V
25
20
15
10
VCC = 2.4V
VCC = 2.7V
5
0
-40 -20 0 20 40 60 80
TEMPERATURE (°C)
IF STAGE GAIN vs. TEMPERATURE
100
95
90
VCC = 2.4V
85
80
75 VCC = 3V
70 VCC = 2.7V
65
60
-40 -20
0
20 40 60 80
TEMPERATURE (°C)
_______________________________________________________________________________________ 3



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Single-Chip Global Positioning System
Receiver Front-End
Typical Operating Characteristics (continued)
(MAX2745 EV kit, VDD = +3.0V, SHDN = GND, fRF = 1575.42MHz, and TA = +25°C, unless otherwise noted.)
TOTAL GAIN vs. TEMPERATURE
110
VCC = 3V
108 VCC = 2.7V
106
104 VCC = 2.4V
102
TEMPERATURE-SENSOR OUTPUT VOLTAGE
vs. TEMPERATURE
1.6
1.4
1.2
1.0 VDD = 3.6V
0.8
0.6
0.4 VDD = 2.4V
0.2
VOLTAGE-BOOSTER
OUTPUT vs. VDD_VB
3.2
BST_CTRL = HIGH
VOUT = VDD
3.0
TA = -40°C
2.8
2.6 TA = +25°C
2.4
TA = +85°C
2.2
100
-40 -20 0 20 40 60 80
TEMPERATURE (°C)
0
-40 -20
0 20 40 60
TEMPERATURE (°C)
80
2.0
1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3
VDD_VB (V)
Pin Description
PIN
1
2
3, 4, 9, 11, 13,
25, 27, 32, 39,
43, 46
NAME
RBIAS
CBIAS
VDD
FUNCTION
External BIAS Resistor. For normal bias, connect a 100k(1%) resistor to ground.
BIAS Bypass Capacitor. Connect a 0.1µF capacitor to ground.
Power-Supply Voltage. Bypass with a 0.1µF capacitor to ground as close to the pins as possible.
5, 6, 8, 14, 26,
30, 41, 44
GND
Ground
7
RFIN
RF Input Signal. Requires external matching network.
10 IEXT_LNA External LNA Voltage Supply
12 AGC_FIL AGC External Filter. Requires external RC lowpass filter.
15 XTAL_SSEL Crystal Swing Select. Drive logic high for full swing. Drive logic low for limited swing.
16
XTAL_CSEL
Crystal Clock Select. Drive logic high for fundamental mode of 16.368MHz. Drive logic low for third
overtone mode of 32.736MHz.
17 BST_CTRL Active-High Boost Control Input. Drive logic high to activate the voltage booster (crystal oscillator is
biased from BIAS). Drive logic low to deactivate the voltage booster (crystal oscillator is self-biased).
18 TEST_EN Connect to Ground for Normal Operation
19 VDD_VB Power Supply for Voltage Booster. Connect to VDD if voltage booster is not used.
20 CKOUT Full-Swing Clock Output
21 DOUT Single-Ended Full-Swing Digital Output
22 VB_CS+ Positive Voltage Booster External Floating CAP. Connect a 6nF capacitor to GND.
23 VB_CS- Negative Voltage Booster External Floating CAP. Connect a 6nF capacitor to GND.
24
VOUT
Voltage Booster Output. Bypass to GND with a 1µF capacitor as close to the pin as possible.
4 _______________________________________________________________________________________




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