1812xxxx Datasheet PDF - AVX Corporation

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1812xxxx
AVX Corporation

Part Number 1812xxxx
Description C0G Dielectric
Page 20 Pages


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CGe0neGral(NSpPec0if)ict4DaUtii.oecnolsmectric C0G (NP0) is the most popular formulation of the “tempera-
ture-compensating,” EIA Class I ceramic materials. Modern
e C0G (NP0) formulations contain neodymium, samarium and
he other rare earth oxides.
S C0G (NP0) ceramics offer one of the most stable capacitor
ta dielectrics available. Capacitance change with temperature
a is 0 ±30ppm/°C which is less than ±0.3% C from -55°C
to +125°C. Capacitance drift or hysteresis for C0G (NP0)
.D ceramics is negligible at less than ±0.05% versus up to
w ±2% for films. Typical capacitance change with life is less
w than ±0.1% for C0G (NP0), one-fifth that shown by most
other dielectrics. C0G (NP0) formulations show no aging
w characteristics.
mThe C0G (NP0) formulation usually has a “Q” in excess
of 1000 and shows little capacitance or “Q” changes with
ofrequency. Their dielectric absorption is typically less than
.c0.6% which is similar to mica and most films.
UPART NUMBER (see page 2 for complete part number explanation)
t40805
5
A 101 J
A
T
2
A
eSize
taShe(L" x W")
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
50V = 5
100V = 1
200V = 2
Dielectric
C0G (NP0) = A
Capacitance Capacitance
Failure
Terminations Packaging
Code (In pF) Tolerance
Rate
T = Plated Ni 2 = 7" Reel
2 Sig. Digits + B = ±.10 pF
A = Not
and Sn
4 = 13" Reel
Number of
Zeros
C = ±.25 pF Applicable
D = ±.50 pF
F = ±1% (25 pF)
G = ±2% (13 pF)
J = ±5%
K = ±10%
7 = Gold Plated
7 = Bulk Cass.
9 = Bulk
Contact
Factory For
1 = Pd/Ag Term
Contact
Factory
For
Multiples
Special
Code
A = Std.
Product
aTemperature Coefficient
.D+0.5
w0
-0.5
Typical Capacitance Change
Envelope: 0 ± 30 ppm/°C
Capacitance vs. Frequency
+2
+1
0
-1
-2
Insulation Resistance vs Temperature
10,000
1,000
100
w m-55 -35 -15 +5 +25 +45 +65 +85 +105 +125
w oTemperature °C
.cVariation of Impedance with Cap Value
Impedance vs. Frequency
U0805 - C0G (NP0)
t410 pF vs. 100 pF vs. 1000 pF
100,000
e10,000
he1,000
S100
ta10.0
10 pF
a1.0
.D0.1
w1
10 100
Frequency, MHz
100 pF
1000 pF
1000
ww4
1KHz
10 KHz
100 KHz
Frequency
1 MHz
10 MHz
Variation of Impedance with Chip Size
Impedance vs. Frequency
1000 pF - C0G (NP0)
10
1206
0805
1812
1210
1.0
0.1
10
100
Frequency, MHz
1000
0
0 20 40 60 80
Temperature °C
100
Variation of Impedance with Ceramic Formulation
Impedance vs. Frequency
1000 pF - C0G (NP0) vs X7R
0805
10.00
X7R
NPO
1.00
0.10
0.01
10
100
Frequency, MHz
1000



