ADXL313 Datasheet PDF - Analog Devices

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ADXL313
Analog Devices

Part Number ADXL313
Description Digital Accelerometer
Page 28 Pages


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Data Sheet
3-Axis, ±0.5 g/±1 g/±2 g/±4 g
Digital Accelerometer
ADXL313
FEATURES
GENERAL DESCRIPTION
Ultralow power (scales automatically with data rate)
The ADXL313 is a small, thin, low power, 3-axis accelerometer
As low as 30 µA in measurement mode (VS = 3.3 V)
with high resolution (13-bit) measurement up to ±4 g. Digital
As low as 0.1 µA in standby mode (VS = 3.3 V)
output data is formatted as 16-bit twos complement and is
Low noise performance
accessible through either a serial port interface (SPI) (3-wire or
150 μg/√Hz typical for X- and Y-axes
4-wire) or I2C digital interface.
250 μg/√Hz typical for the Z-axis
Embedded, patent pending FIFO technology minimizes host
processor load
User-selectable resolution
Fixed 10-bit resolution for any g range
Fixed 1024 LSB/g sensitivity for any g range
Resolution scales from 10-bit at ±0.5 g to 13-bit at ±4 g
Built-in motion detection functions for activity/inactivity
monitoring
Supply and I/O voltage range: 2.0 V to 3.6 V
SPI (3-wire and 4-wire) and I2C digital interfaces
Flexible interrupt modes mappable to two interrupt pins
Measurement range selectable via serial command
Bandwidth selectable via serial command
Wide temperature range (−40°C to +105°C)
The ADXL313 is well suited for car alarm or black box applications.
It measures the static acceleration of gravity in tilt-sensing applica-
tions, as well as dynamic acceleration resulting from motion or
shock. Its high resolution (1024 LSB/g) and low noise (150 μg/√Hz)
enable resolution of inclination changes of as little as 0.1°. A built-
in FIFO facilitates using oversampling techniques to improve
resolution to as little as 0.025° of inclination.
Several built-in sensing functions are provided. Activity and
inactivity sensing detects the presence or absence of motion and
whether the acceleration on any axis exceeds a user-set level.
These functions can be mapped to interrupt output pins. An
integrated 32-level FIFO can be used to store data to minimize
host processor intervention, resulting in reduced system power
consumption.
10,000 g shock survival
Pb free/RoHS compliant
Small and thin: 5 mm × 5 mm × 1.45 mm LFCSP package
Qualified for automotive applications
APPLICATIONS
Low power modes enable intelligent motion-based power
management with threshold sensing and active acceleration
measurement at extremely low power dissipation.
The ADXL313 is supplied in a small, thin 5 mm × 5 mm ×
1.45 mm, 32-lead LFCSP package and is pin compatible with
Car alarms
the ADXL312 accelerometer device.
Hill start aid (HSA) systems
Electronic parking brakes
Data recorders (black boxes)
FUNCTIONAL BLOCK DIAGRAM
VS VDD I/O
ADXL313
POWER
MANAGEMENT
3-AXIS
SENSOR
SENSE
ELECTRONICS
ADC
DIGITAL
FILTER
CONTROL
AND
INTERRUPT
LOGIC
INT1
INT2
32-LEVEL
FIFO
SERIAL I/O
SDA/SDI/SDIO
SDO/ALT
ADDRESS
SCL/SCLK
GND
CS
Figure 1.
Rev. 0
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
©2013 Analog Devices, Inc. All rights reserved.
Technical Support
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ADXL313
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Typical Performance Characteristics ............................................. 6
Theory of Operation ........................................................................ 8
Power Sequencing ........................................................................ 8
Power Savings ............................................................................... 8
Serial Communications ................................................................. 10
SPI................................................................................................. 10
I2C ................................................................................................. 13
Interrupts..................................................................................... 15
REVISION HISTORY
4/13—Revision 0: Initial Version
Data Sheet
FIFO ............................................................................................. 15
Self Test ........................................................................................ 16
Register Map ................................................................................... 17
Register Definitions ................................................................... 18
Applications Information .............................................................. 22
Power Supply Decoupling ......................................................... 22
Mechanical Considerations for Mounting.............................. 22
Threshold .................................................................................... 22
Link Mode ................................................................................... 22
Sleep Mode vs. Low Power Mode............................................. 22
Using Self Test............................................................................. 23
3200 Hz and 1600 Hz ODR Data Formatting ........................ 24
Axes of Acceleration Sensitivity ............................................... 25
Solder Profile................................................................................... 26
Outline Dimensions ....................................................................... 27
Ordering Guide .......................................................................... 28
Automotive Products ................................................................. 28
Rev. 0 | Page 2 of 28



