ADXL312 Datasheet PDF - Analog Devices

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ADXL312
Analog Devices

Part Number ADXL312
Description Digital Accelerometer
Page 30 Pages


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3-Axis, ±1.5 g/±3 g/±6 g/±12 g
Digital Accelerometer
ADXL312
FEATURES
GENERAL DESCRIPTION
Ultralow power: as low as 57 μA in measurement mode and
0.1 μA in standby mode at VS = 3.3 V (typical)
Power consumption scales automatically with bandwidth
User-selectable resolution
Fixed 10-bit resolution
Full resolution, where resolution increases with g range,
up to 13-bit resolution at ±12 g (maintaining 2.9 mg/LSB
scale factor in all g ranges)
Embedded, patent pending FIFO technology minimizes host
processor load
Built-in motion detection functions for activity/inactivity
monitoring
Supply and I/O voltage range: 2.0 V to 3.6 V
SPI (3- and 4-wire) and I2C digital interfaces
Flexible interrupt modes mappable to either interrupt pin
Measurement ranges selectable via serial command
Bandwidth selectable via serial command
Wide temperature range (−40 to +105°C)
10,000 g shock survival
Pb free/RoHS compliant
Small and thin: 5 mm × 5 mm × 1.45 mm LFCSP package
Qualified for automotive applications
The ADXL312 is a small, thin, low power, 3-axis accelerometer
with high resolution (13-bit) measurement up to ±12 g. Digital
output data is formatted as 16-bit twos complement and is
accessible through either a SPI (3- or 4-wire) or I2C digital
interface.
The ADXL312 is well suited for car alarm or black box applica-
tions. It measures the static acceleration of gravity in tilt-sensing
applications, as well as dynamic acceleration resulting from
motion or shock. Its high resolution (2.9 mg/LSB) enables
resolution of inclination changes of as little as 0.25°. A built-in
FIFO facilitates using oversampling techniques to improve
resolution to as little as 0.05° of inclination.
Several special sensing functions are provided. Activity and
inactivity sensing detects the presence or absence of motion and
whether the acceleration on any axis exceeds a user-set level.
These functions can be mapped to interrupt output pins. An
integrated 32 level FIFO can be used to store data to minimize
host processor intervention.
Low power modes enable intelligent motion-based power
management with threshold sensing and active acceleration
measurement at extremely low power dissipation.
APPLICATIONS
Car alarm
Hill start aid (HSA)
Electronic parking brake
Data recorder (black box)
The ADXL312 is supplied in a small, thin 5 mm × 5 mm ×
1.45 mm, 32-lead, LFCSP package.
FUNCTIONAL BLOCK DIAGRAM
VS VDD I/O
ADXL312
POWER
MANAGEMENT
3-AXIS
SENSOR
SENSE
ELECTRONICS
ADC
DIGITAL
FILTER
CONTROL
AND
INTERRUPT
LOGIC
INT1
INT2
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32 LEVEL
FIFO
SERIAL I/O
GND
CS
Figure 1. ADXL312 Simplified Block Diagram
SDA/SDI/SDIO
SDO/ALT
ADDRESS
SCL/SCLK
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2010 Analog Devices, Inc. All rights reserved.



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ADXL312
TABLE OF CONTENTS
Features .............................................................................................. 1 
Applications....................................................................................... 1 
General Description ......................................................................... 1 
Functional Block Diagram .............................................................. 1 
Revision History ............................................................................... 2 
Specifications..................................................................................... 3 
Absolute Maximum Ratings............................................................ 5 
Thermal Resistance ...................................................................... 5 
ESD Caution.................................................................................. 5 
Pin Configuration and Function Descriptions............................. 6 
Typical Performance Characteristics ............................................. 7 
Theory of Operation ...................................................................... 10 
Power Sequencing ...................................................................... 10 
Power Savings ............................................................................. 10 
Serial Communications ................................................................. 12 
SPI................................................................................................. 12 
I2C ................................................................................................. 15 
Interrupts..................................................................................... 17 
REVISION HISTORY
Revision 0: Initial Version
FIFO ............................................................................................. 18 
Self-Test ....................................................................................... 19 
Register Map ................................................................................... 20 
Register Definitions ................................................................... 21 
Applications Information .............................................................. 25 
Power Supply Decoupling ......................................................... 25 
Mechanical Considerations for Mounting.............................. 25 
Threshold .................................................................................... 25 
Link Mode ................................................................................... 25 
Sleep Mode vs. Low Power Mode............................................. 25 
Using Self-Test ............................................................................ 26 
Data Formatting of Upper Data Rates..................................... 27 
Noise Performance ..................................................................... 28 
Axes of Acceleration Sensitivity ............................................... 29 
Solder Profile................................................................................... 30 
Outline Dimensions ....................................................................... 31 
Ordering Guide .......................................................................... 32 
Automotive Products ................................................................. 32 
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Rev. 0 | Page 2 of 32



