1SS400T1 Datasheet PDF - ON Semiconductor

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1SS400T1
ON Semiconductor

Part Number 1SS400T1
Description High Speed Switching Diode
Page 3 Pages


1SS400T1 datasheet pdf
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1SS400T1
Preferred Device
High−Speed
Switching Diode
Features
High−Speed Switching Applications
Lead Finish: 100% Matte Sn (Tin)
Qualified Maximum Reflow Temperature: 260°C
Extremely Small SOD−523 Package
This is a Pb−Free Device
MAXIMUM RATINGS (TA = 25°C)
Rating
Reverse Voltage
Forward Current
Peak Forward Surge Current
THERMAL CHARACTERISTICS
Symbol
VR
IF
IFM(surge)
Max
100
200
500
Unit
V
mAdc
mAdc
Characteristic
Total Device Dissipation
FR−5 Board (Note 1) @TA = 25°C
Derate above 25°C
Symbol
PD
Max Unit
200 mW
1.57 mW/°C
Thermal Resistance, Junction-to-Ambient RqJA
635 °C/W
Junction and Storage Temperature
TJ, Tstg
150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 @ Minimum Pad.
ELECTRICAL CHARACTERISTICS
Characteristic
OFF CHARACTERISTICS
Reverse Voltage Leakage Current
(VR = 80 Vdc)
Diode Capacitance
(VR = 0 V, f = 1.0 MHz)
Forward Voltage
(IF = 100 mAdc)
Reverse Recovery Time
(IF = IR = 10 mAdc)
Symbol
IR
CD
VF
trr
Min Max
− 0.1
− 3.0
− 1.2
− 4.0
Unit
mAdc
pF
Vdc
ns
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1
CATHODE
2
ANODE
1
SOD−523
CASE 502
PLASTIC
MARKING DIAGRAM
AMG
G
1
A = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending upon
manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping
1SS400T1
SOD−523* 3000/Tape & Reel
1SS400T1G
SOD−523* 3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*This package is inherently Pb−Free.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2006
December, 2006 − Rev. 4
1
Publication Order Number:
1SS400T1/D



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+10 V
820 W
2.0 k
100 mH
0.1 mF
IF
50 W OUTPUT
PULSE
GENERATOR
DUT
1SS400T1
0.1 mF
tr tp
10%
t
50 W INPUT
SAMPLING
OSCILLOSCOPE
VR
90%
INPUT SIGNAL
IF
trr t
iR(REC) = 1.0 mA
IR
OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)
Notes: 1. A 2.0 kW variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp » trr
Figure 1. Recovery Time Equivalent Test Circuit
100 10
TA = 85°C
10
TA = −40°C
1.0
TA = 25°C
0.1
1.0
0.01
0.1
0.2
0.4 0.6 0.8 1.0
VF, FORWARD VOLTAGE (VOLTS)
Figure 2. Forward Voltage
0.001
1.2 0
0.68
TA = 150°C
TA = 125°C
TA = 85°C
TA = 55°C
TA = 25°C
10 20 30 40
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Leakage Current
50
0.64
0.60
0.56
0.52
0
2.0 4.0 6.0
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Capacitance
8.0
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1SS400T1
PACKAGE DIMENSIONS
SOD−523
CASE 502−01
ISSUE B
A
1
D 2 PL
0.08 (0.003) M T X Y
−X−
−Y−
B
2
C
K −T−
J
SEATING
S PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
MILLIMETERS
INCHES
DIM MIN NOM MAX MIN NOM MAX
A 1.10 1.20 1.30 0.043 0.047 0.051
B 0.70 0.80 0.90 0.028 0.032 0.035
C 0.50 0.60 0.70 0.020 0.024 0.028
D 0.25 0.30 0.35 0.010 0.012 0.014
J 0.07 0.14 0.20 0.0028 0.0055 0.0079
K 0.15 0.20 0.25 0.006 0.008 0.010
S 1.50 1.60 1.70 0.059 0.063 0.067
SOLDERING FOOTPRINT*
1.40
0.0547
0.40
0.0157
0.40
0.0157
ǒ ǓSCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
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3
1SS400T1/D



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