BGF148 Datasheet PDF - Infineon

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BGF148
Infineon

Part Number BGF148
Description 7 line ESD and EMI interface protection device
Page 14 Pages


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BGF148
7 line ESD and EMI interface protection device
BGF148
Datasheet
Revision 1.9.2, 2014-04-02
Final
Power Management & Multimarket



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Edition 2014-04-02
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2014 Infineon Technologies AG
All Rights Reserved.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com)
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.



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Revision History Rev. 1.9.1, 2014-01-17
Page or Item Subjects (major changes since previous revision)
Revision 1.9.2, 2014-04-02
5 Table 2-1) updated
BGF148
Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™,
CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, EasyPIM™, EconoBRIDGE™, EconoDUAL™,
EconoPIM™, EconoPACK™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™,
ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™,
POWERCODE™; PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™,
ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, TEMPFET™,
thinQ!™, TRENCHSTOP™, TriCore™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA
MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of
OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF
Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™
of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co.
TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™
of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas
Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes
Zetex Limited.
Last Trademarks Update 2011-11-11
Final Datasheet
3 Revision 1.9.2, 2014-04-02



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BGF148
7 line ESD and EMI interface protection device
1 7 line ESD and EMI interface protection device
1.1 Features
• 7 line bidirectional ESD protection
• ESD protection according to IEC61000-4-2 for ±15 kV contact discharge on all external IOs
• ESD protection according to IEC61000-4-2 for ±8 kV contact discharge on all internal IOs
• 6 line pi-type EMI filter for superior EMI filtering and very low cross-talk due to low parasitics
• Suitable for high speed applications due to low line capacitance of typical 1.2 pF
• Very low voltage dependency of line capacitance
• Very low leakage currents
• Application requires very small PCB area using an optimized I/O arrangement
• Small sized Plastic Package with 400 μm pitch
• Pb-free (RoHS compliant) and halogen free package
• Complies with following standards: SD Card Specification V4.1 including UHS104 mode
1.2 Application
• High-Speed Mini-/Micro- SD Card ESD protection and EMI filter
• SD3.0 card Interface (Mini, Micro), down compatible to SD2.0 and lower
– feature phones, smart phones, tablets, digital still cameras, digital video cameras, computers and other
devices using SD card interfaces
Final Datasheet
4 Revision 1.9.2, 2014-04-02



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