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SPECIFICATIONS
TA = −40°C to +105°C, VS = VDD I/O = 3.3 V, acceleration = 0 g, unless otherwise noted.
Table 1. Specifications1
Parameter
SENSOR INPUT
Measurement Range
Nonlinearity
Inter-Axis Alignment Error
Cross-Axis Sensitivity2
OUTPUT RESOLUTION
All g Ranges
±1.5 g Range
±3 g Range
±6 g Range
±12 g Range
SENSITIVITY
Scale Factor at XOUT, YOUT, ZOUT
Scale Factor at XOUT, YOUT, ZOUT
Scale Factor at XOUT, YOUT, ZOUT
Scale Factor at XOUT, YOUT, ZOUT
Conditions
Each axis
User selectable
Percentage of full scale
Min
Each axis
Default resolution
Full resolution enabled
Full resolution enabled
Full resolution enabled
Full resolution enabled
Each axis
±1.5 g, 10-bit or full resolution
±3 g, 10-bit resolution
±6 g, 10-bit resolution
±12 g, 10-bit resolution
2.6
5.2
10.4
20.9
Sensitivity at XOUT, YOUT, ZOUT
Sensitivity at XOUT, YOUT, ZOUT
Sensitivity at XOUT, YOUT, ZOUT
Sensitivity at XOUT, YOUT, ZOUT
Sensitivity Change Due to Temperature
0 g BIAS LEVEL
Initial 0 g Output
Initial 0 g Output
0 g Output over Temperature
0 g Offset Tempco
0 g Offset Tempco
NOISE PERFORMANCE
Noise Density (X-, Y-axes)
Noise Density (Z-axis)
OUTPUT DATA RATE/BANDWIDTH
Measurement Rate3
SELF-TEST4
Output Change in X-Axis
Output Change in Y-Axis
Output Change in Z-Axis
POWER SUPPLY
Operating Voltage Range (VS)
Interface Voltage Range (VDD I/O)
www.DaStuaSphpelyeCt4uUrr.ecnotm
Standby Mode Leakage Current
Turn-On (Wale-Up) Time5
TEMPERATURE
Operating Temperature Range
±1.5 g, 10-bit or full resolution
±3 g, 10-bit resolution
±6 g, 10-bit resolution
±12 g, 10-bit resolution
Each axis
T = 25°C, XOUT, YOUT
T = 25°C, ZOUT
−40°C < T < 105°C, XOUT, YOUT, ZOUT
XOUT, YOUT
ZOUT
User selectable
Data rate ≥ 100 Hz, 2.0 ≤ VS ≤ 3.6
Data rate > 100 Hz
Data rate < 10 Hz
312
156
78
39
−150
−250
−250
200
200
6.25
0.20
−2.10
0.30
2.0
1.7
100
30
−40
ADXL312
Typ
±1.5, 3, 6, 12
±0.5
±0.1
±1
10
10
11
12
13
2.9
5.8
11.6
23.2
345
172
86
43
±0.01
±0.8
±1.5
340
470
170
55
0.1
1.4
Max
3.2
6.4
12.8
25.5
385
192
96
48
+150
+250
+250
440
595
3200
2.10
−0.20
3.40
3.6
VS
300
110
2
+105
Unit
g
%
Degrees
%
Bits
Bits
Bits
Bits
Bits
mg/LSB
mg/LSB
mg/LSB
mg/LSB
LSB/g
LSB/g
LSB/g
LSB/g
%/°C
mg
mg
mg
mg/°C
mg/°C
μg/√Hz
μg/√Hz
Hz
g
g
g
V
V
μA
μA
μA
ms
°C
Rev. 0 | Page 3 of 32



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ADXL312
1 All minimum and maximum specifications are guaranteed. Typical specifications are not guaranteed.
2 Cross-axis sensitivity is defined as coupling between any two axes.
3 Bandwidth is half the output data rate.
4 Self-test change is defined as the output (g) when the SELF_TEST bit = 1 (in the DATA_FORMAT register) minus the output (g) when the SELF_TEST bit = 0 (in the
DATA_FORMAT register). Due to device filtering, the output reaches its final value after 4 × τ when enabling or disabling self-test, where τ = 1/(data rate).
5 Turn-on and wake-up times are determined by the user-defined bandwidth. At a 100 Hz data rate, the turn-on and wake-up times are each approximately 11.1 ms. For
other data rates, the turn-on and wake-up times are each approximately τ + 1.1 in milliseconds, where τ = 1/(data rate).
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Rev. 0 | Page 4 of 32



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