HSMP-3892 Datasheet PDF - AVAGO


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HSMP-3892
AVAGO

Part Number HSMP-3892
Description Surface Mount RF PIN Switch Diodes
Page 13 Pages

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HSMP-389x Series, HSMP-489x Series
Surface Mount RF PIN Switch Diodes
Data Sheet
Description/Applications
The HSMP-389x series is o­ ptimized for switching appli-
cations where low resistance at low current and low ca-
pacitance are required. The HSMP-489x series products
feature ultra low parasitic inductance. These products
are specifically ­designed for use at frequencies which
are much higher than the upper limit for conventional
PIN diodes.
Pin Connections and Package Marking
16
25
34
Notes:
1. Package marking provides orientation, identification, and date
code.
2. See “Electrical Specifications” for appropriate package marking.
Features
Unique Configurations in Surface Mount Packages
– Add Flexibility
– Save Board Space
– Reduce Cost
Switching
– Low Capacitance
– Low Resistance at Low Current
Low Failure in Time (FIT) Rate[1]
Matched Diodes for Consistent Performance
Better Thermal Conductivity for Higher Power
Dissipation
Lead-free
Note:
1. For more information see the Surface Mount PIN Reliability Data
Sheet.



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Package Lead Code Identification,
SOT-23/143
(Top View)
SINGLE
SERIES
#0
COMMON
ANODE
#2
COMMON
CATHODE
#3
UNCONNECTED
PAIR
#4
DUAL ANODE
#5
RING
QUAD
34
4890
Package Lead Code Identification,
SOT-323
(Top View)
SINGLE
SERIES
B
COMMON
ANODE
C
COMMON
CATHODE
E
DUAL ANODE
F
489B
Package Lead Code Identification,
SOT-363
(Top View)
UNCONNECTED
TRIO
654
DUAL SWITCH
MODEL
654
123
L
LOW
INDUCTANCE
SINGLE
654
123
R
SERIES–
SHUNT PAIR
654
123
T
HIGH
FREQUENCY
SERIES
654
123
U
123
V
1 #7 2
UNDER DEVELOPMENT
Absolute Maximum Ratings[1] TC = +25°C
Symbol Parameter
Unit
SOT-23/143 SOT-323/363
If Forward Current (1 µs Pulse) Amp
1 1
PIV Peak Inverse Voltage
V
100 100
Tj Junction Temperature
°C
150 150
Tstg Storage Temperature
°C
-65 to 150
-65 to 150
θjc Thermal Resistance[2] °C/W 500 150
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board.
ESD WARNING:
Handling Precautions Should Be Taken To Avoid Static Discharge.
2



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Electrical Specifications, TC = 25°C, each diode
Part Number
HSMP-
Package
Marking Lead
Code Code Configuration
3890
3892
3893
3894
3895
389B
389C
389E
389F
389L
389R
389T
389U
389V
G0[1]
G2[1]
G3[1]
G4[1]
G5 [1]
G0[2]
G2[2]
G3[2]
G4[2]
GL[2]
S [2]
Z[2]
GU[2]
GV[2]
0 Single
2 Series
3 Common Anode
4 Common Cathode
5 Unconnected Pair
B Single
C Series
E Common Anode
F Common Cathode
L Unconnected Trio
R Dual Switch Mode
T Low Inductance Single
U Series-Shunt Pair
V High Frequency Series Pair
   Test Conditions
Notes:
1. Package marking code is white.
2. Package is laser marked.
Minimum
Breakdown
Voltage VBR (V)
100
Maximum
Series Resistance
RS (ý)
2.5
Maximum
Total Capacitance
CT (pF)
0.30
MVeR a=sVuBrRe
f
=IF
= 5 mA
100 MHz
IR ­10 µA
f
V=R
=5V
1 MHz
High Frequency (Low Inductance, 500 MHz – 3 GHz) PIN Diodes
Part Package
Number Marking
Minimum
Breakdown
Voltage
HSMP- Code[1] Configuration VBR (V)
489x GA Dual Anode
100
Maximum
Series
Resistance
RS (ý)
2.5
Typical
Total
Capacitance
C T (pF)
0.33
Maximum Typical
Total
Total
Capacitance Inductance
CT (pF)
LT (nH)
0.375
1.0
  Test Conditions
VR = VBR IF = 5 mA
f = 1 MHz
VR = 5 V
Measure
VR = 5 V
f = 1 MHz
IR ­10 µA
f=500 MHz–
3 GHz
Note:
1. SOT-23 package marking code is white; SOT-323 is laser marked.
Typical Parameters at TC = 25°C
Part Number
HSMP-
389x
  Test Conditions
Series Resistance
RS (ý)
3.8
f
=IF
= 1 mA
100 MHz
Carrier Lifetime
τ (ns)
200
IFIR==160mmAA
Total Capacitance
C T (pF)
0.20 @ 5V
3



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HSMP-389x Series Typical Performance, TC = 25°C, each diode
100 0.55
0.50
10 0.45
0.40
1
0.1
0.01 0.1 1 10 100
IF – FORWARD BIAS CURRENT (mA)
Figure 1. Total RF Resistance at 25 C vs.
Forward Bias Current.
0.35
0.30 1 MHz
0.25
0.20 0
1 GHz
48
12 16 20
VR – REVERSE VOLTAGE (V)
Figure 2. Capacitance vs. Reverse Voltage.
120 Diode Mounted as a
115 Series Attenuator in a
50 Ohm Microstrip and
110 Tested at 123 MHz
105
100
95
90
85
1 10 30
IF – FORWARD BIAS CURRENT (mA)
Figure 3. 2nd Harmonic Input Intercept
Point vs. Forward Bias Current.
200
160
VR = –2V
120
80
VR = –5V
40
VR = –10V
010 15 20 25
30
FORWARD CURRENT (mA)
Figure 4. Typical Reverse Recovery Time vs.
Reverse Voltage.
100
10
1
0.1
0.01 0
125 C 25 C –50 C
0.2 0.4 0.6 0.8 1.0 1.2
VF – FORWARD VOLTAGE (V)
Figure 5. Forward Current vs. Forward Voltage.
Typical Applications for Multiple Diode Products
321
1
2
3
0 456
b1 b2 b3
Figure 6. HSMP-389L used in a SP3T Switch.
2 12
“ON” 0 +V
“OFF” 0 –V
1 321
1
4 56
RF in RF out
Figure 7. HSMP-389L Unconnected Trio used in a Dual Voltage, High Isolation
Switch.
4




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