MAX1532ETL Datasheet PDF - Maxim Integrated Products

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MAX1532ETL
Maxim Integrated Products

Part Number MAX1532ETL
Description PLASTIC ENCAPSULATED DEVICES
Page 8 Pages


MAX1532ETL datasheet pdf
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MAX1532ETL
Rev. A
RELIABILITY REPORT
FOR
MAX1532ETL
PLASTIC ENCAPSULATED DEVICES
May 8, 2003
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by
www.DataSheet4U.com
Jim Pedicord
Quality Assurance
Reliability Lab Manager
Reviewed by
Bryan J. Preeshl
Quality Assurance
Executive Director



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Conclusion
The MAX1532 successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality
and reliability standards.
Table of Contents
I. ........Device Description
II. ........Manufacturing Information
III. .......Packaging Information
I. Device Description
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
IV. .......Die Information
.....Attachments
A. General
The MAX1532 is a dual-phase, Quick-PWM™, step-down controllers for Intel IMVP™ CPU core supplies. Dual-phase operation reduces
input ripple current requirements and output voltage ripple while easing component selection and layout difficulties. The Quick-PWM control
scheme provides instantaneous response to fast load-current steps. The MAX1546 includes active voltage positioning with adjustable gain
and offset, reducing power dissipation and bulk output capacitance requirements.
The MAX1532 is intended for two different notebook CPU core applications: stepping down the battery directly or stepping down the 5V
system supply to create the core voltage. The singlestage conversion method allows this device to directly step down high-voltage
batteries for the highest possible efficiency. Alternatively, two-stage conversion (stepping down the 5V system supply instead of the
battery) at a higher switching frequency provides the minimum possible physical size.
The MAX1532 complies with the IMVP-IV™ specifications. The switching regulator features soft-start and power-up sequencing, with the
MAX1532 automatically ramping up to the Intel IMVP-IV-specified boot voltage. The MAX1532/MAX1546/MAX1547 also feature independent
four-level logic inputs for setting the suspend voltage (S0–S1). The MAX1532 includea output undervoltage protection, thermal protection,
and voltage regulator power-OK (VROK) output. When any of these protection features detect a fault, the controller shuts down.
Additionally, the MAX1532 includes overvoltage protection.
The MA X1532 is available in lowprofile,40-pin 6mm x 6mm thin QFN packages.
B. Absolute Maximum Ratings
Item
Rating
V+ to GND
-0.3V to +30V
VCC to GND
-0.3V to +6V
VDD to PGND
-0.3V to +6V
SKIP, SUS, D0–D5 to GND
-0.3V to +6V
ILIM, FB, OFS, CCV, CCI, REF, OAIN+,OAIN- to GND
-0.3V to (VCC + 0.3V)
CMP, CSP, CMN, CSN, GNDS to GND
-0.3V to (VCC + 0.3V)
TON, TIME, VROK, S0–S1 to GND
-0.3V to (VCC + 0.3V)
SHDN to GND (Note 1)
-0.3V to +18V
DLM, DLS to PGND
-0.3V to (VDD + 0.3V)
BSTM, BSTS to GND
-0.3V to +36V
DHM to LXM
-0.3V to (VBSTM + 0.3V)
LXM to BSTM
-6V to +0.3V
DHS to LXS
-0.3V to (VBSTS + 0.3V)
LXS to BSTS
-6V to +0.3V
GND to PGND
-0.3V to +0.3V
REF Short-Circuit Duration
Continuous
www.DataOShpeeerta4tUin.cgoTmemperature Range
Junction Temperature
-40°C to +100°C
+150°C
Storage Temperature Range
-65°C to +150°C
Lead Temperature (soldering, 10s)
+300°C
Continuous Power Dissipation (TA = +70°C)
40-Pin QFN (6 x 6)
1860mW
Derates above +70°C
40-Pin QFN
23.2mW/°C
Note 1: SHDN may be forced to 12V for the purpose of debugging prototype boards using the no-fault test mode,
which disables fault protection and overlapping operation.



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II. Manufacturing Information
A. Description/Function:
Dual-Phase, Quick-PWM Controller for IMVP CPU Core Power Supplies
B. Process:
S12 (Standard 1.2 micron silicon gate CMOS)
C. Number of Device Transistors:
11,015
D. Fabrication Location:
California or Oregon, USA
E. Assembly Location:
Thailand and USA
F. Date of Initial Production:
January, 2003
III. Packaging Information
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-112:
40-Pin QFN (6x6)
Copper
Solder Plate
Silver-filled Epoxy
Gold (1.3 mil dia.)
Epoxy with silica filler
# 05-9000-0383
Class UL94-V0
Level 1
IV. Die Information
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
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F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
130 x 172 mils
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
Aluminum/Si (Si = 1%)
None
1.2 microns (as drawn)
1.2 microns (as drawn)
5 mil. Sq.
SiO2
Wafer Saw



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V. Quality Assurance Information
A. Quality Assurance Contacts:
Jim Pedicord (Reliability Lab Manager)
Bryan Preeshl (Executive Director)
Kenneth Huening (Vice President)
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure
Rate (λ) is calculated as follows:
λ= 1 =
1.83
(Chi square value for MTTF upper limit)
MTTF 192 x 4389 x 48 x 2
Temperature Acceleration factor assuming an activation energy of 0.8eV
λ = 22.62 x 10-9
λ = 22.62 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to
routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects
it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be
shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece
sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In
Schematic (Spec. # 06-6131) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test
monitors. This data is published in the Product Reliability Report (RR-1M).
B. Moisture Resistance Tests
Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample
must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard
85°C/85%RH testing is done per generic device/package family once a quarter.
C. E.S.D. and Latch-Up Testing
The PD38-1 die type has been found to have all pins able to withstand a transient pulse of ±1500V, per Mil-
Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of ±250mA.
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