HSMS-270P Datasheet PDF - AVAGO

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HSMS-270P
AVAGO

Part Number HSMS-270P
Description High Performance Schottky Diode
Page 9 Pages


HSMS-270P datasheet pdf
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HSMS-2700, 2702, 270B, 270C, 270P
High Performance Schottky Diode
for Transient Suppression
Data Sheet
Description
The HSMS-2700 series of Schottky diodes, commonly
referred to as clipping /clamping diodes, are optimal for
circuit and waveshape preservation applications with
high speed switching. Ultra-low series resistance, RS,
makes them ideal for protecting sensitive circuit elements
against higher current transients carried on data lines.
With picosecond switching, the HSMS-270x can respond
to noise spikes with rise times as fast as 1 ns. Low ca-
pacitance minimizes waveshape loss that causes signal
degradation.
Features
Ultra-low Series Resistance for Higher Current
Handling
Picosecond Switching
Low Capacitance
Lead-free
Applications
RF and computer designs that require circuit protection,
high-speed switching, and voltage clamping.
HSMS-270x DC Electrical Specifications, TA = +25°C[1]
Part Package
Number Marking Lead
HSMS- Code[2] Code Configuration Package
-2700 J0
0 Single
SOT-23
Maximum
Forward
Voltage
VF (mV)
Minimum
Breakdown
Voltage
VBR (V)
Typical
Capacitance
CT (pF)
Typical
Series
Resistance
RS (Ω)
-270B
B
SOT-323
(3-lead SC-70)
-2702
-270C
J2
2
C Series
SOT-23
550 [3]
SOT-323
(3-lead SC-70)
15[4]
6.7[5]
0.65
-270P JP
P
Bridge Quad
SOT-363
(6-lead SC-70)
Notes:
1. TA = +25°C, where TA is defined to be the temperature at the package pins where contact is made to the circuit board.
2. Package marking code is laser marked.
3. IF = 100 mA; 100% tested
4. IR = 100 μA; 100% tested
5. VF = 0; f =1 MHz
6. Measured with Karkauer method at 20 mA; guaranteed by design.
Maximum
Eff. Carrier
Lifetime
τ (ps)
100[6]
Package Lead Code Identification (Top View)
SINGLE
3
SERIES
3
BRIDGE QUAD
6 54
1 0, B 2
1 2, C 2
123



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Absolute Maximum Ratings, TA= 25ºC
Absolute Maximum[1]
Symbol Parameter
Unit
HSMS-2700/-2702
HSMS-270B/270C/270P
IF
IF- peak
PT
PINV
TJ
TSTG
θJC
DC Forward Current
Peak Surge Current (1μs pulse)
Total Power Dissipation
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance, junction to lead
mA
A
mW
V
°C
°C
°C/W
350
1.0
250
15
150
-65 to 150
500
750
1.0
825
15
150
-65 to 150
150
Note:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
Linear and Non-linear SPICE Model
0.08 pF
2 nH
RS
SPICE model
SPICE Parameters
Parameter
BV
CJO
EG
IBV
IS
N
RS
PB
PT
M
Unit
V
pF
eV
A
A
Ω
V
Value
25
6.7
0.55
10E-4
1.4E-7
1.04
0.65
0.6
2
0.5
2



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Typical Performance
300
100
10
1
0.1 TA = +75 C
TA = +25 C
0.01 TA = –25 C
0 0.1 0.2 0.3 0.4 0.5 0.6
VF – FORWARD VOLTAGE (V)
Figure 1. Forward Current vs. Forward Voltage at
Temperature for HSMS-2700 and HSMS-2702.
160 Max. safe junction temp.
140 TA = +75 C
TA = +25 C
120 TA = –25 C
100
80
60
40
20
0
0 150 300 450 600 750
IF – FORWARD CURRENT (mA)
Figure 4. Junction Temperature vs. Current as a
Function of Heat Sink Temperature for HSMS-270B
and HSMS-270C.
Note: Data is calculated from SPICE parameters.
500
100
10
1
0.1 TA = +75 C
TA = +25 C
0.01 TA = –25 C
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
VF – FORWARD VOLTAGE (V)
Figure 2. Forward Current vs. Forward Voltage at
Temperature for HSMS-270B and HSMS-270C.
7
6
5
4
3
2
1
0 5 10 15 20
VF – REVERSE VOLTAGE (V)
Figure 5. Total Capacitance vs. Reverse Voltage.
160 Max. safe junction temp.
140 TA = +75 C
TA = +25 C
120 TA = –25 C
100
80
60
40
20
0
0 50 100 150 200 250 300 350
IF – FORWARD CURRENT (mA)
Figure 3. Junction Temperature vs. Forward Current
as a Function of Heat Sink Temperature for the
HSMS-2700 and HSMS-2702.
Note: Data is calculated from SPICE parameters.
3



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Package Dimensions
Outline SOT-23
e2
e1
Device Orientation
For Outlines SOT-23/323
REEL
E XXX
e
B
D
A1
Notes:
XXX-package marking
Drawings are not to scale
E1
L
C
DIMENSIONS (mm)
SYMBOL MIN.
MAX.
A 0.79 1.20
A A1 0.000 0.100
B 0.30 0.54
C 0.08 0.20
D 2.73 3.13
E1 1.15 1.50
e 0.89 1.02
e1 1.78 2.04
e2 0.45 0.60
E 2.10 2.70
L 0.45 0.69
USER
FEED
DIRECTION
COVER TAPE
TOP VIEW
4 mm
CARRIER
TAPE
END VIE W
8 mm
ABC ABC ABC ABC
Note: "AB" represents package marking code.
"C" represents date code.
Tape Dimensions and Product Orientation
For Outline SOT-23
P D P2
P0
Recommended PCB Pad Layout
For Avago’s SOT-23 Products
E
0.039
1
0.039
1
F
W
t1 D1
9° MAX
Ko 8° MAX
13.5° MAX
A0 B0
CAVITY
PERFORATION
CARRIER TAPE
DISTANCE
BETWEEN
CENTERLINE
DESCRIPTION
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
DIAMETER
PITCH
POSITION
WIDTH
THICKNESS
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
SYMBOL
A0
B0
K0
P
D1
D
P0
E
SIZE (mm)
3.15 ± 0.10
2.77 ± 0.10
1.22 ± 0.10
4.00 ± 0.10
1.00 + 0.05
1.50 + 0.10
4.00 ± 0.10
1.75 ± 0.10
SIZE (INCHES)
0.124 ± 0.004
0.109 ± 0.004
0.048 ± 0.004
0.157 ± 0.004
0.039 ± 0.002
0.059 + 0.004
0.157 ± 0.004
0.069 ± 0.004
W 8.00 +0.30 –0.10 0.315 +0.012 –0.004
t1 0.229 ± 0.013 0.009 ± 0.0005
F 3.50 ± 0.05 0.138 ± 0.002
P2 2.00 ± 0.05
0.079 ± 0.002
0.035
0.9
0.079
2.0
0.031
0.8
Dimensions in
inches
mm
4



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