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Data Sheet
ADXL313
SPECIFICATIONS
TA = −40°C to +105°C, VS = VDD I/O = 3.3 V, acceleration = 0 g, unless otherwise noted.
Table 1.
Parameter 1
SENSOR INPUT
Measurement Range
Nonlinearity
Micro-Nonlinearity
Interaxis Alignment Error
Cross-Axis Sensitivity2
OUTPUT RESOLUTION
All g Ranges
±0.5 g Range
±1 g Range
±2 g Range
±4 g Range
SENSITIVITY
Sensitivity at XOUT, YOUT, ZOUT
Sensitivity Change Due to Temperature
0 g BIAS LEVEL
Initial 0 g Output
0 g Output Drift over Temperature
0 g Offset Tempco
NOISE PERFORMANCE
Noise Density
RMS Noise
OUTPUT DATA RATE/BANDWIDTH
Measurement Rate3
SELF TEST4
Output Change in X-Axis
Output Change in Y-Axis
Output Change in Z-Axis
POWER SUPPLY
Operating Voltage Range (VS)
Interface Voltage Range (VDD I/O)
Supply Current
Standby Mode Leakage Current
Turn-On (Wake-Up) Time5
TEMPERATURE
Operating Temperature Range
Test Conditions/Comments
Each axis
User selectable
Percentage of full scale
Measured over any 50 mg interval
Each axis
Default resolution
Full resolution enabled
Full resolution enabled
Full resolution enabled
Full resolution enabled
Each axis
Any g-range, full resolution mode
±0.5 g, 10-bit or full resolution
±1 g, 10-bit resolution
±2 g, 10-bit resolution
±4 g, 10-bit resolution
Each axis
T = 25°C, XOUT, YOUT
T = 25°C, ZOUT
−40°C < T < +105°C, XOUT, YOUT, referenced to initial 0 g output
−40°C < T < +105°C, ZOUT, referenced to initial 0 g output
XOUT, YOUT
ZOUT
X-, Y-axes
Z-axis
X-, Y-axes, 100 Hz output data rate (ODR)
Z-axis, 100 Hz ODR
User selectable
Data rate ≥ 100 Hz, 2.0 V ≤ VS ≤ 3.6 V
Data rate > 100 Hz
Data rate < 10 Hz
Min Typ
Max Unit
±0.5, ±1, ±2, ±4
±0.5
±2
±0.1
±1
g
%
%
Degrees
%
10 Bits
10 Bits
11 Bits
12 Bits
13 Bits
1024
921 1024
460 512
230 256
115 128
±0.01
1126
563
282
141
LSB/g
LSB/g
LSB/g
LSB/g
LSB/g
%/°C
−125
−200
±50
±75
±0.5
±0.75
+125
+200
mg
mg
mg
mg
mg/°C
mg/°C
150 µg/√Hz
250 µg/√Hz
1.5 mg rms
2.5 mg rms
6.25 3200 Hz
0.20
−2.36
0.30
2.36
−0.20
3.70
g
g
g
2.0
1.7
100 170
30 55
0.1
1.4
3.6 V
VS V
300 µA
110 µA
2 µA
ms
−40 +105 °C
1 All minimum and maximum specifications are guaranteed. Typical specifications are not guaranteed.
2 Cross-axis sensitivity is defined as coupling between any two axes.
3 Bandwidth is half the output data rate.
4 Self test change is defined as the output (g) when the SELF_TEST bit = 1 (in the DATA_FORMAT register, Address 0x31) minus the output (g) when the SELF_TEST bit =
0 (in the DATA_FORMAT register). Due to device filtering, the output reaches its final value after 4 × τ when enabling or disabling self test, where τ = 1/(data rate).
5 Turn-on and wake-up times are determined by the user-defined bandwidth. At a 100 Hz data rate, the turn-on and wake-up times are each approximately 11.1 ms. For
other data rates, the turn-on and wake-up times are each approximately τ + 1.1 in milliseconds, where τ = 1/(data rate).
Rev. 0 | Page 3 of 28



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ADXL313
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Acceleration
Any Axis, Unpowered
Any Axis, Powered
VS
VDD I/O
All Other Pins
Output Short-Circuit Duration
(Any Pin to Ground)
Temperature Range
Powered
Storage
Rating
10,000 g
10,000 g
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to VDD I/O + 0.3 V or 3.9 V,
whichever is less
Indefinite
−40°C to +125°C
−40°C to +125°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Data Sheet
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
32-Lead LFCSP Package
θJA
27.27
θJC
30
Unit
°C/W
ESD CAUTION
Rev. 0 | Page 4 of 28



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