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C0G (NP0) Dielectric
Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
Q
Insulation Resistance
Dielectric Strength
Resistance to
Flexure
Stresses
Appearance
Capacitance
Variation
Q
Insulation
Resistance
Solderability
Appearance
Capacitance
Variation
Resistance to
Solder Heat
Q
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
NP0 Specification Limits
-55ºC to +125ºC
Within specified tolerance
<30 pF: Q400+20 x Cap Value
30 pF: Q1000
100,000Mor 1000M- µF,
whichever is less
No breakdown or visual defects
No defects
±5% or ±.5 pF, whichever is greater
Meets Initial Values (As Above)
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 MHz ± 10% for cap 1000 pF
1.0 kHz ± 10% for cap > 1000 pF
Voltage: 1.0Vrms ± .2V
Charge device with rated voltage for
60 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Deflection: 2mm
Test Time: 30 seconds
1mm/sec
Initial Value x 0.3
95% of each terminal should be covered
with fresh solder
No defects, <25% leaching of either end terminal
±2.5% or ±.25 pF, whichever is greater
Meets Initial Values (As Above)
Meets Initial Values (As Above)
90 mm
Dip device in eutectic solder at 230 ± 5ºC
for 5.0 ± 0.5 seconds
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24 ± 2
hours before measuring electrical properties.
Meets Initial Values (As Above)
No visual defects
±2.5% or ±.25 pF, whichever is greater
Step 1: -55ºC ± 2º
Step 2: Room Temp
30 ± 3 minutes
3 minutes
Thermal
Shock
Load Life
Load
Humidity
Q
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Q
(C=Nominal Cap)
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Q
Insulation
Resistance
Dielectric
Strength
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
±3.0% or ± .3 pF, whichever is greater
30 pF:
10 pF, <30 pF:
<10 pF:
Q350
Q275 +5C/2
Q200 +10C
Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
No visual defects
±5.0% or ± .5 pF, whichever is greater
30 pF:
10 pF, <30 pF:
<10 pF:
Q350
Q275 +5C/2
Q200 +10C
Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
Step 3: +125ºC ± 2º 30 ± 3 minutes
Step 4: Room Temp 3 minutes
Repeat for 5 cycles and measure after
24 hours at room temperature
Charge device with twice rated voltage in
test chamber set at 125ºC ± 2ºC
for 1000 hours (+48, -0).
Remove from test chamber and stabilize at
room temperature for 24 hours
before measuring.
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
Remove from chamber and stabilize at
room temperature for 24 ± 2 hours
before measuring.
5



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C0G (NP0) Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Soldering
Packaging
L) Length
MM
(in.)
(W) Width
MM
(in.)
(t) Terminal
MM
(in.)
WVDC
Cap 0.5
(pF) 1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
Cap 0.010
(µF) 0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.068
0.082
0.1
WVDC
SIZE
Letter
A
Max.
0.33
Thickness (0.013)
0201
Reflow Only
All Paper
0.60 ± 0.03
(0.024 ± 0.001)
0.30 ± 0.03
(0.011 ± 0.001)
0.15 ± 0.05
(0.006 ± 0.002)
10 16 25
AA A
AA A
AA A
AA A
AA A
AA A
AA A
AA A
AA A
AA A
AA A
AA A
AA A
AA A
AA A
AA A
AA A
AA A
AA A
AA A
AA
AA
AA
AA
A
A
0402
Reflow Only
All Paper
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
16 25 50
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
CC
CC
L
t
W
T
10 16 25
0201
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
16 25 50
0402
G
0.86
(0.034)
J
0.94
(0.037)
Contact Factory for Multiples
6
0603 0805
Reflow/Wave
Reflow/Wave
All Paper
Paper/Embossed
1.60 ± 0.15
(0.063 ± 0.006)
2.01 ± 0.20
(0.079 ± 0.008)
0.81 ± 0.15
(0.032 ± 0.006)
1.25 ± 0.20
(0.049 ± 0.008)
0.35 ± 0.15
(0.014 ± 0.006)
0.50 ± 0.25
(0.020 ± 0.010)
6.3
25 50 100
16
25 50 100 200 16
G
GG
G
EEE
EJ
J
G
GG
G
EEE
EJ
J
G
GG
G
EEE
EJ
J
G
GG
G
EEE
EJ
J
G
GG
G
EEE
EJ
J
G
GG
G
EEE
EJ
J
G
GG
G
EEE
EJ
J
G
GG
G
EEE
EJ
J
G
GG
G
EEE
EJ
J
G
GG
G
EEE
EJ
J
G
GG
G
EEE
EJ
J
G
GG
G
EEE
EJ
J
G
GG
G
EEE
EJ
J
G
GG
G
EEE
EJ
J
G
GG
G
EEE
EJ
J
G
GG
G
EEE
EJ
J
G
GG
G
EEE
EJ
J
G
GG
G
EEE
EJ
J
G
GG
G
EEE
EJ
J
G
GG
G
EEE
EJ
J
G
GG
G
EEE
E
J
J
G
GG
G
EEE
E
J
J
G
GG
G
EEE
E
J
J
G
GG
G
EEE
E
J
J
G
GG
G
EEE
EJ
J
G
GG
G
EEE
EJ
J
G
GG
G
EEE
E
J
J
G
GG
G
EEE
E
J
J
G
GG
G
EEE
E
J
J
G
GG
G
EEE
E
J
J
G
GG
G
EEE
JM
J
G
GG
G
EEE
JM
J
G GG
JJJ JM J
G GG
JJJ JM J
G GG
JJJ J
J
G GG
JJJ J
J
G GG
JJJ J
J
G GG
JJJ J
J
GG
JJJ
J
GG
JJJ
J
JJJ
J
J JM
J
J JM
J
NN
J
NN
J
NN
J
NN
J
NM
NM
NM
M
M
1206
Reflow/Wave
Paper/Embossed
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
25 50 100
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JJ
J JM
J MM
J MP
J MP
J MP
J MP
J MP
JM
M
M
M
M
M
200
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
Q
Q
Q
6.3 25 50
0603
K
1.02
(0.040)
M
1.27
(0.050)
100
N
1.40
(0.055)
16 25 50 100 200 16
0805
P
1.52
(0.060)
Q
1.78
(0.070)
X
2.29
(0.090)
EMBOSSED
Y
2.54
(0.100)
25 50 100
1206
200
Z
2.79
(0.110)
BB
3.05
(0.120)
CC
3.175
(0.125)



