BAV99BRLP Datasheet PDF - Diodes

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BAV99BRLP
Diodes

Part Number BAV99BRLP
Description SURFACE MOUNT SWITCHING DIODE ARRAY
Page 4 Pages


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Features
Fast Switching Speed
Low Profile DFN Package (0.575mm typical thickness) is Much
Thinner than Conventional SOT Style Packages
Thermally Efficient DFN Package Features 500mW Power
Dissipation Capability in a Compact 2.0 * 2.0mm Footprint
Two “BAV99” Circuits In One Package
Lead Free/RoHS Compliant (Note 1)
"Green" Device (Note 2)
BAV99BRLP
SURFACE MOUNT SWITCHING DIODE ARRAY
Mechanical Data
Case: DFN2020B-6
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: NiPdAu over Copper leadframe (Lead Free Plating).
Solderable per MIL-STD-202, Method 208
Polarity: See Diagram
Weight: 0.006 grams (approximate)
DFN2020B-6
Top View
Bottom View
AC1 C2 A2
654
123
A1 C1 AC2
Top View
Internal Schematic
Pin 1 = A1 (anode 1, right below the
notch indication)
Pin 2 = C1 (cathode 1)
Pin 3 = AC2 (internally connected to
rectangular pad)
Pin 4 = A2 (anode 2)
Pin 5 = C2 (cathode 2)
Pin 6 = AC1 (internally connected to
the pad with a notch)
Ordering Information (Note 3)
Notes:
Part Number
BAV99BRLP-7
Case
DFN2020B-6
1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Packaging
3000/Tape & Reel
Marking Information
CK = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: Y = 2011)
M = Month (ex: 9 = September)
Date Code Key
Year
Code
Month
Code
2011
Y
Jan Feb
12
2012
Z
Mar
3
2013
A
Apr May
45
2014
B
Jun Jul
67
2015
C
Aug
8
Sep
9
2016
D
Oct
O
2017
E
Nov Dec
ND
BAV99BRLP
Document number: DS35317 Rev. 4 - 2
1 of 4
www.diodes.com
July 2011
© Diodes Incorporated
Datasheet
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BAV99BRLP
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Non-Repetitive Peak Reverse Voltage
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 4)
Non-Repetitive Peak Forward Surge Current
@ t = 1.0μs
@ t = 1.0ms
@ t = 1.0s
Symbol
VRM
VRRM
VRWM
VR
VR(RMS)
IFM
IFSM
Value
100
75
53
300
3.0
2.0
0.5
Unit
V
V
V
mA
A
Thermal Characteristics
Characteristic
Power Dissipation
Thermal Resistance Junction to Ambient Air
Operating and Storage Temperature Range
(Note 4)
(Note 4)
Symbol
PD
RθJA
TJ , TSTG
Value
500
250
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 5)
Symbol
V(BR)R
Min
75
Forward Voltage
VF
Reverse Current (Note 5)
IR
Total Capacitance
Reverse Recovery Time
CT
trr
Notes:
4. Device mounted on FR-4 PCB, on minimum recommended, 2oz copper pad layout.
5. Short duration pulse test used to minimize self-heating effect.
Max
0.715
0.855
1.0
1.25
2.5
50
30
25
2.0
4.0
Unit
V
V
μA
μA
μA
nA
pF
ns
Test Condition
IR = 2.5μA
IF = 1.0mA
IF = 10mA
IF = 50mA
IF = 150mA
VR = 75V
VR = 75V, TJ = 150°C
VR = 20V, TJ = 150°C
VR = 20V
VR = 0, f = 1.0MHz
IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
BAV99BRLP
Document number: DS35317 Rev. 4 - 2
2 of 4
www.diodes.com
July 2011
© Diodes Incorporated
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BAV99BRLP
500
450
400
Note 4
350
300
250
200
150
100
50
0
0 25 50 75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 1 Power Derating Curve, Total Package
10,000
1,000
1
0.1
0.01
0.001
0
0.5 1.0
1.5
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics, Per Element
2
f=1MHz
1.6
100 1.2
10 0.8
1 0.4
0.1
0
20 40
60 80 100
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 3 Typical Reverse Characteristics, Per Element
0
0 10 20 30 40
VR, DC REVERSE VOLTAGE (V)
Fig. 4 Total Capacitance vs. Reverse Voltage, Per Element
Package Outline Dimensions
A
A1
z
E E2
f
D
D2
d
f
eb
Bottom View
BAV99BRLP
Document number: DS35317 Rev. 4 - 2
A3
SEATING PLANE
L
DFN2020B-6
Dim Min Max Typ
A 0.545 0.605 0.575
A1 0 0.05 0.02
A3 ⎯ ⎯ 0.13
b 0.20 0.30 0.25
D 1.95 2.075 2.00
d ⎯ ⎯ 0.45
D2 0.50 0.70 0.60
e ⎯ ⎯ 0.65
E 1.95 2.075 2.00
E2 0.90 1.10 1.00
f ⎯ ⎯ 0.15
L 0.25 0.35 0.30
z ⎯ ⎯ 0.225
All Dimensions in mm
3 of 4
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July 2011
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Suggested Pad Layout
YC
X2
G1
G
X1
Y1
Z
G
BAV99BRLP
Dimensions Value (in mm)
Z 1.67
G 0.20
G1 0.40
X1 1.0
X2 0.45
Y 0.37
Y1 0.70
C 0.65
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
www.diodes.com
BAV99BRLP
Document number: DS35317 Rev. 4 - 2
4 of 4
www.diodes.com
July 2011
© Diodes Incorporated
Datasheet pdf - http://www.DataSheet4U.net/



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