IRF840AS Datasheet PDF - Vishay


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IRF840AS
Vishay

Part Number IRF840AS
Description Power MOSFET
Page 9 Pages

IRF840AS datasheet pdf
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IRF840AS, SiHF840AS, IRF840AL, SiHF840AL
Vishay Siliconix
Power MOSFET
PRODUCT SUMMARY
VDS (V)
RDS(on) ()
Qg (Max.) (nC)
Qgs (nC)
Qgd (nC)
Configuration
500
VGS = 10 V
38
9.0
18
Single
I2PAK (TO-262)
D2PAK (TO-263)
0.85
D
G
SD
D
G
S
G
S
N-Channel MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
• Low Gate Charge Qg Results in Simple Drive
Requirement
• Improved Gate, Avalanche and Dynamic dV/dt
Ruggedness
• Fully Characterized Capacitance and
Avalanche Voltage and Current
• Effective Coss Specified
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Switch Mode Power Supply (SMPS)
• Uninterruptible Power Supply
• High Speed Power Switching
TYPICAL SMPS TOPOLOGIES
• Two Transistor Forward
• Half Bridge
• Full Bridge
ORDERING INFORMATION
Package
D2PAK (TO-263)
Lead (Pb)-free and Halogen-free SiHF840AS-GE3
Lead (Pb)-free
IRF840ASPbF
SiHF840AS-E3
Note
a. See device orientation.
D2PAK (TO-263)
SiHF840ASTRL-GE3a
IRF840ASTRLPbFa
SiHF840ASTL-E3a
D2PAK (TO-263)
SiHF840ASTRR-GE3a
IRF840ASTRRPbFa
SiHF840ASTR-E3a
I2PAK (TO-262)
SiHF840AL-GE3a
IRF840ALPbF
SiHF840AL-E3
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Currenta
Linear Derating Factor
VGS at 10 V
TC = 25 °C
TC = 100 °C
VDS
VGS
ID
IDM
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
Repetitive Avalanche Energya
Maximum Power Dissipation
Peak Diode Recovery dV/dtc, e
TC = 25 °C
TA = 25 °C
EAS
IAR
EAR
PD
dV/dt
Operating Junction and Storage Temperature Range
Soldering Temperature
for 10 s
TJ, Tstg
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Starting TJ = 25 °C, L = 16 mH, Rg = 25 , IAS = 8.0 A (see fig. 12).
c. ISD 8.0 A, dI/dt 100 A/μs, VDD VDS, TJ 150 °C.
d. 1.6 mm from case.
e. Uses IRF840A, SiH840A data and test conditions.
LIMIT
500
± 30
8.0
5.1
32
1.0
510
8.0
13
125
3.1
5.0
- 55 to + 150
300d
UNIT
V
A
W/°C
mJ
A
mJ
W
V/ns
°C
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91066
S11-1050-Rev. D, 30-May-11
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1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000



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IRF840AS, SiHF840AS, IRF840AL, SiHF840AL
Vishay Siliconix
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
Maximum Junction-to-Ambient
(PCB Mount)a
RthJA
Maximum Junction-to-Case (Drain)
RthJC
Note
a. When mounted on 1" square PCB (FR-4 or G-10 material).
MIN.
-
-
TYP.
-
-
MAX.
40
1.0
UNIT
°C/W
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
VDS
VDS/TJ
VGS(th)
IGSS
IDSS
RDS(on)
gfs
VGS = 0, ID = 250 μA
Reference to 25 °C, ID = 1 mAd
VDS = VGS, ID = 250 μA
VGS = ± 30 V
VDS = 500 V, VGS = 0 V
VDS = 400 V, VGS = 0 V, TJ = 125 °C
VGS = 10 V
ID = 4.8 Ab
VDS = 50 V, ID = 4.8 A
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Output Capacitance
Output Capacitance
Effective Output Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Ciss
Coss
Crss
Coss
Coss
Coss eff.
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
VGS = 0 V,
VDS = 25 V,
f = 1.0 MHz, see fig. 5
VGS = 0 V
VDS = 1.0 V, f = 1.0 MHz
VDS = 400 V, f = 1.0 MHz
VDS = 0 V to 480 Vc, d
VGS = 10 V
ID = 8.0 A, VDS = 400 V,
see fig. 6 and 13b, d
VDD = 250 V, ID = 8.0 A,
Rg = 9.1 , RD = 31 , see fig. 10b, d
MIN.
500
-
2.0
-
-
-
-
3.7
-
-
-
-
-
-
-
-
-
-
TYP. MAX. UNIT
- -V
0.58 - V/°C
- 4.0 V
- ± 100 nA
- 25
μA
- 250
- 0.85
- -S
1018
155
8.0
1490
42
56
-
-
-
11
23
26
19
-
-
-
38
9.0
18
-
-
-
-
pF
nC
ns
Continuous Source-Drain Diode Current
IS
MOSFET symbol
showing the
Pulsed Diode Forward Currenta
integral reverse
ISM p - n junction diode
D
G
S
- - 8.0
A
- - 32
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Forward Turn-On Time
VSD
TJ = 25 °C, IS = 8.0 A, VGS = 0 Vb
- - 2.0 V
trr
- 422 633 ns
TJ = 25 °C, IF = 8.0 A, dI/dt = 100 A/μsb
Qrr - 2.0 3.0 μC
ton Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width 300 μs; duty cycle 2 %.
c. Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 %to 80 % VDS.
d. Uses IRF840A, SiHF840A data and test conditions
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Document Number: 91066
S11-1050-Rev. D, 30-May-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000