No Preview Available !

C0G (NP0) Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Soldering
Packaging
(L) Length
MM
(in.)
(W) Width
MM
(in.)
(t) Terminal
MM
(in.)
WVDC
Cap 0.5
(pF) 1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
Cap 0.010
(µF) 0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.068
0.082
0.1
WVDC
SIZE
Letter
A
Max.
0.33
Thickness (0.013)
1210
Reflow/Wave
Paper/Embossed
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
25 50
100
200
25`
JJ J J
JJ J J
JJ J J
JJ
JJ
JJ
JJ
JM
JM
JJ
JJ
JJ
JM
MQ
MQ
JJ
JJ
JJ
M
M
M
JJ
JJ
JJ
M
M
NN
NN
25 50
100 200
1210
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
G
0.86
(0.034)
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
CC
CC
CC
CC
25
J
0.94
(0.037)
Contact Factory for Multiples
1812
Reflow Only
All Embossed
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
0.61 ± 0.36
(0.024 ± 0.014)
50 100
200
1825
Reflow Only
All Embossed
4.50 ± 0.30
(0.177 ± 0.012)
6.40 ± 0.40
(0.252 ± 0.016)
0.61 ± 0.36
(0.024 ± 0.014)
50 100 200
2220
Reflow Only
All Embossed
5.70 ± 0.40
(0.224 ± 0.016)
5.00 ± 0.40
(0.197 ± 0.016)
0.64 ± 0.39
(0.025 ± 0.015)
50 100
200
2225
Reflow Only
All Embossed
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
0.64 ± 0.39
(0.025 ± 0.015)
50 100 200
L
t
W
T
KK
KK
KK
KK
KK
KK
KK
KK
KK
MM
MM
PX
PX
PX
PX
P
CC
CC
CC
CC
CC
CC
CC
CC
50 100
1812
K
K
K
K
K
P
P
P
P
P
X
X
X
200
M MM
M MM
M MM
M MM
M MM
M MM
M MM
M MM
M MM
M MM
M MM
MM
MM
MM
PM
PM
P
P
P
P
P
50 100 200
1825
XX
XX
XX
XX
XX
XX
XX
XX
XX
XX
XX
XX
XX
XX
XX
XX
XX
XX
XX
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
50 100
200
2220
P PP
P PP
P PP
P PP
P PP
P PP
P PP
P PP
P PP
P PP
P PP
P PP
P PP
P PP
P PY
P PY
P YY
P YY
P YY
P YY
P
P
P
P
50 100 200
2225
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
P
1.52
(0.060)
Q
1.78
(0.070)
X
2.29
(0.090)
EMBOSSED
Y
2.54
(0.100)
Z
2.79
(0.110)
BB
3.05
(0.120)
CC
3.175
(0.125)
7



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