25Q16 Datasheet PDF - Winbond

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25Q16
Winbond

Part Number 25Q16
Description W25Q16
Page 30 Pages


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W25Q80, W25Q16, W25Q32
8M-BIT, 16M-BIT AND 32M-BIT
SERIAL FLASH MEMORY WITH
DUAL AND QUAD SPI
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Publication Release Date: September 26, 2007
- 1 - Preliminary - Revision B
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W25Q80, W25Q16, W25Q32
Table of Contents
1. GENERAL DESCRIPTION ......................................................................................................... 5
2. FEATURES ................................................................................................................................. 5
3. PIN CONFIGURATION SOIC 208-MIL....................................................................................... 6
4. PAD CONFIGURATION WSON 6X5-MM .................................................................................. 6
5. PIN DESCRIPTION SOIC 208-MIL, AND WSON 6X5-MM........................................................ 6
6. PIN CONFIGURATION SOIC 300-MIL....................................................................................... 7
7. PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 7
7.1 Package Types ............................................................................................................... 8
7.2 Chip Select (/CS) ............................................................................................................ 8
7.3 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .............................. 8
7.4 Write Protect (/WP)......................................................................................................... 8
7.5 HOLD (/HOLD) ............................................................................................................... 8
7.6 Serial Clock (CLK) .......................................................................................................... 8
8. BLOCK DIAGRAM ...................................................................................................................... 9
9. FUNCTIONAL DESCRIPTION ................................................................................................. 10
9.1 SPI OPERATIONS .............................ht.tp://ww.w.Da.taShe.et4U..net/ ..................................................................... 10
9.1.1 Standard SPI Instructions...............................................................................................10
9.1.2 Dual SPI Instructions ......................................................................................................10
9.1.3 Quad SPI Instructions.....................................................................................................10
9.1.4 Hold Function .................................................................................................................10
9.2 WRITE PROTECTION.................................................................................................. 11
9.2.1 Write Protect Features....................................................................................................11
10. CONTROL AND STATUS REGISTERS................................................................................... 12
10.1
STATUS REGISTER .................................................................................................... 12
10.1.1 BUSY............................................................................................................................12
10.1.2 Write Enable Latch (WEL) ............................................................................................12
10.1.3 Block Protect Bits (BP2, BP1, BP0)..............................................................................12
10.1.4 Top/Bottom Block Protect (TB).....................................................................................12
10.1.5 Sector/Block Protect (SEC) ..........................................................................................12
10.1.6 Status Register Protect (SRP1, SRP0).........................................................................13
10.1.7 Quad Enable (QE) ........................................................................................................13
10.1.8 Status Register Memory Protection ..............................................................................15
10.2
INSTRUCTIONS........................................................................................................... 18
10.2.1 Manufacturer and Device Identification ........................................................................18
10.2.2 Instruction Set Table 1..................................................................................................19
10.2.3 Instruction Set Table 2 (Read Instructions) ..................................................................20
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W25Q80, W25Q16, W25Q32
10.2.4 Write Enable (06h)........................................................................................................21
10.2.5 Write Disable (04h).......................................................................................................21
10.2.6 Read Status Register-1 (05h) and Read Status Register-2 (35h).................................22
10.2.7 Write Status Register (01h) ..........................................................................................23
10.2.8 Read Data (03h) ...........................................................................................................24
10.2.9 Fast Read (0Bh) ...........................................................................................................25
10.2.10 Fast Read Dual Output (3Bh) .....................................................................................26
10.2.11 Fast Read Quad Output (6Bh)....................................................................................27
10.2.12 Fast Read Dual I/O (BBh)...........................................................................................28
10.2.13 Fast Read Quad I/O (EBh) .........................................................................................30
10.2.14 Page Program (02h) ...................................................................................................32
10.2.15 Quad Input Page Program (32h) ................................................................................33
10.2.16 Sector Erase (20h) .....................................................................................................34
10.2.17 32KB Block Erase (52h) .............................................................................................35
10.2.18 64KB Block Erase (D8h).............................................................................................36
10.2.19 Chip Erase (C7h / 60h)...............................................................................................37
10.2.20 Erase Suspend (75h)..................................................................................................38
10.2.21 Erase Resume (7Ah) ..................................................................................................38
10.2.22 Power-down (B9h) ......................................................................................................39
10.2.23
10.2.24
High Performance Mode (A3h) ...................................................................................40
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Release Power-down or High Performance Mode / Device ID (ABh) .........................40
10.2.25 Read Manufacturer / Device ID (90h) .........................................................................42
10.2.26 Read Unique ID Number ............................................................................................43
10.2.27 JEDEC ID (9Fh) .........................................................................................................44
10.2.28 Mode Bit Reset (FFh or FFFFh) .................................................................................45
11. ELECTRICAL CHARACTERISTICS (PRELIMINARY)............................................................. 46
11.1 Absolute Maximum Ratings .......................................................................................... 46
11.2 Operating Ranges......................................................................................................... 46
11.3 Endurance and Data Retention .................................................................................... 47
11.4 Power-up Timing and Write Inhibit Threshold .............................................................. 47
11.5 DC Electrical Characteristics ........................................................................................ 48
11.6 AC Measurement Conditions........................................................................................ 49
11.7 AC Electrical Characteristics ........................................................................................ 50
11.8 AC Electrical Characteristics (cont’d) ........................................................................... 51
11.9 Serial Output Timing ..................................................................................................... 52
11.10 Input Timing................................................................................................................. 52
11.11 Hold Timing ................................................................................................................. 52
12. PACKAGE SPECIFICATION .................................................................................................... 53
Publication Release Date: September 26, 2007
- 3 - Preliminary - Revision B
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W25Q80, W25Q16, W25Q32
12.1 8-Pin SOIC 208-mil (Package Code SS)...................................................................... 53
12.2 8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 54
12.3 8-contact 6x5 WSON (Package Code ZP) ................................................................... 55
12.4 8-contact 6x5 WSON Cont’d. ....................................................................................... 56
12.5 16-Pin SOIC 300-mil (Package Code SF) .................................................................... 57
13. ORDERING INFORMATION .................................................................................................... 58
13.1 Valid Part Numbers and Top Side Marking .................................................................. 59
14. REVISION HISTORY ................................................................................................................ 60
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