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IRF840AS, SiHF840AS, IRF840AL, SiHF840AL
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
102
Top
VGS
15 V
10 V
8.0 V
7.0 V
10 6.0 V
5.5 V
5.0 V
Bottom 4.5 V
1
4.5 V
0.1
0.1
91066_01
20 µs Pulse Width
TJ = 25 °C
1 10 102
VDS, Drain-to-Source Voltage (V)
Fig. 1 - Typical Output Characteristics
102
10 TJ = 150 °C
TJ = 25 °C
1
20 µs Pulse Width
VDS = 50 V
0.1
4.0 5.0 6.0 7.0 8.0 9.0
91066_03
VGS, Gate-to-Source Voltage (V)
Fig. 3 - Typical Transfer Characteristics
102
Top
VGS
15 V
10 V
8.0 V
7.0 V
10 6.0 V
5.5 V
5.0 V
Bottom 4.5 V
1
4.5 V
0.1
0.1
91066_02
20 µs Pulse Width
TJ = 150 °C
1 10 102
VDS, Drain-to-Source Voltage (V)
Fig. 2 - Typical Output Characteristics
3.0
ID = 8.0 A
VGS = 10 V
2.5
2.0
1.5
1.0
0.5
0.0
- 60 - 40 - 20 0 20 40 60 80 100 120 140 160
91066_04
TJ, Junction Temperature (°C)
Fig. 4 - Normalized On-Resistance vs. Temperature
Document Number: 91066
S11-1050-Rev. D, 30-May-11
www.vishay.com
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000



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IRF840AS, SiHF840AS, IRF840AL, SiHF840AL
Vishay Siliconix
105
VGS = 0 V, f = 1 MHz
Ciss = Cgs + Cgd, Cds Shorted
104
Crss = Cgd
Coss = Cds + Cgd
103 Ciss
102 Coss
10 Crss
1
1
91066_05
10 102
VDS, Drain-to-Source Voltage (V)
103
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage
102
10
TJ = 150 °C
1
TJ = 25 °C
0.1
0.2
91066_07
VGS = 0 V
0.5 0.8 1.1 1.4
VSD, Source-to-Drain Voltage (V)
Fig. 7 - Typical Source-Drain Diode Forward Voltage
20
ID = 8.0 A
16 VDS = 400 V
VDS = 250 V
12 VDS = 100 V
8
4
For test circuit
see figure 13
0
0 10 20 30 40
91066_06
QG, Total Gate Charge (nC)
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage
102
Operation in this area limited
by RDS(on)
10 µs
10
100 µs
1
0.1
10
91066_08
1 ms
10 ms
TC = 25 °C
TJ = 150 °C
Single Pulse
102 103 104
VDS, Drain-to-Source Voltage (V)
Fig. 8 - Maximum Safe Operating Area
www.vishay.com
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Document Number: 91066
S11-1050-Rev. D, 30-May-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000




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