1210Axxxx Datasheet PDF - AVX Corporation

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1210Axxxx
AVX Corporation

Part Number 1210Axxxx
Description X7R Dielectric
Page 20 Pages


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XGe7nReraDl Sipeelceifcict4taUrtii.occnosm X7R formulations are called “temperature stable” ceramics
and fall into EIA Class II materials. X7R is the most popular
e of these intermediate dielectric constant materials. Its tem-
he perature variation of capacitance is within ±15% from
-55°C to +125°C. This capacitance change is non-linear.
taS Capacitance for X7R varies under the influence of electrical
a operating conditions such as voltage and frequency.
.D X7R dielectric chip usage covers the broad spectrum of
industrial applications where known changes in capaci-
w tance due to applied voltages are acceptable.
ww .comPART NUMBER (see page 2 for complete part number explanation)
U0805
5
C 103 M
A
T
2
A
t4Size
Shee(L" x W")
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
50V = 5
100V = 1
200V = 2
Dielectric
X7R = C
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
Capacitance
Tolerance
Preferred
J = ± 5%
K = ±10%
M = ± 20%
Failure
Rate
A = Not
Applicable
Terminations
T = Plated Ni
and Sn
7 = Gold
Plated
Packaging
2 = 7" Reel
4 = 13" Reel
7 = Bulk Cass.
9 = Bulk
Contact
Factory For
Multiples
Special
Code
A = Std.
Product
taX7R Dielectric
Typical Temperature Coefficient
10
a5
0
.D-5
-10
-15
w-20
-25
-60 -40 -20 0 20 40 60 80 100 120 140
wTemperature °C
w mVariation of Impedance with Cap Value
oImpedance vs. Frequency
.c1,000 pF vs. 10,000 pF - X7R
0805
t4U10.00
1,000 pF
10,000 pF
e1.00
Capacitance vs. Frequency
+30
+20
+10
0
-10
-20
-30
1KHz
10 KHz
100 KHz
Frequency
1 MHz
10 MHz
Insulation Resistance vs Temperature
10,000
1,000
100
0
0 20 40 60 80 100 120
Temperature °C
Variation of Impedance with Chip Size
Impedance vs. Frequency
10,000 pF - X7R
10 1206
0805
1210
1.0
Variation of Impedance with Chip Size
Impedance vs. Frequency
100,000 pF - X7R
10
1206
0805
1210
1.0
She0.10 0.1 0.1
ata0.01
.D10
100
Frequency, MHz
1000
.01
1
10 100
Frequency, MHz
1,000
.01
1
10 100
Frequency, MHz
1,000
www 11



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X7R Dielectric
Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
Dissipation Factor
Insulation Resistance
Dielectric Strength
Resistance to
Flexure
Stresses
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Solderability
Resistance to
Solder Heat
Thermal
Shock
Load Life
Load
Humidity
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
X7R Specification Limits
-55ºC to +125ºC
Within specified tolerance
2.5% for 50V DC rating
3.0% for 25V DC rating
3.5% for 16V DC rating
5.0% for 10V DC rating
100,000Mor 1000M- µF,
whichever is less
No breakdown or visual defects
No defects
±12%
Meets Initial Values (As Above)
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 kHz ± 10%
Voltage: 1.0Vrms ± .2V
For Cap > 10 µF, 0.5Vrms @ 120Hz
Charge device with rated voltage for
60 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Deflection: 2mm
Test Time: 30 seconds
1mm/sec
Initial Value x 0.3
95% of each terminal should be covered
with fresh solder
No defects, <25% leaching of either end terminal
±7.5%
Meets Initial Values (As Above)
Meets Initial Values (As Above)
90 mm
Dip device in eutectic solder at 230 ± 5ºC
for 5.0 ± 0.5 seconds
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24 ± 2
hours before measuring electrical properties.
Meets Initial Values (As Above)
No visual defects
±7.5%
Step 1: -55ºC ± 2º
Step 2: Room Temp
30 ± 3 minutes
3 minutes
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
±12.5%
Initial Value x 2.0 (See Above)
Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
No visual defects
±12.5%
Initial Value x 2.0 (See Above)
Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
Step 3: +125ºC ± 2º 30 ± 3 minutes
Step 4: Room Temp 3 minutes
Repeat for 5 cycles and measure after
24 ± 2 hours at room temperature
Charge device with twice rated voltage in
test chamber set at 125ºC ± 2ºC
for 1000 hours (+48, -0)
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
Remove from chamber and stabilize at
room temperature and humidity for
24 ± 2 hours before measuring.
12



