MA27V11 Datasheet PDF - Panasonic Semiconductor

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MA27V11
Panasonic Semiconductor

Part Number MA27V11
Description Silicon epitaxial planar type
Page 3 Pages


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Variable Capacitance Diodes
MA27V11
Silicon epitaxial planar type
For VCO
Features
Good linearity and large capacitance-ratio in CD VR relation
High frequency type by this low capacitance
Ultraminiature Package 1.0 mm × 0.6 mm (height: 0.52 mm),
optimum for high-density mounting and high-speed mounting
Absolute Maximum Ratings Ta = 25°C
Parameter
Symbol Rating
Reverse voltage
Junction temperature
Storage temperature
VR 8
Tj 125
Tstg 55 to +125
Unit
V
°C
°C
0.27+–00..0025
2
0.10+–00..0025
Unit: mm
1
0.60±0.05
1: Anode
2: Cathode
SSSMini2-F1 Package
Marking Symbol: D
Electrical Characteristics Ta = 25°C ± 3°C
Parameter
Reverse current
Diode capacitance
Capacitance ratio
Series resistance *
Symbol
IR
CD(1V)
CD(4V)
CD(1V) /CD(4V)
rD
Conditions
VR = 5 V
VR = 1 V, f = 1 MHz
VR = 4 V, f = 1 MHz
VR = 4 V, f = 470 MHz
Min Typ Max
10
2.77 3.01
1.23 1.34
2.16 2.34
0.35
Unit
nA
pF
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. Absolute frequency of input and output is 470 MHz.
3. *: Measuring instrument; YHP MODEL 4191A RF IMPEDANCE ANALYZER
Publication date: March 2004
SKD00059BED
1



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MA27V11
IF VF
160
120
25°C
Ta = 60°C
80
CD VR
10
f = 1 MHz
Ta = 25°C
1
40
40°C
0
0 0.4 0.8 1.2
Forward voltage VF (V)
10 1
0
10 20
Reverse voltage VR (V)
IR Ta
103 VR = 5 V
102
CD Ta
f = 1 MHz
1.026
VR = 1 V
1.016
1.006
0.996
4V
0.986
0
20 40 60 80
Ambient temperature Ta (°C)
10
1
0 10 20 30
Ambient temperature Ta (°C)
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Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of
the products or technical information described in this material and controlled under the "Foreign Exchange
and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and
applied circuits examples of the products. It neither warrants non-infringement of intellectual property right
or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical
information as described in this material.
(4) The products described in this material are intended to be used for standard applications or general elec-
tronic equipment (such as office equipment, communications equipment, measuring instruments and house-
hold appliances).
Consult our sales staff in advance for information on the following applications:
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus-
tion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
body.
Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifica-
tions satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rat-
ing, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent
physical injury, fire, social damages, for example, by using the products.
(7) When using products for which damp-proof packing is required, observe the conditions (including shelf life
and amount of time let standing of unsealed items) agreed upon when specification sheets are individually
exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2003 SEP



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