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X7R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Soldering
Packaging
(L) Length
(W) Width
(t) Terminal
MM
(in.)
MM
(in.)
MM
(in.)
WVDC
Cap
(pF)
Cap.
(µF)
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.10
0.12
0.15
0.18
0.22
0.27
0.33
0.47
0.56
0.68
0.82
1.0
1.2
1.5
1.8
2.2
3.3
4.7
10
22
47
100
WVDC
SIZE
0201
Reflow Only
All Paper
0.60 ± 0.03
(0.024 ± 0.001)
0.30 ± 0.03
(0.011 ± 0.001)
0.15 ± 0.05
(0.006 ± 0.002)
10 16
AA
AA
AA
AA
AA
AA
AA
AA
AA
AA
AA
AA
AA
10 16
0201
6.3
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
6.3
0402
Reflow Only
All Paper
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
10 16 25
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
C CC
CC
CC
CC
CC
CC
C
C
C
10 16 25
0402
50 6.3 10
C
C
C
C GG
C GG
C GG
C GG
C GG
C GG
C GG
C GG
C GG
C GG
C GG
C GG
C GG
C GG
C GG
C GG
C GG
C GG
C GG
GG
GG
GG
GG
GG
GG
GG
GG
GG
GG
GG
GG
GG
GG
GG
GG
GG
GG
GG
50 6.3 10
0603
Reflow/Wave
All Paper
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.014 ± 0.006)
16 25 50
100 200
10
G G G GG
G G G GG
G G G GG
G G G GG
G G G GG
G G G GG
G G G GG
G G G GG
G G G GG
G G G GG
G G GG
G G GG
G G GG
G G GG
G G GG
G G GG
G G GG
G G GG
G G GG
G G GG
G G GG
G G GG
G G GG
GGG
GGG
GGG
GGG
GGG
GGG
GG
G
G
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
N
N
N
N
N
16 25 50 100 200 10
0603
Letter
A
Max.
0.33
Thickness (0.013)
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
G
0.86
(0.034)
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
P
1.52
(0.060)
Contact Factory for Multiples
0805 1206
Reflow/Wave
Reflow/Wave
Paper/Embossed
Paper/Embossed
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
16 25 50 100 200 10 16 25 50 100 200
E EE EE
L
W
E EE EE
E EE EE
E EE EE
T
E EE EE
E EE EE
E EE EE
t
E EE EE J J J J JJ
E EE E J J J J J JJ
E EE E J J J J J JJ
E EE E J J J J J JJ
E EE E J J J J J JJ
E EE E J J J J J JJ
E EE E J J J J J JJ
E EE E J J J J J JJ
E EE J J J J J J JJ
E EE J J J J J J JJ
E EE J J J J J J JJ
E EE J J J J J J JJ
E EE J J J J J J JJ
J J J J J J J J J JM
J J J J J J J J J JM
J J J J M J J J J JM
J J J J M J J J J JM
J JJ J
J J J J JM
J JJM
J JJM
J JJM
J J J J JM
J J J J JM
J J J J JM
J JJ
J JJ
J JJ
J J J J JP
J J J J JP
J J J JM
J JJ
J JM
JJ
J J J JM
J JJJ
J JJJ
JM
JM
M
J JJJ
J JJJ
J J JM
M J J MM
M M MMM
MMQ
MMQ
MMQ
MMQ
P
P
P
Q
16 25 50 100 200 10 16 25 50 100 200
0805 1206
Q
1.78
(0.070)
X
2.29
(0.090)
EMBOSSED
Y
2.54
(0.100)
Z
2.79
(0.110)
BB
3.05
(0.120)
CC
3.175
(0.125)
13



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X7R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Soldering
Packaging
(L) Length
MM
(in.)
(W) Width
MM
(in.)
(t) Terminal
MM
(in.)
WVDC
Cap 100
(pF) 120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
Cap. 0.010
(µF) 0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.10
0.12
0.15
0.18
0.22
0.27
0.33
0.47
0.56
0.68
0.82
1.0
1.2
1.5
1.8
2.2
3.3
4.7
10
22
47
100
WVDC
SIZE
Letter
A
Max.
0.33
Thickness (0.013)
1210
Reflow/Wave
Paper/Embossed
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
10 16 25 50 100 16
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
J JJJ
M MMM
M MM
M MP
M MP
N NPX
NN
NN
NP
X
QZ
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
P
P
Z
Z
Z
Z
Z
Z
Z
10
C
0.56
(0.022)
16 25
1210
50
E
0.71
(0.028)
PAPER
G
0.86
(0.034)
100
J
0.94
(0.037)
16
K
1.02
(0.040)
1812 1825
Reflow Only
Reflow Only
All Embossed
All Embossed
4.50 ± 0.30
(0.177 ± 0.012)
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
6.40 ± 0.40
(0.252 ± 0.016)
0.61 ± 0.36
(0.024 ± 0.014)
0.61 ± 0.36
(0.024 ± 0.014)
25 50 100 50 100
2220
Reflow Only
All Embossed
5.7 ± 0.40
(0.224 ± 0.016)
5.0 ± 0.40
(0.197 ± 0.016)
0.64 ± 0.39
(0.025 ± 0.015)
50 100 200
2225
Reflow Only
All Embossed
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
0.64 ± 0.39
(0.025 ± 0.015)
50 100
L
t
W
T
KK
KK
KK
MM
MM
MM
X XXM M
X XXM M
X XXM M
KK
KK
KK
MM
MM
MM
X XXM M
X XXM M
X XXM M
KK
KK
KK
MM
MM
MM
X XXM M
X XXM M
X XXM M
KK
KK
KK
MM
MM
MM
X XXM M
X XXM M
X XXM M
KK
KK
KK
MM
MM
MM
X XXM M
X XXM M
X XXM M
KK
MM
X XXM M
KK
MM
X XXM M
K M MM X X
MM
K M MM X X
KP
MM
XX
M Q MM X X
MM
MM
MM
MX
MX
MX
MQ
MQ
MQ
XX
X
X
MM
MM
MM
M M X MP
M MP
M
ZM
25
1812
M
1.27
(0.050)
50
N
1.40
(0.055)
100
P
1.52
(0.060)
50 100
1825
50 100
2220
200
Q
1.78
(0.070)
X
2.29
(0.090)
EMBOSSED
Y
2.54
(0.100)
Z
2.79
(0.110)
50 100
2225
BB
3.05
(0.120)
CC
3.175
(0.125)
Contact Factory for Multiples
14



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